ICEPT学会研究
International Conference on Electronic Packaging Technologyは、Institute of Microelectronics, Chinese Academy of Sciences / Xi’an Jiaotong University / IEEE EPS / CIE-EMPTが主催する実装 / 先端パッケージ / 3D integration分野の学会です。
packaging design、manufacturing technologies、photonics、MEMS、system integrated packaging を広く対象にする。
- 確認日
- 2026-05-30
- 開催サイクル
- 2026-08-05〜07 / Wyndham Grand Xian South, Xi'an, China
reader evaluation
この学会をどう見るか
Position Tier
Tier B
確立した専門・地域学会です。
snapshot
基本データ
source signal dashboard
歴史と組織構成のダッシュボード
history
Since 1994
初回開催年 1994年 / 32年 / 公式確認
根拠official inaugurated year
history source企業 / 大学 / 研究機関比率
2026 ICEPT official committee affiliation rows
56.5% University
- Company 18.5%
- University 56.5%
- Research institute 16.9%
- Government / public agency 1.3%
- Professional society 1.9%
- Other / unknown 4.8%
Official ICEPT 2026 Conference Chairs, Technical Committee, Organizing Committee, and International Advisory Committee rows are counted at source-row grain. The public graph does not expose committee location axes.
source2026 ICEPT program presenter affiliations
65.5% Company
- Company 65.5%
- University 25.5%
- Research institute 5.5%
- Government / public agency 1.8%
- Other / unknown 1.8%
The official accepted abstract PDF was reviewed but has no affiliation column, so program signal counts official Program HTML PDC, plenary, interactive, session, and invited presentation rows with visible affiliation text. Chairs, welcome addresses, breaks, panels without affiliation, and duplicated mobile/desktop repeats are excluded.
source会社別内訳
2026 ICEPT committee company affiliations
- Huawei 7
- Beijing Herogees Consulting Company 5
- Haiguang Information Technology 3
- ASE Group 2
- Heraeus 2
- HiSilicon 2
- Huatian Technology 2
- JCET Group 2
- NXP Semiconductors 2
- Qualcomm 2
- Universal Global Scientific Industrial 2
- Xiaomi 2
- Awinic Technology 1
- Bin XIE Smart Power & Energy Semi. Co. Ltd. 1
- BOE 1
- Boss Precision 1
Top reviewed company affiliations from official committee rows; committee service is not a customer, revenue, hiring, or collaboration signal.
source2026 ICEPT program presenter company affiliations
- NAURA 2
- Unimicron Technology 2
- ACM Research 1
- ASE Group 1
- Awinic Technology 1
- Besi 1
- CoreTech System (Moldex3D) 1
- Empyrean Technology 1
- EV Group 1
- Guangzhou Zen Semiconductor 1
- Huatek 1
- Indium Corporation 1
- iSTAR 1
- Kokusai Electric 1
- NXP Semiconductors 1
- Pacrim Technology 1
Top reviewed company affiliations from Program HTML presentation/speaker affiliation rows with visible organization text.
source所属機関の国・地域別内訳
2026 ICEPT program presenter affiliation countries / regions
- China 23 41.8%
- Japan 8 14.5%
- United States 8 14.5%
- Germany 5 9.1%
- Taiwan 5 9.1%
- Austria 2 3.6%
- Netherlands 2 3.6%
- Malaysia 1 1.8%
- Singapore 1 1.8%
Rows are grouped by presenter affiliation institution country/region from official ICEPT 2026 Program HTML affiliation text and reviewed institution matching; this is not a personal attribute field.
sourceスポンサー
2026 ICEPT sponsor / organizer / partner organization mix
74.6% Company
- Company 74.6%
- University 6%
- Research institute 3%
- Government / public agency 4.5%
- Professional society 9%
- Other / unknown 3%
Official ICEPT 2026 sponsor/logo rows plus organizer/co-organizer listings, not revenue, customer, procurement, hiring, or collaboration evidence.
source2026 ICEPT official sponsors, organizers, and co-organizers
- sponsored by Institute of Microelectronics, Chinese Academy of Sciences sponsored by / Research institute
- sponsored by Xi'an Jiaotong University sponsored by / University
- sponsored by IEEE Electronics Packaging Society sponsored by / Professional society
- sponsored by CIE-EMPT sponsored by / Professional society
- organized by Xi'an Jiaotong University organized by / University
- organized by Shaanxi Semiconductor Industry Association organized by / Professional society
- organized by Beijing Herogees Consulting Company organized by / Company
- organized by National Center for Advanced Packaging (NCAP China) organized by / Company
- co-organized by Xidian University co-organized by / University
- co-organized by Northwestern Polytechnical University co-organized by / University
- co-organized by IEEE Electronics Packaging Society co-organized by / Professional society
- co-organized by Shennan Circuits co-organized by / Company
- co-organized by China CEPREI Laboratory co-organized by / Government lab
- sponsors page logo/listing row National Center for Advanced Packaging (NCAP China) sponsor / partner listing / Company
- sponsors page logo/listing row China CEPREI Laboratory sponsor / partner listing / Government lab
- sponsors page logo/listing row Shennan Circuits sponsor / partner listing / Company
- sponsors page logo/listing row NAURA sponsor / partner listing / Company
- sponsors page logo/listing row ULVAC sponsor / partner listing / Company
- sponsors page logo/listing row Shanghai Jiading Investment Promotion Service Center sponsor / partner listing / Government lab
- sponsors page logo/listing row 知存科技 sponsor / partner listing / Company
- sponsors page logo/listing row TongFu Microelectronics sponsor / partner listing / Company
- sponsors page logo/listing row 元夫半导体 sponsor / partner listing / Company
- sponsors page logo/listing row 天津中科晶禾电子科技有限责任公司 sponsor / partner listing / Company
- sponsors page logo/listing row Zhuhai Silicon Chip Technology sponsor / partner listing / Company
- sponsors page logo/listing row LPKF sponsor / partner listing / Company
- sponsors page logo/listing row DISCO sponsor / partner listing / Company
- sponsors page logo/listing row EV Group sponsor / partner listing / Company
- sponsors page logo/listing row 广东星空科技装备有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 芯慧联芯（江苏）科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 华封科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 深圳市立特为智能有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 深圳市立可自动化设备有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 苏州模流分析软件有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 苏州微知电子科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 英国工业显微镜有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row Shenzhen Hanswell Technology sponsor / partner listing / Company
- sponsors page logo/listing row 宁波柔印电子科技有限责任公司 sponsor / partner listing / Company
- sponsors page logo/listing row ACM Research sponsor / partner listing / Company
- sponsors page logo/listing row 芬泰电子（上海）有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 伊帕思 sponsor / partner listing / Unknown
- sponsors page logo/listing row JIACO Instruments sponsor / partner listing / Company
- sponsors page logo/listing row Advantest sponsor / partner listing / Company
- sponsors page logo/listing row 卫利国际科贸（上海）有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 凯戈纳斯仪器商贸（上海）有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row Heraeus sponsor / partner listing / Company
- sponsors page logo/listing row 北京雅世恒源科技发展有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 深圳市矩阵多元科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 福英达 sponsor / partner listing / Unknown
- sponsors page logo/listing row 康模数尔软件技术（上海）有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row Shenzhen Institute of Advanced Technology sponsor / partner listing / Research institute
- sponsors page logo/listing row 上海福讯电子有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 沈阳和研科技股份有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 苏州拓鼎电子有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 深圳市华屹超精密测量有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 宁波舜宇仪器有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 亚科电子（香港）有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 北京朗时云帆科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 苏州伊赛仑特电子科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 上海坤道信息技术有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 深圳市圭华智能科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 苏州科斗精密机械有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 上海索屿智能科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 安徽旭腾微电子设备有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 北京华卓精科科技股份有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row 深圳市克洛诺斯科技有限公司 sponsor / partner listing / Company
- sponsors page logo/listing row ICEP 2026 sponsor / partner listing / Professional society
- sponsors page logo/listing row IEMT sponsor / partner listing / Professional society
Official ICEPT 2026 Sponsors page main logo/listing rows plus Conference Organizers page sponsored-by, organized-by, and co-organized-by rows, not revenue/customer/procurement evidence.
sourcetopics
研究テーマと企業調査へ変換する
監視テーマ
system integration, manufacturing technologies, photonics, MEMS, packaging design
CFPから抽出する論点
中国の packaging / assembly エコシステムに近い会議で、実装拠点のテーマ分布を把握しやすい。
年次比較で残す比較軸
APAC 実装勢のテーマ密度を確認する用途に向き、ICEP-HBS と EPTC の間を埋める観測点になる。
deadlines
投稿・採択イベント
related pages
関連ページ
sources
公式確認リンク
- 公式 公式ページ 確認日: 2026-05-30
- 募集要項 募集要項 / CFP 確認日: 2026-05-30