{"service":"handoutai-research-labs","surface":"gold-list","page":1,"limit":20,"pages":11,"total":205,"facets":{"areas":[{"value":"中国・四国","label":"中国・四国","count":13},{"value":"中部","label":"中部","count":30},{"value":"九州","label":"九州","count":23},{"value":"北海道","label":"北海道","count":6},{"value":"東北","label":"東北","count":34},{"value":"関東","label":"関東","count":58},{"value":"関西","label":"関西","count":41}],"entityTypes":[{"value":"research-lab","label":"研究室"}],"paperDb":[{"value":"listed","label":"論文DB掲載","count":10,"paper_count":30,"latest_paper_year":2026}],"conferences":[{"value":"3dic","label":"3DIC","name":"IEEE 3D Systems Integration Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"a-sscc","label":"A-SSCC","name":"IEEE Asian Solid-State Circuits Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"aicas","label":"AICAS","name":"IEEE International Conference on Artificial Intelligence Circuits and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ald-ale","label":"ALD/ALE","name":"AVS International Conference on Atomic Layer Deposition and Atomic Layer Etching Workshop","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"apec","label":"APEC","name":"IEEE Applied Power Electronics Conference and Exposition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"asicon","label":"ASICON","name":"IEEE International Conference on ASIC","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"asmc","label":"ASMC","name":"SEMI Advanced Semiconductor Manufacturing Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"asp-dac","label":"ASP-DAC","name":"Asia and South Pacific Design Automation Conference","tier":"S","count":3,"presentation_count":3,"latest_presentation_year":2026},{"value":"asian-test-symposium","label":"ATS","name":"IEEE Asian Test Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"avs","label":"AVS","name":"AVS 72nd International Symposium & Exhibition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"bcicts","label":"BCICTS","name":"IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cicc","label":"CICC","name":"IEEE Custom Integrated Circuits Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cleo","label":"CLEO","name":"Conference on Lasers and Electro-Optics","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"codes-isss","label":"CODES+ISSS","name":"International Conference on Hardware/Software Codesign and System Synthesis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cstic","label":"CSTIC","name":"Conference of Science & Technology for Integrated Circuits","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"compound-semiconductor-week","label":"CSW","name":"Compound Semiconductor Week","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"dac","label":"DAC","name":"Design Automation Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"date","label":"DATE","name":"Design, Automation and Test in Europe Conference","tier":"S","count":2,"presentation_count":2,"latest_presentation_year":2026},{"value":"dpc","label":"DPC","name":"IMAPS Device Packaging Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"drc","label":"DRC","name":"Device Research Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"display-week","label":"Display Week","name":"Display Week / SID International Symposium, Seminar and Exhibition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ecce","label":"ECCE","name":"IEEE Energy Conversion Congress and Exposition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ectc","label":"ECTC","name":"IEEE Electronic Components and Technology Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"edtm","label":"EDTM","name":"IEEE Electron Devices Technology and Manufacturing Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eipbn","label":"EIPBN","name":"International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"electronic-materials-conference","label":"EMC","name":"Electronic Materials Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"empc","label":"EMPC","name":"European Microelectronics & Packaging Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"epeps","label":"EPEPS","name":"IEEE Conference on Electrical Performance of Electronic Packaging and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eptc","label":"EPTC","name":"IEEE Electronics Packaging Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"esref","label":"ESREF","name":"European Symposium on Reliability of Electron Devices, Failure Physics and Analysis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"esserc","label":"ESSERC","name":"IEEE European Solid-State Electronics Research Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"estc","label":"ESTC","name":"IEEE Electronics System-Integration Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ets","label":"ETS","name":"IEEE European Test Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"european-microwave-integrated-circuits-conference","label":"EuMIC","name":"European Microwave Integrated Circuits Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eurosime","label":"EuroSimE","name":"International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"fmcad","label":"FMCAD","name":"Formal Methods in Computer-Aided Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"fpga","label":"FPGA","name":"ACM/SIGDA International Symposium on Field-Programmable Gate Arrays","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"gaseous-electronics-conference","label":"GEC","name":"Gaseous Electronics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"hot-chips","label":"Hot Chips","name":"Hot Chips: A Symposium on High Performance Chips","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iccad","label":"ICCAD","name":"IEEE/ACM International Conference on Computer-Aided Design","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-international-conference-on-computer-design","label":"ICCD","name":"IEEE International Conference on Computer Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icep-hbs","label":"ICEP-HBS","name":"International Conference on Electronics Packaging joined with Hybrid Bonding Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-conference-on-ic-design-and-technology","label":"ICICDT","name":"International Conference on IC Design and Technology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-conference-on-magnetism","label":"ICM","name":"International Conference on Magnetism","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icmbe","label":"ICMBE","name":"International Conference on Molecular Beam Epitaxy","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icmctf","label":"ICMCTF","name":"International Conference on Metallurgical Coatings and Thin Films","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icmts","label":"ICMTS","name":"IEEE International Conference on Microelectronic Test Structures","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icns","label":"ICNS","name":"International Conference on Nitride Semiconductors","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icps","label":"ICPS","name":"International Conference on the Physics of Semiconductors","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icscrm","label":"ICSCRM","name":"International Conference on Silicon Carbide and Related Materials","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icsict","label":"ICSICT","name":"IEEE International Conference on Solid-State and Integrated Circuit Technology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iedm","label":"IEDM","name":"IEEE International Electron Devices Meeting","tier":"SS","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-biocas","label":"IEEE BioCAS","name":"IEEE Biomedical Circuits and Systems Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-hardware-oriented-security-and-trust-symposium","label":"IEEE HOST","name":"IEEE International Symposium on Hardware Oriented Security and Trust","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-international-conference-on-electronics-circuits-and-systems","label":"IEEE ICECS","name":"IEEE International Conference on Electronics, Circuits and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mems","label":"IEEE MEMS","name":"IEEE International Conference on Micro Electro Mechanical Systems","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-mtt-s-international-microwave-symposium","label":"IEEE MTT-S IMS","name":"IEEE MTT-S International Microwave Symposium","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-nano","label":"IEEE-NANO","name":"IEEE International Conference on Nanotechnology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iemt","label":"IEMT","name":"IEEE International Electronics Manufacturing Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iitc","label":"IITC","name":"IEEE International Interconnect Technology Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-liquid-crystal-conference","label":"ILCC","name":"International Liquid Crystal Conference (ILCC)","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"imaps-symposium","label":"IMAPS Symposium","name":"International Symposium on Microelectronics","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"impact-iaac","label":"IMPACT-IAAC","name":"International Microsystems, Packaging, Assembly and Circuits Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"imw","label":"IMW","name":"IEEE International Memory Workshop","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"intermag","label":"INTERMAG","name":"IEEE International Magnetics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ipfa","label":"IPFA","name":"IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iprm","label":"IPRM","name":"International Conference on Indium Phosphide and Related Materials","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"irmmw-thz","label":"IRMMW-THz","name":"International Conference on Infrared, Millimeter, and Terahertz Waves","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"irps","label":"IRPS","name":"IEEE International Reliability Physics Symposium","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"acm-ieee-international-symposium-on-computer-architecture","label":"ISCA","name":"ACM/IEEE International Symposium on Computer Architecture","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iscas","label":"ISCAS","name":"IEEE International Symposium on Circuits and Systems","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isec","label":"ISEC","name":"International Superconductive Electronics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"islped","label":"ISLPED","name":"IEEE/ACM International Symposium on Low Power Electronics and Design","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isocc","label":"ISOCC","name":"International SoC Design Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ispd","label":"ISPD","name":"International Symposium on Physical Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ispsd","label":"ISPSD","name":"International Symposium on Power Semiconductor Devices and ICs","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isqed","label":"ISQED","name":"International Symposium on Quality Electronic Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isscc","label":"ISSCC","name":"IEEE International Solid-State Circuits Conference","tier":"SS","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"istfa","label":"ISTFA","name":"International Symposium for Testing and Failure Analysis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"itc","label":"ITC","name":"International Test Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"itherm","label":"ITherm","name":"IEEE ITherm Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ius","label":"IUS","name":"IEEE International Ultrasonics Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iwls","label":"IWLS","name":"International Workshop on Logic & Synthesis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iwn","label":"IWN","name":"International Workshop on Nitride Semiconductors","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"lt30","label":"LT30","name":"International Conference on Low Temperature Physics","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-acm-international-symposium-on-microarchitecture","label":"MICRO","name":"IEEE/ACM International Symposium on Microarchitecture","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mmm","label":"MMM","name":"Annual Conference on Magnetism and Magnetic Materials","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mnc","label":"MNC","name":"International Microprocesses and Nanotechnology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mne","label":"MNE","name":"International Conference on Micro and Nano Engineering","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"nsrec","label":"NSREC","name":"IEEE Nuclear and Space Radiation Effects Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"oecc","label":"OECC","name":"OECC / OptoElectronics and Communications Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ofc","label":"OFC","name":"Optical Fiber Communications Conference and Exhibition","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"pmj","label":"PMJ","name":"Photomask Japan","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"radecs","label":"RADECS","name":"RADiation and its Effects on Components and Systems Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"rfic","label":"RFIC","name":"IEEE Radio Frequency Integrated Circuits Symposium","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"semi-therm","label":"SEMI-THERM","name":"SEMI-THERM Semiconductor Thermal Measurement, Modeling and Management Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"sisc","label":"SISC","name":"IEEE Semiconductor Interface Specialists Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"sispad","label":"SISPAD","name":"International Conference on Simulation of Semiconductor Processes and Devices","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-international-system-on-chip-conference","label":"SOCC","name":"IEEE International System-on-Chip Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"socc","label":"SOCC","name":"IEEE International System-on-Chip Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-alp","label":"SPIE ALP","name":"SPIE Advanced Lithography + Patterning","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-dtco-computational","label":"SPIE DTCO","name":"SPIE DTCO and Computational Patterning","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-advanced-etch","label":"SPIE Etch","name":"SPIE Advanced Etch Technology and Process Integration for Nanopatterning","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-patterning-materials","label":"SPIE Materials","name":"SPIE Advances in Patterning Materials and Processes","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-metrology-inspection","label":"SPIE Metrology","name":"SPIE Metrology, Inspection, and Process Control","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-optical-euv","label":"SPIE Optical/EUV","name":"SPIE Optical and EUV Nanolithography","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-photomask-euv","label":"SPIE Photomask/EUV","name":"SPIE Photomask Technology + Extreme Ultraviolet Lithography","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-photonics-europe","label":"SPIE Photonics Europe","name":"SPIE Photonics Europe","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-photonics-west","label":"SPIE Photonics West","name":"SPIE Photonics West","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ssdm","label":"SSDM","name":"International Conference on Solid State Devices and Materials","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"therminic","label":"THERMINIC","name":"International Workshop on Thermal Investigations of ICs and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"transducers","label":"Transducers","name":"International Conference on Solid-State Sensors, Actuators and Microsystems","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vlsi","label":"VLSI","name":"Symposium on VLSI Technology and Circuits","tier":"SS","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vlsi-tsa","label":"VLSI TSA","name":"International VLSI Symposium on Technology, Systems and Applications","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vts","label":"VTS","name":"IEEE VLSI Test Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iwlpc","label":"WLPS / IWLPC","name":"Wafer-Level Packaging Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null}],"presentationYears":[{"value":"2026","label":"2026","count":3,"presentation_count":5}]},"evidenceContracts":{"paperDb":"exact-author-affiliation-current-membership-v1","majorConferencePresentation":"source-explicit-presenter-current-membership-v1"},"records":[{"publicLabId":"rlab-6e597565d7c53c3d7f5a741b","labName":"Adaptive Systems Laboratory","institutionName":"会津大学","entityType":"research-lab","area":"東北","prefecture":"福島県","officialUrl":"https://adaptive.u-aizu.ac.jp/","evidenceSummary":"大学公式ページで、電子設計自動化に関する研究内容を確認しました。","researchKeywords":["電子設計自動化"],"principalInvestigators":["Yuichi Okuyama"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-000e4d062b4dce0c8358e6cd","labName":"Advanced Devices(Suda Lab)","institutionName":"名古屋大学","entityType":"research-lab","area":"中部","prefecture":"愛知県","officialUrl":"https://sudalab.skr.jp/","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、固体電子・ナノエレクトロニクス、化合物半導体材料、光・電子デバイス、リソグラフィ・半導体計測に関する研究内容を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","半導体デバイス・プロセス","固体電子・ナノエレクトロニクス","化合物半導体材料","光・電子デバイス","リソグラフィ・半導体計測","半導体量子デバイス","半導体結晶成長・エピタキシ"],"principalInvestigators":["Jun Suda","Masahiro Horita"],"paperDbListed":true,"paperCount":1,"latestPaperYear":2026,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-5ea2705a80894ae88ff48b97","labName":"Advanced Signal Processing (Hashimoto Lab)","institutionName":"京都大学","entityType":"research-lab","area":"関西","prefecture":"京都府","officialUrl":"https://www.s-ee.t.kyoto-u.ac.jp/en/information/laboratory/asp","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、固体電子・ナノエレクトロニクス、半導体メモリに関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","固体電子・ナノエレクトロニクス","半導体メモリ"],"principalInvestigators":["Masanori Hashimoto"],"paperDbListed":true,"paperCount":2,"latestPaperYear":2026,"matchedPresentationCount":2,"explicitPresenterPresentationCount":2,"latestPresentationYear":2026,"conferenceActivity":[{"conference":"ASP-DAC","conferenceName":"Asia and South Pacific Design Automation Conference","tier":"S","year":2026,"presentationCount":1},{"conference":"DATE","conferenceName":"Design, Automation and Test in Europe Conference","tier":"S","year":2026,"presentationCount":1}],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-53785013dfe8d28a376f4636","labName":"Awano Laboratory","institutionName":"名古屋大学","entityType":"research-lab","area":"中部","prefecture":"愛知県","officialUrl":"https://www.arc.nuee.nagoya-u.ac.jp/","evidenceSummary":"大学公式ページで、半導体デバイス・プロセス、集積回路、電子設計自動化に関する研究内容を確認しました。","researchKeywords":["半導体デバイス・プロセス","集積回路","電子設計自動化"],"principalInvestigators":["Hiromitsu Awano"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-5f2b412ec9bd9c0bf3f73493","labName":"Cao Lab","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://cao-lab.org/","evidenceSummary":"大学公式ページで、電子設計自動化に関する研究内容を確認しました。","researchKeywords":["電子設計自動化"],"principalInvestigators":["Yang Cao","Pengpeng Qiao"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-e8ad696ed2b4a773d10f6d0e","labName":"Iizuka Lab","institutionName":"東京大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://www.mos.t.u-tokyo.ac.jp/iizuka/en","evidenceSummary":"大学公式ページで、半導体デバイス・プロセス、集積回路に関する研究内容を確認しました。","researchKeywords":["半導体デバイス・プロセス","集積回路"],"principalInvestigators":["Tetsuya Iizuka"],"paperDbListed":true,"paperCount":3,"latestPaperYear":2026,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-78825c8836f0e385f371b1e9","labName":"Islam Laboratory","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://www.cas.ict.eng.isct.ac.jp/","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、集積回路に関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","集積回路"],"principalInvestigators":[],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-7322b20e421c074c6299c2de","labName":"Kadomoto Lab","institutionName":"東京大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://kadomoto-lab.org/","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、集積回路に関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","集積回路"],"principalInvestigators":["Junichiro Kadomoto"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-6f3e6a5f4769a1b0181ecd30","labName":"Katayama Laboratory","institutionName":"大阪大学","entityType":"research-lab","area":"関西","prefecture":"大阪府","officialUrl":"http://www.qoe.eei.eng.osaka-u.ac.jp/","evidenceSummary":"大学公式ページで、半導体、化合物半導体材料、半導体フォトニックデバイスに関する研究内容を確認しました。","researchKeywords":["半導体","化合物半導体材料","半導体フォトニックデバイス"],"principalInvestigators":["Ryuji Katayama"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-479421e02ed1b3e1f2b6b17d","labName":"MEMS Lab, IIS, UTokyo","institutionName":"東京大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"http://toshi.iis.u-tokyo.ac.jp/toshilab","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、固体電子・ナノエレクトロニクス、マイクロ・ナノデバイス、半導体MEMSに関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","固体電子・ナノエレクトロニクス","マイクロ・ナノデバイス","半導体MEMS"],"principalInvestigators":[],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-c8ebba03099f656dcc758013","labName":"Masa Kobayashi Lab","institutionName":"東京大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://nano-lsi.iis.u-tokyo.ac.jp/en/home","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、半導体デバイス、固体電子・ナノエレクトロニクスに関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","半導体デバイス","固体電子・ナノエレクトロニクス"],"principalInvestigators":["Masaharu Kobayashi"],"paperDbListed":true,"paperCount":2,"latestPaperYear":2026,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-85bcfbc3a43b5170614f0773","labName":"Morishita Lab Tohoku University","institutionName":"東北大学","entityType":"research-lab","area":"東北","prefecture":"宮城県","officialUrl":"https://www.csrn.tohoku.ac.jp/morishita_lab","evidenceSummary":"大学公式ページで、半導体、化合物半導体材料、半導体スピントロニクスに関する研究内容を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","化合物半導体材料","半導体スピントロニクス"],"principalInvestigators":["森下 弘樹","森下弘樹"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-2d7b5e06e928e535c45f5c36","labName":"Nagata & Miki Laboratory","institutionName":"神戸大学","entityType":"research-lab","area":"関西","prefecture":"兵庫県","officialUrl":"https://www.edu.kobe-u.ac.jp/stin-seaqy/en","evidenceSummary":"大学公式ページで、電子設計自動化に関する研究内容を確認しました。","researchKeywords":["電子設計自動化"],"principalInvestigators":["Makoto Nagata","Rikuu Hasegawa","Satoshi Kubota","Takuya Wadatsumi"],"paperDbListed":true,"paperCount":4,"latestPaperYear":2026,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-d1bb0beac7fee1441e83c594","labName":"Nishiyama Lab","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://www.opto.ee.eng.isct.ac.jp/","evidenceSummary":"大学公式ページで、半導体、集積回路、リソグラフィ・半導体計測、半導体フォトニックデバイス、半導体結晶成長・エピタキシに関する研究内容を確認しました。","researchKeywords":["半導体","集積回路","リソグラフィ・半導体計測","半導体フォトニックデバイス","半導体結晶成長・エピタキシ"],"principalInvestigators":[],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-ee19c3c0bb2994e027e2e8da","labName":"PEMSIC : Power-Electronic and Mixed-Signal-Integrated Circuits Lab., Nagasaki University, JAPAN","institutionName":"長崎大学","entityType":"research-lab","area":"九州","prefecture":"長崎県","officialUrl":"https://pemsic.eee.nagasaki-u.ac.jp/","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、光・電子デバイス、集積回路、マイクロ・ナノデバイスに関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","光・電子デバイス","集積回路","マイクロ・ナノデバイス"],"principalInvestigators":[],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-6865535e800e6d012112c0aa","labName":"Pham Nam Hai Research Group","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://magn.ee.eng.isct.ac.jp/","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、半導体スピントロニクスに関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","半導体スピントロニクス"],"principalInvestigators":["Pham Nam Hai"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-473bcfdb4e48ed38a1b7c131","labName":"Process Design Engineering Laboratory","institutionName":"九州大学","entityType":"research-lab","area":"九州","prefecture":"福岡県","officialUrl":"https://eng.kyushu-u.ac.jp/en/research-education/labs/lab-process-design-engineering-laboratory/","evidenceSummary":"九州大学工学部公式ページで、Process Design Engineering Laboratory、寒川義裕教授、III族窒化物半導体とエピタキシ工程の研究、学部・大学院の配属単位を確認。","researchKeywords":[],"principalInvestigators":["Yoshihiro Kangawa","寒川 義裕"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-21"},{"publicLabId":"rlab-d74f203e3af9e7ff34d08e35","labName":"Processing Architecture and Systems","institutionName":"京都大学","entityType":"research-lab","area":"関西","prefecture":"京都府","officialUrl":"https://www.s-ee.t.kyoto-u.ac.jp/en/information/laboratory/passg","evidenceSummary":"大学公式ページで、半導体、半導体デバイス・プロセス、固体電子・ナノエレクトロニクス、半導体メモリに関する研究内容を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","固体電子・ナノエレクトロニクス","半導体メモリ"],"principalInvestigators":["Haoyuan Li","Hiroto Tagata","Takashi Sato"],"paperDbListed":true,"paperCount":2,"latestPaperYear":2026,"matchedPresentationCount":2,"explicitPresenterPresentationCount":2,"latestPresentationYear":2026,"conferenceActivity":[{"conference":"ASP-DAC","conferenceName":"Asia and South Pacific Design Automation Conference","tier":"S","year":2026,"presentationCount":1},{"conference":"DATE","conferenceName":"Design, Automation and Test in Europe Conference","tier":"S","year":2026,"presentationCount":1}],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-e625b1a41eebdd71b1eb6552","labName":"Quantum Optoelectronics(Chichibu Lab)","institutionName":"東北大学","entityType":"research-lab","area":"東北","prefecture":"宮城県","officialUrl":"https://db.tagen.tohoku.ac.jp/php/forweb/outline.php?lang=en&no=1003","evidenceSummary":"大学公式ページで、半導体、固体電子・ナノエレクトロニクス、半導体結晶成長・エピタキシに関する研究内容を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","固体電子・ナノエレクトロニクス","半導体結晶成長・エピタキシ"],"principalInvestigators":["Shigefusa Chichibu"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"},{"publicLabId":"rlab-6c06c751f0a8212b724a8482","labName":"Reconfigurable System Laboratory","institutionName":"岡山大学","entityType":"research-lab","area":"中国・四国","prefecture":"岡山県","officialUrl":"https://www.rs.cs.okayama-u.ac.jp/","evidenceSummary":"大学公式ページで、半導体デバイス・プロセス、集積回路に関する研究内容を確認しました。","researchKeywords":["半導体デバイス・プロセス","集積回路"],"principalInvestigators":["渡邊 実","渡邊実"],"paperDbListed":false,"paperCount":0,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-07-20"}]}