conference research / Tier a

EPEPS学会研究

Electronic packaging and systems electrical performance, signal integrity, power integrity, thermal integrity, high-speed interconnects, SerDes, DDR and memory interfaces, RF/wireless/quantum system interconnects, advanced packaging, 3D integration, heterogeneous integration, chiplet interfaces, co-packaged optics, package/PCB design, modeling, simulation, measurement, CAD, and ML/AI-assisted interconnect and packaging workflows.

IEEE Conference on Electrical Performance of Electronic Packaging and Systemsは、実装 / 先端パッケージ / 3D integrationの観点から EPEPS, IEEE EPS, IEEE MTT-S, IEEE APS, electrical performance of electronic packaging and systems, signal integrity, power integrity, thermal integrity, package design, high-speed interconnects, HBM, chiplets, UCIe, co-packaged optics, 3D integration, heterogeneous integration, Intel, IBM, Samsung Electronics, Nvidia, Texas Instruments, Keysight, Xpeedic, Siemens EDA, Cadence, Synopsys, and official first-listed EasyChair program affiliation rows を確認するための学会です。公式ページ、募集要項、program、proceedings を分けて確認し、研究室DBや求人DBの分類軸へ接続します。