EDAPS学会研究
IEEE Electrical Design of Advanced Packaging and Systems Symposiumは、IEEE Electronics Packaging Society / EDAPS Organizing Committeeが主催する実装 / 先端パッケージ / 3D integration分野の学会です。
electrical design, modeling, simulation, and measurement for chip, package, and system levels; 3D-IC, chiplet, interposer, SiP, SI/PI/EMC, RF/mm-wave/THz package, photonics package, package CAD, substrate, and thermal/multiphysics modelingを確認できる。
- 確認日
- 2026-07-04
- 開催サイクル
- 2026-12-14〜2026-12-16 / IIT Ropar, Chandigarh, India
reader evaluation
この学会をどう見るか
Position Tier
Tier B
確立した専門・地域学会です。
産業動向への有用性
限定的
企業発表・委員会・スポンサーを分けて確認
研究の性格
混合
33 EasyChair EDAPS 2025 oral/poster presentation rows / 33件
地理的な到達範囲
地域国際
発表者の所属機関国・地域 / 2026 / 参加範囲を示す軸で、学会の優劣とは別の指標です
snapshot
基本データ
source signal dashboard
歴史と組織構成のダッシュボード
委員会 14件 / 確認した発表 33件 / 発表者所属 33件 / スポンサー掲載 4件
history
26th edition in 2026
初回開催年 2001年（推定） / 25年 / 公式確認
根拠初回会議年
history source企業 / 大学 / 研究機関比率
EDAPS 2026 committee organization mix
71.4% University / academic institution
- Company 28.6%
- University / academic institution 71.4%
Rows use the visible official EDAPS 2026 committee page. The public graph keeps this grain to organization type only.
sourceEDAPS sponsor and sponsor-seminar organization mix
75% Company
- Company 75%
- Professional society / nonprofit 25%
Rows keep current IEEE EPS sponsor statement and EDAPS 2025 sponsor-seminar organizations as listing signals only; they are not revenue or procurement evidence.
source会社別内訳
EDAPS 2026 committee company breakdown
- AMD 1
- Siemens 1
- Simyog Technology Pvt. Ltd 1
- Texas Instruments 1
Company rows are counted at visible official committee person-role grain.
sourceEDAPS 2025 program first-listed affiliation company breakdown
- ASE 1
- Dai Nippon Printing 1
- Resonac 1
Company rows are counted from first-listed author affiliation organization pages.
source所属機関の国・地域別内訳
EDAPS 2025 program affiliation organization country/region
- Japan 12 36.4%
- South Korea 8 24.2%
- Belgium 3 9.1%
- China 3 9.1%
- Taiwan 3 9.1%
- India 2 6.1%
- Canada 1 3%
- United States 1 3%
Country/region is assigned from the first-listed author affiliation organization in EasyChair author pages; it is not a person-level attribute.
sourceスポンサー
EDAPS 2025 program first-listed affiliation organization mix
84.8% University / academic institution
- Company 9.1%
- University / academic institution 84.8%
- Research institute 6.1%
Rows use first-listed author affiliation organization pages from oral and poster sessions. Keynotes, tutorials, sponsor seminars, TC sessions, breaks, and chairs are excluded.
sourceEDAPS sponsor and sponsor-seminar listings
- Current society sponsor statement IEEE Electronics Packaging Society official_sponsor / Professional society
- EDAPS 2025 sponsor seminar Cadence program_sponsor_seminar / Company
- EDAPS 2025 sponsor seminar Zuken program_sponsor_seminar / Company
- EDAPS 2025 sponsor seminar Ansys program_sponsor_seminar / Company
Rows enumerate the current IEEE EPS sponsor statement and EDAPS 2025 sponsor-seminar organization rows. They are listing signals, not revenue or procurement evidence.
sourcetopics
研究テーマと企業調査へ変換する
監視テーマ
advanced packaging, chiplets, 3D-IC, interposers, signal integrity, power integrity, EMC, antenna-in-package, high-speed channels, package CAD, thermal and multiphysics modeling
CFPから抽出する論点
Official EDAPS 2026 sources identify the December 14-16, 2026 IIT Ropar / Chandigarh cycle, August 21 paper deadline, September 21 acceptance notification, October 12 final paper deadline, IEEE EPS sponsorship, visible 2026 committee rows, and the EDAPS-linked 2025 EasyChair program.
年次比較で残す比較軸
The official EDAPS 2026 CFP identifies the conference as the 26th edition.
deadlines
投稿・採択イベント
related pages
関連ページ
sources
公式確認リンク
- 公式 公式ページ 確認日: 2026-07-04
- 募集要項 募集要項 / CFP 確認日: 2026-07-04
- program program 確認日: 2026-07-04
- proceedings proceedings 確認日: 2026-07-04