Req. ID: JR90854 Front End Central Product Integration Senior / Staff / Principal / Engineer, Test & Product Yield Integration Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Central Product Integration Engineer at Micron Technology, you will provide technical leadership across the global Micron network to drive yield, product quality, and New Product Introduction (NPI) through deep technical expertise, business process development, and project execution. This role operates at the intersection of Test, Product, Yield, Front‑End Manufacturing, and Packaging / BEOL integration, requiring strong across function collaboration and the ability to translate complex technical challenges into scalable solutions. You will work closely with teams across Japan, Taiwan, Singapore, and the United States to ensure products meet performance, quality, and reliability requirements within aggressive schedules. Key Responsibilities * Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. * Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. * Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. * Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs. * Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification. * Lead across functions and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. * Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. * Maintain strong working relationships with partners in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams. * Communicate project status, risks, and proposals effectively through clear written reports and technical presentations. * Proactively identify obstacles, escalate when needed, and partner with management to drive successful outcomes. * Travel to Micron fab and development sites as needed to support project execution and alignment. Minimum Qualifications * Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field. * 2+ years of experience in one or more of the following: * Product Integration * Test Engineering * Yield Engineering * Design Engineering * BEOL semiconductor processing or process integration * Strong knowledge of Semiconductor Device Physics and DRAM product operations. * Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield. * Strong data analysis, debugging, troubleshooting, and problem‑solving skills with attention to detail. * Effective verbal and written communication skills with the ability to present to both small and large technical audiences. * Demonstrated ability to collaborate across functions and cultures, building strong customer and co‑worker relationships. * Ability to work independently with minimal supervision, manage multiple priorities, and stay organized. * Intermediate to advanced PC skills, including Microsoft Office. * Willingness to travel approximately 20–50% to support global project needs. * Flexibility to adapt to changing priorities and take on additional responsibilities as needed. Preferred Qualifications * Experience in DRAM High Bandwidth Memory (HBM) products. * Exposure to DRAM HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout‑related topics. * Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations. * Proven ability to drive alignment and execution in central or network‑level roles. * Strong curiosity about innovation, continuous improvement, and scalable solution development. Job Profile(s): FAB Engineer 4 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace…