conference research / Tier b

JIMM Spring Meeting学会研究

Metals and materials research covering electric, electronic and optical materials, thermoelectric materials, computational materials science, alloy processing, diffusion, microstructure, joining, characterization, corrosion, and reliability. Relevant to semiconductor materials, advanced packaging, interconnect metallurgy, diffusion barriers, thermal and electromigration reliability, and process integration.

日本金属学会春期講演大会 / The Japan Institute of Metals and Materials Spring Meetingは、ロジック / デバイス / プロセス統合の観点から JIMM Spring Meeting, metals and materials science, electric/electronic/optical materials, thermoelectric materials, computational science, first-listed affiliation sample, Nippon Steel, Toshiba, official exhibitor rows, analytical instrument vendors, and official Confit program pages を確認するための学会です。公式ページ、募集要項、program、proceedings を分けて確認し、研究室DBや求人DBの分類軸へ接続します。