半導体製造ラボ

conference research / Tier b

COOL Chips 29学会研究

Low-power and high-speed processor and system design, AI accelerators, memory systems, FPGA, vector processing, heterogeneous computing, quantum-classical systems, sensors, neuromorphic hardware, hardware security, and 3D integration.

IEEE Symposium on Low-Power and High-Speed Chips and Systemsは、回路 / システム / 設計自動化の観点から COOL Chips, low-power chips, high-speed chips, processors, AI accelerators, memory systems, FPGA, vector processing, heterogeneous systems, quantum computing, neuromorphic hardware, hardware security, 3D integration, Fujitsu, SK hynix, NVIDIA, NEC, Socionext, Hitachi, IBM, Sony Semiconductor Solutions を確認するための学会です。公式ページ、募集要項、program、proceedings を分けて確認し、研究室DBや求人DBの分類軸へ接続します。

snapshot

基本データ

Tier B

3大国際会議以外の主要学会として、分野別に確認する。

分野 回路 / システム / 設計自動化

研究室DBと技術レーダーのfield接続に使う。

ジャンル 回路 / 設計 / 3DI / 実装

FEOL、BEOL、3DI、回路、WBG、フォトニクス、信頼性へ接続する。

主催 IEEE Computer Society technical committees / COOL Chips 29 Organizing Committee
開催サイクル 2026-04-15 to 2026-04-17 / Takeda Hall, The University of Tokyo, Tokyo, Japan

2026 cycle finished / official home, committees, final program, call, technical sponsor/cooperation, and history sources checked

投稿形式 Official COOL Chips 29 guidance identifies reviewed six-page full papers, reviewed extended abstracts up to three pages, and separately reviewed poster abstracts. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals.

topics

研究テーマと企業調査へ変換する

coverage

Low-power and high-speed processor and system design, AI accelerators, memory systems, FPGA, vector processing, heterogeneous computing, quantum-classical systems, sensors, neuromorphic hardware, hardware security, and 3D integration.

監視テーマ

COOL Chips, low-power chips, high-speed chips, processors, AI accelerators, memory systems, FPGA, vector processing, heterogeneous systems, quantum computing, neuromorphic hardware, hardware security, 3D integration, Fujitsu, SK hynix, NVIDIA, NEC, Socionext, Hitachi, IBM, Sony Semiconductor Solutions

CFPから抽出する論点

Official 2026 sources identify the April 15-17 Tokyo cycle, February 16 extended paper/abstract deadline, March 13 acceptance notification, March 31 final-manuscript deadline, three committee sections, the completed final program, and four technical sponsor/cooperation rows. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals.

年次比較で残す比較軸

The official 2026 home identifies COOL Chips 29 and states that the international symposium was initiated in 1998.

deadlines

投稿・採択イベント

論文締切 2026-02-16

2026 cycle finished / official home, committees, final program, call, technical sponsor/cooperation, and history sources checked

採択通知 2026-03-13

2026 cycle finished / official home, committees, final program, call, technical sponsor/cooperation, and history sources checked

最終原稿締切 2026-03-31

2026 cycle finished / official home, committees, final program, call, technical sponsor/cooperation, and history sources checked

related pages

関連ページ

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sources

公式確認リンク