半導体製造ラボ SEMICONDUCTOR DATA LAB

ICPT学会研究

International Conference on Planarization/CMP Technologyは、Chinese Tribology Institute, CMES / Tsinghua University / ICPT 2025 Organizing Committeeが主催するロジック / デバイス / プロセス統合分野の学会です。

主な対象

chemical mechanical planarization / polishing、FEOL CMP、BEOL CMP、post-CMP cleaning、CMP consumables、equipment / metrology、3D IC / TSV / packaging、SiC / GaN / diamond substrate polishingを確認できる。

確認日
2026-07-30
開催サイクル
2025-10-29〜11-01 / Hong Kong Science Park, Hong Kong, China

reader evaluation

この学会をどう見るか

Position Tier

Tier B

確立した専門・地域学会です。

なぜこの評価？
公式根拠 2600926009_285293126009_2224464Poster_Number_THUicpt2024-download-program-overview-data
評価方法を見る

snapshot

基本データ

ジャンル FEOL / デバイス / BEOL / 配線・製造 / 3DI / 実装
開始年 ICPT 2024 19th conference / backcast to 2006
投稿形式 English abstract submission; accepted presenters submit full-length papers with 4-8 pages for oral presenters and 3-4 pages for poster presenters; preferred oral/poster format and topic area are specified at submission.

source signal dashboard

歴史と組織構成のダッシュボード

history

ICPT 2024 19th conference / edition-count backcast to 2006

初回開催年 2006年 / 19年 / 公式source抽出 / spot QA済

根拠official 19th edition count backcast

history source

企業 / 大学 / 研究機関比率

ICPT official committee affiliation organization mix

49 official ICPT 2025 chair rows plus ICPT 2024 committee affiliation source rows / 公式source抽出 / spot QA済

38.8% University

  • Company 34.7%
  • University 38.8%
  • Research institute 22.4%
  • Professional society / nonprofit 4.1%

Rows add visible ICPT 2025 chair rows to detailed ICPT 2024 executive, program, and organizing committee rows because the current full committee lists render as unavailable placeholders in the official text surface.

source

ICPT 2025 poster-number first-listed affiliation organization mix

77 official ICPT 2025 poster-number first-listed affiliation organization rows / 公式source抽出 / spot QA済

55.8% University

  • Company 33.8%
  • University 55.8%
  • Research institute 5.2%
  • Unknown / government / association 5.2%

Rows are official 2025 poster-number rows. Each row uses the first-listed visible affiliation organization; rows with no visible affiliation organization are retained as Unknown.

source

会社別内訳

ICPT official committee company affiliation rows

17 company rows / 49 official committee affiliation source rows / 公式source抽出 / spot QA済

  1. Anji Microelectronics 2
  2. Entegris 2
  3. Anstinc Technology 1
  4. Fil Technology 1
  5. Fujimi 1
  6. Fujimi Inc 1
  7. Hermes-Epitek Corp. 1
  8. Intel 1
  9. KINIK 1
  10. KIOXIA Corp. 1
  11. Merck KGaA 1
  12. Merck Performance Materials 1
  13. Texas Instruments 1
  14. VERSUM Materials 1
  15. X-TrinSiC 1

Company rows are organization names from official ICPT committee affiliation source rows.

source

ICPT 2025 poster-number company affiliation rows

26 company rows / 77 official poster-number first-listed affiliation organization rows / 公式source抽出 / spot QA済

  1. Hwatsing Technology Co. Ltd. 4
  2. Qnity, DuPont Electronics 3
  3. Entegris 2
  4. ACM Research (Shanghai), Inc. 1
  5. AGC Inc. 1
  6. AION Co., Ltd. 1
  7. Air Water Mechatronics Inc. 1
  8. Anton Paar GmbH 1
  9. Bruker Nano Inc. 1
  10. Ebara Corporation 1
  11. FUJIMI Incorporated 1
  12. Fuso Chemical Co. Ltd. 1
  13. KCTech 1
  14. Micron SemiAsiaOP Pte Ltd. 1
  15. Rhosonics 1
  16. Solvay 1
  17. Solventum 1
  18. ST Microelectronics 1
  19. STMicroelectronics 1
  20. Vibrantz Technologies 1

Company rows are first-listed affiliation organizations from official ICPT 2025 poster-number rows.

source

所属機関の国・地域別内訳

ICPT 2025 poster-number first-listed affiliation organization countries / regions

77 official poster-number first-listed affiliation organization rows / affiliation organization country or region / 公式source抽出 / spot QA済

  1. China 27 35.1%
  2. South Korea 19 24.7%
  3. Japan 10 13%
  4. United States 8 10.4%
  5. Unknown 6 7.8%
  6. France 2 2.6%
  7. Austria 1 1.3%
  8. Belgium 1 1.3%
  9. Hong Kong, China 1 1.3%
  10. Netherlands 1 1.3%
  11. Singapore 1 1.3%

Countries and regions are based only on the first-listed affiliation organization shown in official ICPT 2025 poster-number rows.

source

スポンサー

ICPT official sponsor / partner / exhibitor listing mix

44 official ICPT text-visible sponsor / partner / exhibitor listing rows / 公式source抽出 / spot QA済

79.5% Company

  • Company 79.5%
  • University 9.1%
  • Research institute 2.3%
  • Professional society / nonprofit 4.5%
  • Unknown / government / association 4.5%

Rows enumerate text-visible organizer, support, PCO, and exhibitor listings from ICPT 2025 plus official ICPT 2024 exhibitor rows. The sponsor donut and sponsor list use the same listing rows.

source

ICPT official sponsor / partner / exhibitor listings

44 official text-visible sponsor / partner / exhibitor listing rows / 公式source抽出 / spot QA済

  • Hosted by Chinese Mechanical Engineering Society (CMES) Hosted by / Professional society
  • Organized by Chinese Tribology Institute, CMES Organized by / Professional society
  • Organized by Tsinghua University Organized by / University
  • Co-organized by Hwatsing Technology Co., Ltd. Co-organized by / Company
  • Co-organized by Anji Microelectronics Technology (Shanghai) Co., Ltd. Co-organized by / Company
  • Supported by Fudan University Supported by / University
  • Supported by Hong Kong Applied Science and Technology Research Institute (ASTRI) Supported by / Research institute
  • Supported by Shanghai University Supported by / University
  • Supported by Hong Kong Tourism Board Supported by / Government / public program
  • Supported by Government-Funded Program Supported by / Government / public program
  • Supported by Southwest Jiaotong University Supported by / University
  • Professional Conference Organizer Beijing Xinxinyixiang International Conferences Co., Ltd. Professional Conference Organizer / Company
  • Exhibitor Bruker (Beijing) Scientific Technology Co., Ltd. Exhibitor / Company
  • Exhibitor Park Systems Corp. Exhibitor / Company
  • Exhibitor Winifred International Technology Ltd. Exhibitor / Company
  • Exhibitor ADVANTEC CO.,LTD. Exhibitor / Company
  • Exhibitor Global Net Corp. Exhibitor / Company
  • Exhibitor Shinhan Diamond Korea Exhibitor / Company
  • Exhibitor AMAT Exhibitor / Company
  • Exhibitor Advanced Energy Minerals Exhibitor / Company
  • Exhibitor Levitronix GmbH Exhibitor / Company
  • Exhibitor Advantiv Technologies Europe GmbH Exhibitor / Company
  • Exhibitor Nouryon Exhibitor / Company
  • Exhibitor DuPont Exhibitor / Company
  • Exhibitor Kuraray Co., Ltd. Exhibitor / Company
  • Exhibitor 3M Deutschland GmbH Exhibitor / Company
  • Exhibitor SPS Group b.v. Exhibitor / Company
  • Exhibitor Entegris Exhibitor / Company
  • Exhibitor TSI GmbH Exhibitor / Company
  • Exhibitor ProSys Inc. Exhibitor / Company
  • Exhibitor EBARA CORPORATION Exhibitor / Company
  • Exhibitor EHWA Europe GmbH Exhibitor / Company
  • Exhibitor S3 Alliance GmbH Exhibitor / Company
  • Exhibitor KCTech Co., Ltd. Exhibitor / Company
  • Exhibitor Fath GmbH Exhibitor / Company
  • Exhibitor Advanced Materials Technology Exhibitor / Company
  • Exhibitor EMD Electronics Exhibitor / Company
  • Exhibitor Vibrantz Corporation Exhibitor / Company
  • Exhibitor Resonac Europe GmbH Exhibitor / Company
  • Exhibitor Accretech (Europe) GmbH Exhibitor / Company
  • Exhibitor NOF CORPORATION Exhibitor / Company
  • Exhibitor SONOTEC GmbH Exhibitor / Company
  • Exhibitor Kanomax FMT, Inc. Exhibitor / Company
  • Exhibitor Solventum Exhibitor / Company

Rows are the same official listing rows used by the sponsor mix donut. ICPT 2025 tier sponsor logo names are image-only in the reviewed text surface, so they are not transcribed. Rows are listing evidence, not revenue, customer, procurement, hiring, or collaboration evidence.

source

topics

研究テーマと企業調査へ変換する

監視テーマ

CMP slurry, post-CMP cleaning, FEOL CMP, BEOL CMP, hybrid bonding, 3D IC / TSV, process control, metrology, consumables, SiC, GaN, diamond polishing

CFPから抽出する論点

Official ICPT 2025 pages list abstract deadline 2025-06-30, notification 2025-08-08 on the home page, full-length paper deadline 2025-08-31 on the abstract page, and poster/oral presentation inclusion in proceedings for registered presenters.

年次比較で残す比較軸

Official ICPT 2024 program overview identifies ICPT 2024 as the 19th International Conference on Planarization/CMP Technology.

deadlines

投稿・採択イベント

最終原稿締切 2026-09-05

related pages

関連ページ

締切一覧で全体比較研究室DBで発表実績タグを確認学会記事トレンド技術レーダー

sources

公式確認リンク

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