半導体製造ラボ SEMICONDUCTOR DATA LAB

IMPACT-IAAC学会研究

International Microsystems, Packaging, Assembly and Circuits Technology Conferenceは、IEEE Electronics Packaging Society / IMAPS Taiwan / ITRI / TPCAが主催する実装 / 先端パッケージ / 3D integration分野の学会です。

主な対象

advanced packaging、heterogeneous integration、IC substrates、PCB、thermal management、reliability、manufacturing processes、materials を台湾/APAC実装エコシステムで確認できる。

確認日
2026-06-26
開催サイクル
2026-10-19〜22 / Grand HiLai Taipei + TaiNEX 2, Taipei, Taiwan

reader evaluation

この学会をどう見るか

Position Tier

Tier A

国際的に強い主要・専門学会です。

産業動向への有用性

強い

企業発表・委員会・スポンサーを分けて確認

研究の性格

産業動向中心

310 official session/poster rows with lead author affiliation institutions / 310件

地理的な到達範囲

国際

発表者の所属機関国・地域 / 2026 / 参加範囲を示す軸で、学会の優劣とは別の指標です

なぜこの評価？
  • 産業動向への有用性は「310 official session/poster rows with lead author affiliation institutions」の所属組織構成と補助signalを分けて評価し、強いです。 公式根拠
  • 発表programの所属機関国・地域を主な母集団として、地理的な到達範囲は国際です。 公式根拠
公式根拠 pageIMPACT 2025 ProgramBook 完整版(含封面封底) 壓縮committeemypage
評価方法を見る

snapshot

基本データ

ジャンル 3DI / 実装

source signal dashboard

歴史と組織構成のダッシュボード

history

2006 first held

初回開催年 2006年 / 21年 / 公式source抽出 / spot QA済

根拠official 21st impact iaac 2026 and 20th anniversary 2025 inclusive edition inference

history source

企業 / 大学 / 研究機関比率

IMPACT-IAAC 2026 official committee source rows

121 official committee hidden JSON source rows / 公式source抽出 / spot QA済

42.1% Company

  • Company 42.1%
  • University 33.1%
  • Research institute 4.1%
  • Professional society 7.4%
  • Other / unknown 13.2%

Official IMPACT-IAAC 2026 committee rows are counted at source-row grain across Core Committee, advisory boards, Technical Program Committee, and Local Committee surfaces. Duplicate people across surfaces remain counted because the official surfaces and roles are separate source rows.

source

IMPACT 2025 official Program Book session/poster lead affiliations

310 official session/poster rows with lead author affiliation institutions / 公式source抽出 / spot QA済

52.6% Company

  • Company 52.6%
  • University 40.6%
  • Research institute 6.8%

Rows are official IMPACT 2025 Program Book oral-session and poster rows with lead author and affiliation columns, parsed at source-row grain. Program country/region is based on affiliation institution country/region, not a person-level attribute.

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会社別内訳

IMPACT-IAAC 2026 committee company rows

51 company rows / 121 official committee source rows / 公式source抽出 / spot QA済

  1. Intel 4
  2. AMD 3
  3. Applied Materials 3
  4. Rapidus Corporation 3
  5. ASE 2
  6. Lam Research 2
  7. MKS Atotech 2
  8. SPIL 2
  9. TSMC 2
  10. UMC 2
  11. Applied Materials Inc. 1
  12. ChipMOS Technologies Inc. 1
  13. Elephantech Inc 1
  14. Eternal Materials 1
  15. Grand Joint Technology 1
  16. iCana Ltd. 1
  17. Ichia Technologies, Inc. 1
  18. Integrated Service Technology Inc. 1
  19. JCU Corporation 1
  20. JSR Corporation 1
  21. MacDermid Alpha Electronics Solutions 1
  22. National University of Kaohsiung 1
  23. Okuno Taiwan Co., Ltd. 1
  24. Omron Corporation 1
  25. Qnity 1
  26. Qnity / DuPont Electronics 1
  27. Senju Electronic (Taiwan) Co.,Ltd 1
  28. ShinePure Hi-Tech 1
  29. Taimide Tech. Inc. 1
  30. TechSearch International 1
  31. Tong Hsing 1
  32. Tong Hsing Electronic Industries, LTD. 1
  33. Toray Research Center, Inc. 1
  34. ULVAC 1
  35. Unimicron 1
  36. USI 1

Company rows are organization names parsed from the official IMPACT-IAAC 2026 committee hidden JSON field.

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IMPACT 2025 program company rows by lead affiliation

163 company rows / 310 official session/poster rows / 公式source抽出 / spot QA済

  1. Intel 16
  2. AMD 12
  3. ASE 10
  4. Applied Materials 8
  5. MKS Inc. 4
  6. MKS Atotech 3
  7. Qnity / DuPont Electronics 3
  8. Siliconware Precision Industries (SPIL) 3
  9. TSMC 3
  10. Unimicron Technology Corp. 3
  11. Universal Scientific Industrial (USI) 3
  12. USI 3
  13. Lam Research 2
  14. Sony Semiconductor Solutions Corporation 2
  15. Ushio Inc. 2
  16. AMD Global Services (M) Sdn Bhd 1
  17. ANVOS Analytics Co., Ltd. 1
  18. ARAKAWA CHEMICAL INDUSTRIES, LTD. 1
  19. ASE Group Chung-Li Branch 1
  20. ASE/National Sun Yat-sen University 1
  21. AT&S 1
  22. AuthenX Inc. 1
  23. Bridge Semiconductor 1
  24. Daicel Corporation 1
  25. DELO Industrial Adhesives 1
  26. Denso 1
  27. DuPont 1
  28. Elephantech 1
  29. EMC 1
  30. GEA 1
  31. Grand Joint Technology 1
  32. GreenSource Engineering 1
  33. IBM 1
  34. Inc. Acbel Polytech 1
  35. Inc. Toray Industries 1
  36. Institute of Science Tokyo, Japan. / Kanagawa, Murata Manufacturing Co., Ltd. Kyoto, Japan 1
  37. Integrated Service Technology Inc. 1
  38. Intel Corporation 1
  39. JCU Corporation 1
  40. JSR 1
  41. Kao Corporation 1
  42. Kinsus Interconnect Technology Corp. 1
  43. Korea Advanced Institute of Science and Technology / SAMSUNG Electronics / Seoul National University of Science and Technology 1
  44. LAM RESEARCH 1
  45. Lenovo 1
  46. LPKF Laser & Electronics 1
  47. Ltd. ROHM Company 1
  48. MacDermid Alpha 1
  49. MacDermid Alpha Electronic Solutions 1
  50. MacDermid Alpha Electronics Solutions 1
  51. MacDermid Alpha Electronics Solutions, Waterbury, CT, USA 1
  52. Micron 1
  53. Microsoft 1
  54. Miniaturization Competence Center(MCC) of USI 1
  55. Mirle Automation Co. 1
  56. Mitsubishi Materials Corporation 1
  57. MKS Atotech Taiwan Limited 1
  58. MKS Inc 1
  59. MKS Instruments / Materials Solutions Division / Atotech Deutschland GmbH & Co. KG 1
  60. nexensor Inc. 1
  61. Nexperia Hong Kong 1
  62. Nihon Gosei Kako 1
  63. NXP 1
  64. Okuno chemical Industries Co., Ltd. 1
  65. Onto Innovation 1
  66. Panasonic Connect Co., Ltd, 1
  67. Photothermal Spectroscopy Corp 1
  68. Raytek Semiconductor Inc. 1
  69. RENA Technologies GmbH 1
  70. Resonac 1
  71. RIMTEC CORPORATION 1
  72. ROHM 1
  73. ROHM Company Ltd. 1
  74. SCHMID 1
  75. SciTech Power Research Ltd. 1
  76. ShinePure Hi-Tech 1
  77. Shinko Electric Industries 1
  78. Sony Semiconductor Solutions 1
  79. SPIL 1
  80. Taiwan ForeSight Co.Ltd 1
  81. Taiyo Holdings 1
  82. TechSearch International 1
  83. TechSearch International, Inc 1
  84. Tenasic Technology 1
  85. TONG HSING ELECTRONIC IND. LTD 1
  86. Tong Hsing Electronic Industries 1
  87. Tong Hsing Electronic Industries, Ltd. 1
  88. Toray Research Center, Inc. 1
  89. ULVAC, Inc. 1
  90. USI Inc. 1
  91. USI, Universal Scientific Industrial (USI) 1
  92. Wafer Chem 1
  93. Wistron 1
  94. Wistron Corporation 1
  95. Wistron NeWeb Corporation 1
  96. Wiwynn Corporation 1
  97. WNC Corporation 1
  98. X-FAB Sarawak Sdn. Bhd. 1
  99. Yole 1
  100. Zuken Inc. 1
  101. Zymet, Inc 1

Company rows are lead-author affiliation institutions from the official IMPACT 2025 Program Book session and poster tables.

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所属機関の国・地域別内訳

IMPACT 2025 Program Book lead affiliation institution countries / regions

310 official session/poster rows / lead affiliation institution country/region / 公式source抽出 / spot QA済

  1. Taiwan 162 52.3%
  2. United States 72 23.2%
  3. Japan 38 12.3%
  4. South Korea 16 5.2%
  5. Germany 5 1.6%
  6. China 4 1.3%
  7. Singapore 3 1%
  8. Australia 2 0.6%
  9. Malaysia 2 0.6%
  10. Unknown 2 0.6%
  11. Austria 1 0.3%
  12. France 1 0.3%
  13. Hong Kong 1 0.3%
  14. Netherlands 1 0.3%

Countries/regions are based on lead-author affiliation institutions from the official IMPACT 2025 Program Book. This is affiliation institution geography, not a person-level attribute; two rows remain Unknown because the official affiliation name is insufficient to resolve geography conservatively.

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スポンサー

IMPACT-IAAC 2026 official organizer / partner / sponsor listing mix

42 official organizer, co-organizer, partner, co-hosting event, and sponsor logo listing rows / 公式source抽出 / spot QA済

52.4% Company

  • Company 52.4%
  • University 14.3%
  • Research institute 2.4%
  • Professional society 28.6%
  • Other / unknown 2.4%

Rows enumerate official organizer/co-organizer/partner/co-hosting statements plus 2026 Industry / Special Forum, Tabletop Exhibition, and Sponsor logo listings. They are not revenue, customer, procurement, hiring, or collaboration evidence.

source

IMPACT-IAAC 2026 official organizer, partner, and sponsor listing

42 official organizer, co-organizer, partner, co-hosting event, and sponsor logo listing rows / 公式source抽出 / spot QA済

  • Organizer IEEE Electronics Packaging Society (IEEE EPS) organizer / Professional society
  • Organizer IMAPS Taiwan organizer / Professional society
  • Organizer Industrial Technology Research Institute (ITRI) organizer / Research institute
  • Organizer Taiwan Printed Circuit Association (TPCA) organizer / Professional society
  • Co-Organizer Feng Chia University co-organizer / University
  • Co-Organizer National Tsing Hua University co-organizer / University
  • Co-Organizer National Taiwan University co-organizer / University
  • Co-Organizer I-Shou University co-organizer / University
  • Co-Organizer Global Electronics Association co-organizer / Professional society
  • Co-Organizer International Conference on Electronics Packaging (ICEP) co-organizer / Professional society
  • Co-Organizer International College of Semiconductor Technology, National Yang Ming Chiao Tung University co-organizer / University
  • Co-Organizer iNEMI co-organizer / Unknown
  • Co-Organizer International Symposium on Microelectronics Packaging (ISMP) co-organizer / Professional society
  • Co-Organizer Japan Institute of Electronics Packaging (JIEP) co-organizer / Professional society
  • Co-Organizer Graduate School of Advanced Technology, National Taiwan University co-organizer / University
  • Co-Organizer SMTA Taiwan Chapter co-organizer / Professional society
  • Co-Organizer Taiwan Semiconductor Industry Association (TSIA) co-organizer / Professional society
  • Co-Organizer Taiwan Thermal Management Association (TTMA) co-organizer / Professional society
  • Partner Electronic Packaging Technology Conference (EPTC) partner / Professional society
  • Partner TechSearch International partner / Company
  • Partner Yole Group partner / Company
  • Co-hosting Event TPCA Show 2026 co-hosting event / Professional society
  • Industry / Special Forum AMD industry / special forum / Company
  • Industry / Special Forum Applied Materials industry / special forum / Company
  • Industry / Special Forum Advanced Semiconductor Engineering (ASE) industry / special forum / Company
  • Industry / Special Forum Hi-CHIP industry / special forum / Company
  • Industry / Special Forum Intel industry / special forum / Company
  • Industry / Special Forum Lam Research industry / special forum / Company
  • Industry / Special Forum MKS Atotech industry / special forum / Company
  • Industry / Special Forum Qnity / DuPont Electronics industry / special forum / Company
  • Industry / Special Forum Siliconware Precision Industries (SPIL) industry / special forum / Company
  • Tabletop Exhibition Elephantech tabletop exhibition / Company
  • Tabletop Exhibition Toray Research Center tabletop exhibition / Company
  • Sponsors Eternal Materials sponsor / Company
  • Sponsors Omron sponsor / Company
  • Sponsors Universal Scientific Industrial (USI) sponsor / Company
  • Sponsors Ichia Technologies sponsor / Company
  • Sponsors JCU Corporation sponsor / Company
  • Sponsors JSR Corporation sponsor / Company
  • Sponsors MacDermid Alpha Electronics Solutions sponsor / Company
  • Sponsors Okuno Chemical Industries sponsor / Company
  • Sponsors United Microelectronics Corporation (UMC) sponsor / Company

Rows are the same official listing rows used by the sponsor mix donut: home-page organizer/co-organizer/partner/co-hosting entries plus the sponsor-page Industry / Special Forum, Tabletop Exhibition, and Sponsor logo entries. They are listing evidence only, not revenue, customer, procurement, hiring, or collaboration evidence.

source

topics

研究テーマと企業調査へ変換する

監視テーマ

advanced packaging, heterogeneous integration, IC substrate, PCB, thermal, reliability, materials

CFPから抽出する論点

公式2026 homeはEnergy-Efficient AIをテーマに、2026年10月19〜22日 Taipei開催と2026年6月30日へのsubmission deadline延長を案内している。

年次比較で残す比較軸

公式2026 footerは21st conference、公式2025 Program Book/archiveは2006 inception / 20th anniversaryを示すため、初回開催年は2006とする。

deadlines

投稿・採択イベント

論文締切 2026-06-30

related pages

関連ページ

締切一覧で全体比較研究室DBで発表実績タグを確認学会記事トレンド技術レーダー

sources

公式確認リンク

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