半導体製造ラボ SEMICONDUCTOR DATA LAB

CS MANTECHとは | 2026日程・投稿・Technical Digest

CS MANTECHはInternational Conference on Compound Semiconductor Manufacturing Technologyの略称です。

主な対象

compound semiconductor manufacturingを軸に、GaN HEMT、reliability、wafer processing、advanced packaging、heterogeneous integration、RF/mmWave、optoelectronics、power conversionまで確認できる。

公式Aboutは、compound semiconductor manufacturing and device technologyを扱う年次国際会議として説明しています。2026年はPortland Marriott Downtown Waterfrontで5月18〜21日に開催され、公式ProgramにはGaN HEMT、reliability、wafer processing、advanced packaging、heterogeneous integration、RF/mmWave、optoelectronics、power conversionなどが並びます。

確認日
2026-07-01
開催サイクル
2027-05-17〜20 / Sandestin resort, Northwest Florida, US

reader evaluation

この学会をどう見るか

Position Tier

Tier B

確立した専門・地域学会です。

地理的な到達範囲

国際

発表者の所属機関国・地域 / 2027 / 参加範囲を示す軸で、学会の優劣とは別の指標です

なぜこの評価?
  • 発表programの所属機関国・地域を主な母集団として、地理的な到達範囲は国際です。 公式根拠
評価方法を見る

snapshot

基本データ

ジャンル WBG / パワー
投稿形式 2-page abstract PDF / accepted author full paper up to 4 pages / Technical Digest / Session Chair review and feedback

source signal dashboard

歴史と組織構成のダッシュボード

history

Since 1986

初回開催年 1986年 / 40年 / 公式source確認

根拠official 2026 program first conference launched october 1986

history source

企業 / 大学 / 研究機関比率

CS MANTECH 2026 official committee person-role-affiliation rows

120 person-role-affiliation rows / official 2026 committee, executive, and board pages / 公式source抽出 / spot QA済

77.5% Company

  • Company 77.5%
  • University 8.3%
  • Research institute 0.8%
  • Government / public agency 2.5%
  • Professional society 0.8%
  • Other / unknown 10%

Official CS MANTECH 2026 Technical Program Committee, Executive Committee, and Board of Directors rows are counted at source-row grain. Secondary official sources: https://csmantech.org/executive-committee/ and https://csmantech.org/board-of-directors/. No geography breakdown is projected for these service rows.

source

CS MANTECH 2026 numbered program first-listed affiliation rows

94 numbered program rows / official 2026 Advance Program PDF / 公式source抽出 / spot QA済

57.4% Company

  • Company 57.4%
  • University 28.7%
  • Research institute 4.3%
  • Government / public agency 8.5%
  • Other / unknown 1.1%

Official CS MANTECH 2026 numbered plenary, technical, special-session, and poster program rows count the first-listed affiliation institution. The non-presentation 7A.0 introduction row is excluded.

source

会社別内訳

CS MANTECH committee company affiliations

93 company rows / 120 official committee person-role-affiliation rows / 公式source抽出 / spot QA済

  1. Qorvo 10
  2. MACOM 7
  3. Northrop Grumman 6
  4. IQE 4
  5. HRL Laboratories 3
  6. Raytheon 3
  7. Veeco 3
  8. Allegro MicroSystems 2
  9. Arkesso 2
  10. BAE Systems 2
  11. ePAK International 2
  12. GCS 2
  13. Google 2
  14. JPO/DCS Corp 2
  15. nLight 2
  16. Skyworks Solutions 2

Top reviewed company affiliations from official CS MANTECH 2026 committee, executive, and board person-role-affiliation rows. Committee service is not customer, revenue, hiring, or collaboration evidence.

source

CS MANTECH program company affiliations

54 company rows / 94 official program first-listed affiliation rows / 公式source抽出 / spot QA済

  1. MACOM 4
  2. Northrop Grumman 4
  3. HRL Laboratories 3
  4. Qorvo 3
  5. Skyworks Solutions 3
  6. WIN Semiconductors 3
  7. Matsuda Sangyo 2
  8. Virginia Diodes 2
  9. ams OSRAM 1
  10. BAE Systems 1
  11. Crystal IS 1
  12. GCS 1
  13. GlobalFoundries 1
  14. Infineon Technologies 1
  15. IQE 1
  16. Kurt J. Lesker Company 1

Top reviewed company affiliations from official CS MANTECH 2026 numbered program rows using the first-listed affiliation institution.

source

所属機関の国・地域別内訳

CS MANTECH 2026 program first-listed affiliation countries / regions

94 official program first-listed affiliation rows / 公式source抽出 / spot QA済

  1. United States 56 59.6%
  2. Taiwan 9 9.6%
  3. United Kingdom 8 8.5%
  4. Germany 6 6.4%
  5. Japan 5 5.3%
  6. France 3 3.2%
  7. Hungary 1 1.1%
  8. Israel 1 1.1%
  9. Italy 1 1.1%
  10. Singapore 1 1.1%
  11. South Korea 1 1.1%
  12. Sweden 1 1.1%
  13. Turkey 1 1.1%

Rows are grouped by first-listed program affiliation institution country/region from the official CS MANTECH 2026 Advance Program PDF and reviewed institution matching.

source

スポンサー

CS MANTECH 2026 official sponsor / media partner / exhibitor organization mix

87 unique official sponsor / media partner / exhibitor organization rows / 公式source抽出 / spot QA済

92% Company

  • Company 92%
  • University 1.1%
  • Other / unknown 6.8%

Official CS MANTECH 2026 sponsor and media partner rows from the sponsor page plus exhibitor organizations from https://csmantech.org/exhibit-hall-2026/; duplicated sponsor/exhibitor organizations are merged with roles retained. Not revenue, customer, procurement, hiring, or collaboration evidence.

source

CS MANTECH official sponsor, media partner, and exhibitor organizations

87 unique official sponsor / media partner / exhibitor organization rows / 公式source抽出 / spot QA済

  • 2026 Gold Sponsors / 2026 Exhibitor Accel-RF sponsor / exhibitor / Company
  • 2026 Exhibitor Air Liquide-Balazs NanoAnalysis exhibitor / Company
  • 2026 Gold Sponsors / 2026 Exhibitor Aixtron sponsor / exhibitor / Company
  • 2026 Exhibitor Annealsys exhibitor / Company
  • 2026 Exhibitor Applied Microengineering exhibitor / Company
  • 2026 Exhibitor Atomscale exhibitor / Company
  • 2026 Exhibitor AXT exhibitor / Company
  • 2026 Exhibitor Beneq exhibitor / Company
  • 2026 Exhibitor C&D Semiconductor exhibitor / Company
  • 2026 Exhibitor Camtek exhibitor / Company
  • 2026 Exhibitor Canon USA exhibitor / Company
  • 2026 Exhibitor ClassOne Technology exhibitor / Company
  • 2026 Exhibitor CLAWS Hub exhibitor / Nonprofit
  • 2026 Silver Sponsors / 2026 Exhibitor Cohu sponsor / exhibitor / Company
  • 2026 Media Partners Compound Semiconductor Magazine media_partner / Media
  • 2026 Exhibitor Covalent exhibitor / Company
  • 2026 Exhibitor CS CLEAN SOLUTIONS exhibitor / Company
  • 2026 Exhibitor CSconnected exhibitor / Nonprofit
  • 2026 Exhibitor Denton Vacuum exhibitor / Company
  • 2026 Exhibitor DOWA Electronics Materials exhibitor / Company
  • 2026 Exhibitor Efab International Technology exhibitor / Company
  • 2026 Exhibitor eInnoSys exhibitor / Company
  • 2026 Exhibitor ePAK International exhibitor / Company
  • 2026 Exhibitor ErgoTech Systems exhibitor / Company
  • 2026 Exhibitor Eurofins EAG Laboratories exhibitor / Company
  • 2026 Exhibitor EV Group exhibitor / Company
  • 2026 Bronze Sponsors / 2026 Exhibitor Ferrotec sponsor / exhibitor / Company
  • 2026 Silver Sponsors / 2026 Exhibitor Forge Nano sponsor / exhibitor / Company
  • 2026 Exhibitor Freiberg Instruments exhibitor / Company
  • 2026 Exhibitor Freiberger Compound Materials exhibitor / Company
  • 2026 Exhibitor HORIBA exhibitor / Company
  • 2026 Media Partners How2Power.com media_partner / Media
  • 2026 Exhibitor Insaco exhibitor / Company
  • 2026 Exhibitor Intelligent Epitaxy Technology exhibitor / Company
  • 2026 Exhibitor IVWorks exhibitor / Company
  • 2026 Exhibitor JST exhibitor / Company
  • 2026 Platinum Sponsor / 2026 Exhibitor KLA sponsor / exhibitor / Company
  • 2026 Exhibitor Kurt J. Lesker Company exhibitor / Company
  • 2026 Exhibitor LAB14 exhibitor / Company
  • 2026 Silver Sponsors Lam Research sponsor / Company
  • 2026 Exhibitor LayTec exhibitor / Company
  • 2026 Bronze Sponsors MACOM sponsor / Company
  • 2026 Exhibitor Malvern Panalytical exhibitor / Company
  • 2026 Exhibitor Matsuda Sangyo exhibitor / Company
  • 2026 Exhibitor Microsanj exhibitor / Company
  • 2026 Media Partners Microwave Journal media_partner / Media
  • 2026 Exhibitor Midwest Microelectronics Consortium exhibitor / Nonprofit
  • 2026 Exhibitor Mitsuboshi Diamond Industrial exhibitor / Company
  • 2026 Exhibitor Modutek exhibitor / Company
  • 2026 Exhibitor Nel Hydrogen exhibitor / Company
  • 2026 Exhibitor Nippon Sanso exhibitor / Company
  • 2026 Silver Sponsors Northrop Grumman sponsor / Company
  • 2026 Exhibitor Nouryon exhibitor / Company
  • 2026 Exhibitor NTT exhibitor / Company
  • 2026 Bronze Sponsors Osemi sponsor / Company
  • 2026 Platinum Sponsor / 2026 Exhibitor Plasma-Therm sponsor / exhibitor / Company
  • 2026 Exhibitor Pozzetta exhibitor / Company
  • 2026 Exhibitor Precitec 3D Metrology exhibitor / Company
  • 2026 Gold Sponsors Qorvo sponsor / Company
  • 2026 Exhibitor Raith exhibitor / Company
  • 2026 Exhibitor RASIRC exhibitor / Company
  • 2026 Bronze Sponsors / 2026 Exhibitor Raytheon sponsor / exhibitor / Company
  • 2026 Exhibitor RENA Technologies exhibitor / Company
  • 2026 Exhibitor RSC exhibitor / Company
  • 2026 Exhibitor Samco exhibitor / Company
  • 2026 Exhibitor scia Systems exhibitor / Company
  • 2026 Exhibitor Semilab exhibitor / Company
  • 2026 Exhibitor Shellback Semiconductor Technology exhibitor / Company
  • 2026 Exhibitor Sono-Tek exhibitor / Company
  • 2026 Exhibitor SPS-America exhibitor / Company
  • 2026 Exhibitor STR US exhibitor / Company
  • 2026 Exhibitor StratEdge exhibitor / Company
  • 2026 Exhibitor Sumitomo Chemical exhibitor / Company
  • 2026 Bronze Sponsors Teledyne Scientific & Imaging sponsor / Company
  • 2026 Bronze Sponsors / 2026 Exhibitor Thermo Fisher Scientific sponsor / exhibitor / Company
  • 2026 Gold Sponsors Tokyo Electron sponsor / Company
  • 2026 Exhibitor Trymax exhibitor / Company
  • 2026 Exhibitor University of Southern California exhibitor / University
  • 2026 Exhibitor Vacuum Engineering & Materials exhibitor / Company
  • 2026 Exhibitor Veeco exhibitor / Company
  • 2026 Bronze Sponsors / 2026 Exhibitor Virginia Diodes sponsor / exhibitor / Company
  • 2026 Exhibitor Visiontec USA exhibitor / Company
  • 2026 Bronze Sponsors Vistec Semiconductor Systems sponsor / Company
  • 2026 Exhibitor Vital Materials exhibitor / Company
  • 2026 Exhibitor Wafer World exhibitor / Company
  • 2026 Gold Sponsors WIN Semiconductors sponsor / Company
  • 2026 Exhibitor Yunnan Xinyao Semiconductor Materials exhibitor / Company

Official CS MANTECH 2026 sponsor and media partner organization rows from https://csmantech.org/sponsors/; official exhibitor organizations from https://csmantech.org/exhibit-hall-2026/; duplicated sponsor/exhibitor organizations are merged with roles retained.

source

topics

研究テーマと企業調査へ変換する

監視テーマ

GaN HEMT, compound manufacturing, wafer processing, reliability, advanced packaging, heterogeneous integration, RF/mmWave, optoelectronics, power conversion

CFPから抽出する論点

公式homeで2027年5月17〜20日のSandestin開催を確認。締切は次回Authors/CFP更新後に別更新する。

年次比較で残す比較軸

CS MANTECH公式About / Authors / Accepted Authors / Author Kit / 2026 Advance Programで、会議の位置づけ、2-page abstract、accepted author guidance、Session Chair review and feedback、Technical Digest掲載、2026 program scopeを確認済み。匿名査読の有無は公式文面だけでは断定しない。

verified notes

公式根拠で補足する論点

WBGだけに限定しない

2026 Advance Programは、GaN HEMTやpower conversionに加え、reliability、wafer processing、growth techniques、advanced packaging、heterogeneous integration、RF/mmWave、optoelectronicsを扱います。このため、公開本文ではpower devicesだけに限定せず、compound semiconductor manufacturingを軸にした会議として説明します。

査読性は公式表現の範囲で書く

Author Kitでは、full paperがTechnical Digestへ収録され、Session Chairsへreview and feedbackのために提出されることを確認できます。一方で、一般的な匿名査読プロセスまでは確認できないため、公開面では「Session Chair review and feedback」と「匿名査読は未確認」を分けます。

2026投稿サイクルは締切済みとして扱う

公式Authorsページの2026サイクルでは、abstract submission closes on November 28th, 2025と案内されています。Accepted Authorsページには2026年2月13日、3月6日、3月20日のfull paper締切があるため、現時点では投稿受付中ではなく、採択者向け原稿フローまで進んだサイクルとして整理します。

Technical Digestは年次導線と実例を分ける

公式Digestsページには年次アーカイブ導線があり、2025 Digestではセッション別のabstract / paper導線を確認できます。2026年の表示内容を過年度から保証せず、current cycleのAuthor KitとDigests導線を分けて案内します。

deadlines

投稿・採択イベント

締切日付は未取得です。募集要項ページで最新サイクルを確認してください。

sources

公式確認リンク

回答待ち 更新中 公開Q&A

このページの質問窓口

AIに疑問を送る

「匿名で送信する」を押して内容を送ると、受付ID付きの回答URLを発行します。URLでは進捗を追うことができ、通常は1日以内に回答します。個人情報を取り除いて編集した質問と回答だけを、承認済み資料の出典リンクとともに公開Q&A一覧へ掲載します。

通常、1日以内に回答します 回答待ち 更新中

  1. 匿名で送る 分かりにくい箇所、指摘、追加してほしい内容を書きます。
  2. 受付IDと回答URLを保存する 送信後に発行されるURLへ、進捗が順次反映されます。
  3. 進捗と回答を追う URLには、受付済み、回答作成中、解決済みの状態と回答が載ります。
公開Q&A一覧へ 5〜4,000文字。氏名・連絡先などの個人情報、秘密情報は入力禁止です。

このフォームは匿名です。氏名・連絡先・応募情報などの個人情報、秘密情報、社外秘情報、契約情報、非公開資料の入力は禁止です。投稿原文は運営用DBに保存し、公開面には、個人情報・秘密情報・危険な命令を除く安全審査と読みやすい文章への編集を経た質問文と回答だけを載せます。状態は「受付済み」「回答作成中」「解決済み」の3段階です。安全審査の結果によっては公開を保留します。サイト側の機械検査を通った内容だけを運営側のAI回答作成環境へ送り、回答案の作成と、それとは独立したAI審査に使います。機械検査には見落としの可能性があり、回答作成と審査の履歴は利用中の環境に保持されます。IPアドレスや端末情報は送信対象外です。回答URLは公開Q&A用で、共有先からも開けます。送信により、この利用条件と審査後のQ&A公開に同意したものとします。