半導体製造ラボ

conference research / Tier b

ECSJ Meeting学会研究

Electrochemistry and materials-device research covering electronic materials, nano-functional devices, wet process and interconnect surface stability, CMP before hybrid bonding, Ru/graphene caps, porous silicon, GaAs and oxide formation, plating and electroless deposition, battery/electrode materials, sensors, and micro-nano fabrication. Relevant to semiconductor materials, FEOL/BEOL wet process, advanced packaging, device materials, and process characterization.

電気化学会大会 / Electrochemical Society of Japan Meetingは、ロジック / デバイス / プロセス統合の観点から ECSJ Meeting, electronic materials and nano-functional devices, micro-nano structure materials, device formation nano process, hybrid bonding CMP, porous silicon, GaAs, TSV-like plating, first-listed affiliation sample, official company exhibition rows, PR poster rows, banner advertiser rows, and ECSJ convention archive を確認するための学会です。公式ページ、募集要項、program、proceedings を分けて確認し、研究室DBや求人DBの分類軸へ接続します。

snapshot

基本データ

Tier B

3大国際会議以外の主要学会として、分野別に確認する。

分野 ロジック / デバイス / プロセス統合

研究室DBと技術レーダーのfield接続に使う。

ジャンル FEOL / デバイス / BEOL / 配線・製造 / WBG / パワー / 信頼性 / メモリ

FEOL、BEOL、3DI、回路、WBG、フォトニクス、信頼性へ接続する。

主催 The Electrochemical Society of Japan
開催サイクル 2026-03-17 to 2026-03-19 / Tokyo University of Science Noda Campus, Noda, Chiba, Japan

2026 cycle finished / official ECSJ Confit summary, executive committee, S14 micro-nano device formation sessions, S19 electronic materials and nano-functional devices sessions, company project listing, and official convention archive checked

投稿形式 Official ECSJ 93rd Meeting sources identify member-only presentation registration, abstract manuscript submission, public Confit session pages, and a completed March 2026 in-person cycle. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals.

topics

研究テーマと企業調査へ変換する

coverage

Electrochemistry and materials-device research covering electronic materials, nano-functional devices, wet process and interconnect surface stability, CMP before hybrid bonding, Ru/graphene caps, porous silicon, GaAs and oxide formation, plating and electroless deposition, battery/electrode materials, sensors, and micro-nano fabrication. Relevant to semiconductor materials, FEOL/BEOL wet process, advanced packaging, device materials, and process characterization.

監視テーマ

ECSJ Meeting, electronic materials and nano-functional devices, micro-nano structure materials, device formation nano process, hybrid bonding CMP, porous silicon, GaAs, TSV-like plating, first-listed affiliation sample, official company exhibition rows, PR poster rows, banner advertiser rows, and ECSJ convention archive

CFPから抽出する論点

Official ECSJ/Confit sources identify the March 17-19, 2026 Tokyo University of Science Noda cycle, presentation registration deadline, abstract manuscript period, executive committee list, public session pages for micro-nano device formation and electronic materials/nano-functional devices, company exhibition/PR/banner listing rows, and official convention archive evidence.

年次比較で残す比較軸

Official ECSJ convention archive lists the 93rd Meeting in 2026 and traces the numbered meeting series to the first meeting in 1933. The DAC-style graph stores firstHeldYear=1933 and current-cycle evidence in PostgreSQL researchVisualSignals.

deadlines

投稿・採択イベント

要旨締切 2026-01-07

2026 cycle finished / official ECSJ Confit summary, executive committee, S14 micro-nano device formation sessions, S19 electronic materials and nano-functional devices sessions, company project listing, and official convention archive checked

最終原稿締切 2026-02-17

2026 cycle finished / official ECSJ Confit summary, executive committee, S14 micro-nano device formation sessions, S19 electronic materials and nano-functional devices sessions, company project listing, and official convention archive checked

related pages

関連ページ

研究室DBの学会発表実績タグは、公式業績・program・researchmap/KAKEN成果などで実際の発表が確認できた場合だけ表示します。候補・近接テーマだけでは接続しません。

sources

公式確認リンク