conference research / Tier b

TMS Annual学会研究

Materials science and engineering research spanning electronic packaging and interconnection materials, thin films and coatings, interfaces, advanced characterization, additive manufacturing, nuclear and energy materials, microstructure, thermodynamics, kinetics, and materials processing. Relevant to semiconductor packaging, interconnect metallurgy, diffusion barriers, thermal interfaces, reliability, and process characterization.

TMS Annual Meeting & Exhibitionは、ロジック / デバイス / プロセス統合の観点から TMS Annual Meeting, ProgramMaster symposium organizers, approved abstract title rows, Electronic Packaging and Interconnection Materials, Thin Films and Coatings, Chemistry and Physics of Interfaces, advanced characterization, official exhibitor directory, national labs, instrument vendors, and materials software exhibitors を確認するための学会です。公式ページ、募集要項、program、proceedings を分けて確認し、研究室DBや求人DBの分類軸へ接続します。