THERMINIC学会研究
International Workshop on Thermal Investigations of ICs and Systemsは、THERMINIC Steering Committeeが主催する実装 / 先端パッケージ / 3D integration分野の学会です。
Thermal and reliability investigations for ICs, power electronics, packaging, measurement, modeling, and cooling systems.
- 確認日
- 2026-08-13
- 開催サイクル
- 2026-09-16 to 2026-09-18 / Berlin, Germany
reader evaluation
この学会をどう見るか
Position Tier
Tier A
国際的に強い主要・専門学会です。
snapshot
基本データ
source signal dashboard
歴史と組織構成のダッシュボード
委員会 27件 / 発表者所属 3件 / スポンサー掲載 11件
企業 / 大学 / 研究機関比率
THERMINIC 2026 committee affiliation-role rows
40.7% company
- company 40.7%
- university 37%
- research institution 18.5%
- unknown 3.7%
Official chair and steering-committee affiliation-role rows; source-row grain, not unique people. Geography is excluded from this committee block.
sourceTHERMINIC 2026 published keynote affiliation rows
66.7% company
- company 66.7%
- research institution 33.3%
Published named-keynote affiliation subset; it is not an accepted-paper first-author census.
source会社別内訳
THERMINIC 2026 committee company affiliation rows
- NXP 2
- ams-OSRAM 1
- ASML 1
- Huawei 1
- Infineon 1
- mcc 1
- mcc Agentur für Kommunikation 1
- Siemens 1
- Siemens Digital Industry Software 1
- ST Microelectronics 1
All named committee affiliations are retained; bars show company rows only.
sourceTHERMINIC 2026 published keynote company affiliation rows
- ams-OSRAM International GmbH 1
- Infineon Technologies, Regensburg, Germany 1
Published keynote subset only; it is not an accepted-paper first-author census.
source所属機関の国・地域別内訳
THERMINIC 2026 published-keynote affiliation countries / regions
- Unknown 2 66.7%
- Germany 1 33.3%
Published affiliation-location rows. Two source rows do not print a country and remain Unknown rather than inferred.
sourceスポンサー
THERMINIC 2026 official supporter and exhibitor listing
90.9% company
- company 90.9%
- professional society 9.1%
The sponsor donut and complete listing use the same official co-sponsor, supporter, and exhibitor rows.
sourceTHERMINIC 2026 official supporter and exhibitor listing
- IEEE Official homepage co-sponsor logo / Professional society
- Berliner Nanotest und Design GmbH Platinum Supporter / Company
- ams OSRAM Group Platinum Supporter / Company
- Huawei Premium Supporter / Company
- Insidix Supporter / Company
- Berlin Partner for Business and Technology Supporter / Company
- Synopsys Supporter / Company
- InfraTec Exhibitor / Company
- megacool technologies Exhibitor / Company
- Cadence Exhibitor / Company
- budatec Exhibitor / Company
Complete named co-sponsor, supporter, and exhibitor listing visibly published on the official pages; no prospective packages or unlisted organizations are inferred.
sourcetopics
研究テーマと企業調査へ変換する
監視テーマ
thermal modeling, thermal metrology, power electronics, reliability, advanced cooling, NXP, Huawei, ASML, Siemens, Infineon, STMicroelectronics, ams OSRAM
CFPから抽出する論点
Official sources identify April 15 abstract, June 8 acceptance, August 3 proceedings-paper, and September 16-18 workshop dates.
年次比較で残す比較軸
The official past-events archive lists annual meetings from 1995; the 2026 workshop is the 32nd edition.
deadlines
投稿・採択イベント
related pages
関連ページ
sources
公式確認リンク
- 公式 公式ページ 確認日: 2026-08-13
- 募集要項 募集要項 / CFP 確認日: 2026-08-13
- program program 確認日: 2026-08-13