ISMP学会研究
International Symposium on Microelectronics Packagingは、Korean Microelectronics Packaging Societyが主催する実装 / 先端パッケージ / 3D integration分野の学会です。
chiplet package design、2.xD/3.xD integration、fine-pitch substrates、interposers、fluxless bonding、hybrid bonding、co-packaged optics を packaging 側から確認する。
- 確認日
- 2026-07-30
- 開催サイクル
- 2026-11-03〜06 / Paradise Hotel Busan, Busan, Korea
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基本データ
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歴史と組織構成のダッシュボード
history
Official ISMP 2026 Overview states ISMP 2026 is the 24th International Symposium on Microelectronics Packaging
初回開催年 2003年（推定） / 23年 / 公式source抽出 / spot QA済
根拠official edition number backcast
history source企業 / 大学 / 研究機関比率
ISMP 2026 official committee affiliation organization rows
61.9% University
- Company 19%
- University 61.9%
- Research institute 14.3%
- Professional society 4.8%
Rows use the official ISMP 2026 Committee page, counted at source row / role row grain.
sourceISMP 2026 official plenary, keynote, and invited speaker affiliation organization rows
72.7% Company
- Company 72.7%
- University 20.5%
- Research institute 6.8%
Rows count official plenary, keynote, and invited speaker affiliation organization rows; this is not an accepted-presentation first-listed affiliation export.
source会社別内訳
ISMP 2026 official committee company rows
- Camtec Korea Inc. 1
- EMC Doctors Inc. 1
- Hanwha e-ssential 1
- LG Chem 1
Company rows are official committee source rows, not de-duplicated headcount.
sourceISMP 2026 official speaker company rows
- Samsung Electronics Co., Ltd. 2
- Adeia Inc. 1
- Ajinomoto Co., Inc. 1
- AMD (Advanced Micro Devices, Inc.) 1
- Amkor Technology 1
- Amkor Technology Korea, Inc. 1
- Applied Materials, Inc. 1
- BASF 1
- BE Semiconductor Industries NV (BESI) 1
- BSP Co., Ltd. 1
- Comet 1
- Corning Science & Technology 1
- Corning Technology Center Korea 1
- EBARA Corporation 1
- ELSPES Inc. 1
- EV Group 1
- Laserapps Co., Ltd. 1
- LPKF Laser & Electronics Korea Ltd. 1
- Mitsubishi Materials Corporation 1
- NVIDIA Corporation 1
- OpenAI Inc. 1
- PulseForge Inc. 1
- Resonac Corporation 1
- SK hynix Inc. 1
- Sumitomo Bakelite Co., Ltd. 1
- Taiyo Ink Mfg. Co., Ltd. 1
- TechSearch International, Inc. 1
- Tokuyama Corporation 1
- Tokyo Electron Korea Ltd. 1
- Tomocube Inc. 1
- ULVAC, Inc. 1
Company rows are affiliation-bearing official speaker rows; this is not a full accepted-presentation first-author affiliation export.
source所属機関の国・地域別内訳
ISMP 2026 official speaker affiliation organization countries / regions
- South Korea 20 45.5%
- Japan 8 18.2%
- United States 7 15.9%
- Taiwan 4 9.1%
- Germany 2 4.5%
- Austria 1 2.3%
- Belgium 1 2.3%
- Switzerland 1 2.3%
Countries and regions are based on official speaker affiliation organization rows and listed affiliation organization country/region, not person attributes.
sourceスポンサー
ISMP 2026 official sponsor and booth listing mix
75% Company
- Company 75%
- University 12.5%
- Research institute 12.5%
Rows enumerate the official ISMP 2026 Our Sponsor page listings and omit TBD placeholders. The sponsor donut and sponsor list use the same listing rows.
sourceISMP 2026 official sponsor and booth listings
- Platinum sponsor LG Chem Platinum sponsor / Company
- Platinum sponsor Genesem Inc. Platinum sponsor / Company
- Gold sponsor Dongwoo Fine-Chem Gold sponsor / Company
- Booth exhibitor Comet Booth exhibitor / Company
- Booth exhibitor KANC / Korea Advanced Nano Fab Center Booth exhibitor / Research institute
- Booth exhibitor Hanyang University Semiconductor Research Center Booth exhibitor / University
- Booth exhibitor Ajin Electronics Booth exhibitor / Company
- Booth exhibitor H&Iruja Booth exhibitor / Company
Rows are the same official ISMP 2026 Our Sponsor page listings used by the sponsor mix donut. TBD placeholders are excluded; several names are reviewed from official logo images and official link targets.
sourcetopics
研究テーマと企業調査へ変換する
監視テーマ
chiplet packaging, 2.xD/3.xD integration, fine-pitch substrates, interposers, hybrid bonding, co-packaged optics, packaging reliability
CFPから抽出する論点
公式Overview / Welcome messageはoral and poster presentation向けabstract投稿を案内し、committee・plenary/keynote/invited speaker・sponsorページで産学構成を確認できる。
年次比較で残す比較軸
KMEPS主催の韓国packaging系シンポジウムとして、advanced packaging、substrate、bonding、optical packaging、reliabilityの地域シグナルを確認する。
deadlines
投稿・採択イベント
related pages
関連ページ
sources
公式確認リンク
- 公式 公式ページ 確認日: 2026-07-30
- 募集要項 募集要項 / CFP 確認日: 2026-07-30
- program program 確認日: 2026-07-30
- 公式 ISMP 2026 welcome message 確認日: 2026-07-30
- 公式 ISMP 2026 committee 確認日: 2026-07-30
- program ISMP 2026 plenary speakers 確認日: 2026-07-30
- program ISMP 2026 keynote speakers 確認日: 2026-07-30
- 公式 ISMP 2026 sponsorship 確認日: 2026-07-30
- 公式 ISMP 2026 sponsors 確認日: 2026-07-30