半導体製造ラボ

公式求人詳細

Advanced Packaging Materials Supply Chain Engineer

インテルの公式求人。勤務地は東京都、採用区分は中途、職種カテゴリはサプライチェーンです。

分類・ページ生成
2026/07/27
求人DB生成
2026/07/25

応募判断に必要な情報を先に確認

必須・歓迎・働き方

公式求人票の明記内容のみ

必須 応募条件

  • To be considered for this position, you must meet the following minimum qualifications: • Bachelor's or Master's degree in Materials Science, Chemistry, Chemical Engineering, or a related f…

歓迎 あると活かせる経験

  • to have ability to have deep engineering discussions in both languages.
  • The following qualifications are not required but will be considered a plus in identifying top candidates: • Strong analytical skills and the ability to work effectively in ambiguous situat…

働き方 勤務条件

勤務地
東京都
リモート
在宅・出社併用
勤務帯
記載なし
出張
記載なし
オンコール
記載なし
転居
記載なし
想定役割
記載なし
転勤
記載なし

公式募集要項で最新条件を確認

求人市場で見るこのポジション

企業・同職種・必須スキルの比較

求人市場分析を見る

企業 × 関連工程

同社の公開求人全体

純増減 +5件

当DBの直近90日観測で、インテルは新規 5件・終了 0件。現在公開 5件です。

同職種の掲載給与

サプライチェーン / 物流

中央値 700万円

掲載年収レンジの中点を比較。給与確認済み 33件/同職種 100件です。

類似求人の必須スキル

サプライチェーン / 物流

  • 業務英語 33件 33%

新規・終了は当DBでの観測差分であり、市場成長や採用需要の増減を単独では示しません。 直近30日は収集対象拡張の影響を含みます。

企業公式情報から整理

募集要項

企業の公式採用ページまたは公式に委任された採用システムの公開情報を、項目別に整理しています。 確認できない条件は推測せず、公式募集要項への案内を表示します。

3/8 公式情報で確認できた項目

仕事内容

公式情報あり

Job Description

The Role and Impact As a Supply Chain Engineer at Intel, you will be responsible for developing and executing supply chain strategies, as well as ensuring supplier process and product readiness to meet Intel's expectations for cost, quality, availability, technology, and environmental leadership. By benchmarking emerging industry technologies, conducting root cause analyses, and recommending actionable solutions, your contributions will be pivotal to Intel's ability to deliver cutting-edge products and maintain leadership in the semiconductor industry. This role ensures Intel's supply chain aligns with future technology roadmaps, closes gaps between manufacturing capabilities and market demands, and champions quality, reliability, and performance excellence across the supply chain. This role requires a strong foundation in the core competencies of semiconductor package assembly materials supply chain engineering. Key Responsibilities Key responsibilities include, but are not limited to: • Collaborating with Technology Development (TD) and Package Design teams to support technology sourcing initiatives • Collaborating with Factory Module team to troubleshoot materials-related issues to support High Volume Manufacturing (HVM) • Analyzing supply chain risks across materials and processes, developing alternate sourcing strategies for single-sourced commodities and mitigating supply chain risks • Managing supplier change controls to ensure continuity and compliance • Analyzing supplier cost structures to identify optimization and Value Engineering opportunities • Understanding supplier manufacturing processes to support readiness and scalability • Leading quality excursion management efforts, driving failure mode and effects analysis (FMEA) with suppliers to minimize variability and align specifications with operational requirements • Applying Statistical Process Control (SPC) expertise to supplier operations • Evaluating and improving supplier quality systems through supplier audits and gap closure and continuous improvement activities • Assessing ramp readiness risks for both Intel and suppliers, and implementing mitigation strategies • Driving supplier performance improvements by establishing control standards, determining KPIs, and conducting regular evaluations against performance targets • Gathering and analyzing industry and market intelligence to inform sourcing decisions • Participating in supplier selection and supplier onboarding processes • Managing intellectual property (IP) and fostering collaborative relationships with suppliers • Driving problem-solving initiatives to resolve supply chain issuesQualifications:Minimum Qualifications To be considered for this position, you must meet the following minimum qualifications: • Bachelor's or Master's degree in Materials Science, Chemistry, Chemical Engineering, or a related field • 6 or more years of experience in semiconductor assembly material (or related) industry with a Bachelor's degree, 4 or more years with a Master's degree • Has proficiency in English and Japanese, is capable of business-level discussions in both languages. Preferred to have ability to have deep engineering discussions in both languages. Preferred Qualifications The following qualifications are not required but will be considered a plus in identifying top candidates: • Strong analytical skills and the ability to work effectively in ambiguous situations • Familiarity with semiconductor assembly and packaging processes and materials, including wafer-level packaging • Expertise in supplier manufacturing operations, quality assurance processes, and risk mitigation strategies • Proven ability to drive cross-functional collaboration and lead strategic initiatives within supply chain frameworks • Strong problem-solving skills with an emphasis on continuous improvement and operational excellence • Knowledge and application of Statistical Process Control (SPC) and/or Design of Experiments (DOE) • Proficiency in data analysis, root cause analysis, and business intelligence tools for decision-making Job Type:Experienced HireShift:Shift 1 (Japan)Primary Location: Japan, TokyoAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/AWork Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examinati…

対象となる方

公式ページで確認

当サイトが取得した公式公開情報では確認できません。応募前に最新の公式募集要項をご確認ください。

勤務時間

公式ページで確認

当サイトが取得した公式公開情報では確認できません。応募前に最新の公式募集要項をご確認ください。

給与

公式ページで確認

当サイトが取得した公式公開情報では確認できません。応募前に最新の公式募集要項をご確認ください。

待遇・福利厚生

公式ページで確認

当サイトが取得した公式公開情報では確認できません。応募前に最新の公式募集要項をご確認ください。

休日・休暇

公式ページで確認

当サイトが取得した公式公開情報では確認できません。応募前に最新の公式募集要項をご確認ください。

求人情報

求人名
Advanced Packaging Materials Supply Chain Engineer
会社名
インテル
半導体直接関連度
B:半導体事業支援職
職種カテゴリ
サプライチェーン
勤務地
東京都
都道府県
東京都
地域区分
関東
公式記載の勤務地
東京都
勤務地確認
通常
採用区分
中途
雇用形態
正社員
給与
公式募集要項で確認
求人取得日
2026/07/21
最終監査日
2026/07/21
掲載状態
募集中
公式募集要項
掲載元を開く
公式応募ページ
応募ページを開く

5軸分類

企業カテゴリ
半導体デバイス
職種ファミリー
サプライチェーン
具体職種
サプライチェーン / 物流
対象製品
半導体パッケージ
関連工程・技術
工程未分類
半導体直接関連度
B:半導体事業支援職
関連職種
サプライチェーン / サプライチェーン / 物流
関連工程
工程未分類
関連技術
未分類
勤務地エリア
関東

一部分類項目は未確認です。公式募集要項と確認根拠を併せて確認してください。

半導体直接関連度の判定根拠

B:半導体事業支援職 — 半導体事業・工場・顧客を、営業・調達・施設・IT・法務などから支える仕事

判定の確度:B(半導体事業を支援する業務)

Advanced Packaging Materials Supply Chain Engineer。

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