IMAPS Symposium学会研究
International Symposium on Microelectronicsは、IMAPSが主催する実装 / 先端パッケージ / 3D integration分野の学会です。
heterogeneous integration、bonding、materials、RF / MW、MEMS / sensors、metrology、AI-enabled design を packaging supply chain 全体で追える。
- 確認日
- 2026-05-30
- 開催サイクル
- 2026-09-28〜10-01 / Encore Boston Harbor, Boston, Massachusetts, US
reader evaluation
この学会をどう見るか
Position Tier
Tier A
国際的に強い主要・専門学会です。
snapshot
基本データ
source signal dashboard
歴史と組織構成のダッシュボード
history
IMAPS official pages mark 2025 as the 58th and 2026 as the 59th Symposium; 1968 is an approximate start proxy
初回開催年 1968年（推定） / 57年 / 公式source抽出 / spot QA済
根拠official 58th 2025 and 59th 2026 annual count backcast
history source企業 / 大学 / 研究機関比率
IMAPS Symposium 2025 official organizing committee rows
66.7% Company
- Company 66.7%
- University 33.3%
Rows use the official IMAPS Symposium 2025 organizing committee names and affiliations. Geographic breakdown is intentionally omitted for this committee block.
sourceIMAPS Symposium 2025 title first-listed affiliation rows
72% Company
- Company 72%
- University 19.6%
- Research institute 6.5%
- Professional society / media / other 1.9%
Rows count the first-listed author first affiliation organization for each official Oxford Abstracts title. Countries and regions use affiliation organization location only.
source会社別内訳
IMAPS Symposium 2025 official committee company rows
- Qorvo 1
- Qualcomm 1
Company rows are official committee source rows, not de-duplicated headcount.
sourceIMAPS Symposium 2025 title-listing company rows
- Heraeus 4
- NXP Semiconductors 3
- Siliconware Precision Industries 3
- Amkor Technology 2
- Ansys 2
- DuPont 2
- IBM 2
- Indium Corporation 2
- MacDermid Alpha Electronics Solutions 2
- Qualcomm 2
- TAIYO INK MFG. 2
- Texas Instruments 2
- Toray Industries 2
- AMD 1
- Applied Materials 1
- Asahi Kasei Corporation 1
- ASE 1
- Atotech Deutschland GmbH 1
- Cadence Design Systems 1
- DISCO CORPORATION 1
- Electroninks Inc 1
- EMD Electronics 1
- EV Group 1
- Femtum 1
- Finetech 1
- FK Delvotec 1
- Forgione Engineering, Inc. 1
- Gel-Pak 1
- Henkel Corporation 1
- Hesse Mechatronics 1
- INTEKPLUS Co. 1
- ITWEAE 1
- Kinsus interconnect technology Corp. 1
- KYZEN 1
- Lam Research 1
- LPKF Laser & Electronics SE 1
- LQDX Inc 1
- MEC COMPANY LTD. 1
- Menlo Microsystems 1
- Nano Electronics and Micro System Technologies, Inc. 1
- NexGen Wafer Systems America LLC 1
- OKUNO CHEMICAL INDUSTRIES 1
- Promex Industries 1
- PulseForge Inc. 1
- Qorvo 1
- Resonac Corporation 1
- Rogers Corporation 1
- Saras Micro Devices 1
- SavanSys Solutions LLC 1
- Scientech Corporation 1
- Shinko Electric Industries Co. 1
- Siemens EDA 1
- Silitronics Solutions Inc 1
- Syenta 1
- TAIYO HOLDINGS 1
- TANAKA Precious Metal Technologies 1
- Toray Research Center 1
- Unimicron Technology Corporation 1
- USsemi 1
- XTPL Inc. 1
Company rows are first-listed affiliation rows from official Oxford Abstracts title records, not de-duplicated organization headcount.
source所属機関の国・地域別内訳
IMAPS Symposium 2025 first-listed affiliation organization countries / regions
- United States 62 57.9%
- Japan 16 15%
- Taiwan 9 8.4%
- Germany 8 7.5%
- Singapore 4 3.7%
- Canada 2 1.9%
- South Korea 2 1.9%
- Australia 1 0.9%
- Austria 1 0.9%
- Sweden 1 0.9%
- Unknown 1 0.9%
Countries and regions are based on first-listed affiliation organizations in the official Oxford Abstracts IMAPS 2025 title listing. Unknown is retained where the official affiliation record does not expose a country or region.
sourceスポンサー
IMAPS Symposium 2025 official sponsor and partner listing mix
84.2% Company
- Company 84.2%
- Professional society / media / other 15.8%
Rows enumerate every organization visible in the official IMAPS 2025 sponsor image, including Premier, Gold, Silver, Supporting, industry partner, and media partner rows. The sponsor donut and sponsor list use the same listing rows.
sourceIMAPS Symposium 2025 official sponsor and partner listings
- Premier Sponsor ASE premier_sponsor / Company
- Premier Sponsor IBM premier_sponsor / Company
- Premier Sponsor STATS ChipPAC premier_sponsor / Company
- Gold Sponsor DECA gold_sponsor / Company
- Gold Sponsor Intel Foundry gold_sponsor / Company
- Gold Sponsor Northrop Grumman gold_sponsor / Company
- Silver Sponsor Ajinomoto silver_sponsor / Company
- Silver Sponsor AmTECH Microelectronics silver_sponsor / Company
- Silver Sponsor NAMICS silver_sponsor / Company
- Silver Sponsor Saras Micro Devices silver_sponsor / Company
- Silver Sponsor XYZTEC silver_sponsor / Company
- Supporting Sponsor Amkor Technology supporting_sponsor / Company
- Supporting Sponsor Hesse Mechatronics supporting_sponsor / Company
- Supporting Sponsor MicroCircuit Laboratories supporting_sponsor / Company
- Supporting Sponsor Microdul supporting_sponsor / Company
- Supporting Sponsor NorCom Systems Inc supporting_sponsor / Company
- Supporting Sponsor TechSearch International supporting_sponsor / Other
- Official Industry Partner 3DInCites industry_partner / Other
- Official Media Partner Chip Scale Review media_partner / Other
Rows are the same official sponsor / partner image listing rows used by the sponsor mix donut. Country/region is not displayed because the sponsor image does not state country for each listed organization.
sourcetopics
研究テーマと企業調査へ変換する
監視テーマ
heterogeneous integration, bonding, thermal materials, MEMS/sensors, metrology, AI-enabled design, reliability
CFPから抽出する論点
IMAPS 系は assembly と materials 側の実務温度が高く、ECTC より supply chain 寄りの論点を抽出できる。
年次比較で残す比較軸
OSAT、材料、bonding、metrology の接続を比較でき、packaging DB を実務寄りに育てるときの観測点になる。
deadlines
投稿・採択イベント
related pages
関連ページ
sources
公式確認リンク
- 公式 公式ページ 確認日: 2026-05-30
- 募集要項 募集要項 / CFP 確認日: 2026-05-30