conference research / Tier a

EuroSimE学会研究

Thermal, mechanical, and multiphysics simulation and experiments for microelectronics, microsystems, packaging, and reliability.

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystemsは、実装 / 先端パッケージ / 3D integrationの観点から thermal management, warpage, mechanical reliability, multiphysics, microelectronics packaging, NXP, imec, Bosch, Infineon, STMicroelectronics, ASML を確認するための学会です。公式ページ、募集要項、program、proceedings を分けて確認し、研究室DBや求人DBの分類軸へ接続します。