2026-08-07
ICDCM Tier B
要旨締切 / 11日後
ロジック / デバイス / プロセス統合
要旨締切 2026-08-07 11日後
半導体学会・締切DB
このページは、半導体の主要学会を conference master、yearly edition、deadline events へ分けていくためのDBです。
どの学会があるか、今どのサイクルを確認するか、投稿・採択・会期の関連日付をどの公式ページで確認するか を 1 か所に集めています。
回路・EDA から photomask、thermal、EOS / ESD まで、あとで年次テーブルへ分割できる広さを確保しています。
投稿先候補の優先確認順や分野別のTierを先に比較する場合は、半導体系学会Tierマップ から入ると、締切DBで確認する対象を絞れます。
Semiconductor conference intelligence
主要半導体学会一覧
主要学会のTier、開催サイクル、募集要項、要旨締切、次に見るページをまとめたDBです。 直近90日の初回締切、分野、公式source-backedスポンサー/出展組織を確認できます。
237 主要学会
6 分野
35 開催国・地域
132 監視中サイクル
12 90日内初回締切
Upcoming first deadlines
直近90日の初回締切カード
基準日: 2026-07-27 JST
2026-08-07
IEEE ICM Tier B
論文締切 / 11日後
回路 / システム / 設計自動化
論文締切 2026-08-07 11日後
2026-08-07
SISC Tier B
要旨締切 / 11日後
ロジック / デバイス / プロセス統合
要旨締切 2026-08-07 11日後
2026-08-14
APEC Tier B
予稿締切 / 18日後
パワー半導体 / Wide-Bandgap
予稿締切 2026-08-14 18日後
2026-08-15
REPP Tier B
要旨締切 / 19日後
実装 / 先端パッケージ / 3D integration
要旨締切 2026-08-15 19日後
2026-08-21
EDAPS Tier B
要旨締切 / 25日後
実装 / 先端パッケージ / 3D integration
要旨締切 2026-08-21 25日後
2026-09-09
ISSCC Tier SS
論文締切 / 44日後
回路 / システム / 設計自動化
論文締切 2026-09-09 44日後
2026-09-13
DATE Tier S
要旨締切 / 48日後
回路 / システム / 設計自動化
要旨締切 2026-09-13 48日後
2026-09-17
ISQED Tier A
論文締切 / 52日後
回路 / システム / 設計自動化
論文締切 2026-09-17 52日後
2026-09-20
IUS Tier B
最終原稿締切 / 55日後
ロジック / デバイス / プロセス統合
最終原稿締切 2026-09-20 55日後
2026-10-05
SEMI-THERM Tier A
要旨締切 / 70日後
実装 / 先端パッケージ / 3D integration
要旨締切 2026-10-05 70日後
2026-10-12
IRPS Tier S
要旨締切 / 77日後
Memory / Reliability / Failure Physics
要旨締切 2026-10-12 77日後
表示件数: 237 会期が近い順で表示
| 学会 | 開催サイクル | 募集要項 | 関連日付 | 確認ポイント |
|---|---|---|---|---|
| DAC Design Automation Conference回路 / システム / 設計自動化 ACM / IEEE CEDA | 会期終了 2026-07-29 2日後 2026-07-26〜29 / Long Beach Convention Center, Long Beach, California, US Long Beach Convention Center / Long Beach, United States | research abstract + manuscript + poster presentation 研究論文だけでなく engineering track や pavilion もあり、設計ツールと実装現場の変化を同時に観測できる。 | | EDA、AI for chip design、chiplet、low power、cloud design、system-level co-design を大規模コミュニティで追える。 監視テーマ: EDA, AI for chip design, chiplet, low power, system design, cloud, verification |
| FMS Future of Memory and StorageMemory / Reliability / Failure Physics FMS / Terrapinn | 会期開始 2026-08-04 8日後 2026-08-04〜06 / Santa Clara Convention Center, Santa Clara, California, US Santa Clara Convention Center / Santa Clara, United States | call for presentations / industry program 学術査読中心ではないが、memory product、controller、storage system の産業シグナルを抽出するための補助線になる。 | | DRAM、NAND、storage-class memory、controller、AI memory system、enterprise storage を産業側から確認する。 監視テーマ: DRAM, NAND, HBM, memory controller, SSD, AI memory, storage systems |
| ICEPT International Conference on Electronic Packaging Technology実装 / 先端パッケージ / 3D integration Institute of Microelectronics, Chinese Academy of Sciences / Xi’an Jiaotong University / IEEE EPS / CIE-EMPT | 会期開始 2026-08-05 9日後 2026-08-05〜07 / Wyndham Grand Xian South, Xi'an, China Wyndham Grand Xian South / Xi'an, China | abstract + full paper 中国の packaging / assembly エコシステムに近い会議で、実装拠点のテーマ分布を把握しやすい。 | | packaging design、manufacturing technologies、photonics、MEMS、system integrated packaging を広く対象にする。 監視テーマ: system integration, manufacturing technologies, photonics, MEMS, packaging design |
| ISLPED IEEE/ACM International Symposium on Low Power Electronics and Design回路 / システム / 設計自動化 IEEE / ACM | 会期開始 2026-08-05 9日後 2026-08-05〜07 / Northwestern University, Evanston, Illinois, USA Northwestern University / Evanston, Illinois, United States | Official ISLPED 2026 pages list abstract submission, full-paper deadline, invited talk/panel/tutorial proposals, acceptance notification, and camera-ready paper deadline. Official ISLPED 2026 home lists August 5-7, 2026 at Northwestern University, abstract deadline extended to 2026-03-11, full paper deadline extended to 2026-03-18, acceptance notification 2026-05-18, and camera-ready paper 2026-06-15. | | low-power electronics, circuits, architecture, EDA, embedded AI, compute-in-memory, security, energy-efficient systemsを横断して確認できる。 監視テーマ: low-power electronics, energy-efficient circuits, EDA, embedded AI accelerators, compute-in-memory, security primitives, neuromorphic and GenAI circuit design |
| IEEE MWSCAS IEEE International Midwest Symposium on Circuits and Systems回路 / システム / 設計自動化 IEEE Circuits and Systems Society / MWSCAS 2026 Organizing Committee | 会期開始 2026-08-09 13日後 2026-08-09〜12 / Cincinnati, Ohio, United States Hilton Cincinnati Netherland Plaza / Cincinnati, United States | IEEE conference paper / peer-reviewed oral and poster sessions / accepted papers in IEEE Xplore 公式current-cycle keynote pageは5名のspeakerと所属を確認できる。accepted paperのfirst-listed author affiliationを安全に対応付けられるrosterは公開sourceから確認できないため、著者所属censusや国・地域を推測しない。 | | circuits and systems、analog / mixed-signal、wireless、biomedical circuits、AI and edge、digital IC / VLSI、neuromorphic、power、beyond-CMOSを横断して確認できる。 監視テーマ: analog and mixed-signal, digital IC and VLSI, AI and edge, neuromorphic circuits, biomedical circuits, beyond-CMOS |
| ICPS International Conference on the Physics of Semiconductorsロジック / デバイス / プロセス統合 ICPS 2026 Organizing Committee / JSAP / IEICE | 会期開始 2026-08-16 20日後 2026-08-16〜21 / Keio Plaza Hotel, Shinjuku, Tokyo, Japan Keio Plaza Hotel, Shinjuku, Tokyo / Tokyo, Japan | short abstract + one-page abstract PDF / oral or poster presentation selected by Program Committee 公式Abstract Submissionは一ページabstract PDF、plain text short abstract、oral/posterはProgram Committeeが決定、締切は2026-03-29 23:59 PDTへ延長済みと案内。 | | semiconductor physics 全般を対象にする国際会議で、transport、optical、magnetic、low-dimensional systems、quantum devices、wide-bandgap、2D materials を横断して追える。 監視テーマ: semiconductor physics, quantum devices, low-dimensional systems, wide-bandgap, 2D materials, spintronics, optoelectronics |
| Hot Chips Hot Chips: A Symposium on High Performance Chips回路 / システム / 設計自動化 Hot Chips Committee | 会期開始 2026-08-23 27日後 2026-08-23〜25 / Memorial Auditorium, Stanford, Palo Alto, California, US Memorial Auditorium, Stanford / Palo Alto, United States | 2-page extended abstract or poster summary; Program Committee evaluation; no mandatory written paper 2026 CFPはpresentation / poster、2-page extended abstract、Program Committee評価、slides/postersのproceedings掲載を示す。written paper必須ではないため査読付き論文会議とは分けるが、高性能チップのサブ分野トップ級シンポジウムとしてAに上げる。 | | 高性能マイクロプロセッサと関連ICを主題にする公式leading conferenceとして、CPU、GPU、AI accelerator、memory、networking/interconnect、packaging、I/O、system software を製品発表に近い温度感で確認する。 監視テーマ: AI accelerators, CPUs, GPUs, memory, packaging, sustainable computing, optics |
| SPIE Optics+Photonics SPIE Optics+Photonicsロジック / デバイス / プロセス統合 SPIE | 最終原稿締切 2026-08-05 9日後 2026-08-23〜2026-08-27 / San Diego, California, US San Diego, California, US / San Diego, United States | Official SPIE Optics+Photonics abstract guidelines request author information, an abstract for technical review of 200-300 words, a 50-150 word program summary, and manuscript / poster PDF workflows for SPIE Digital Library publication. Official SPIE Optics+Photonics pages list the OP26 San Diego cycle on 23-27 August 2026. The official abstract guidelines list abstract submission deadline 2026-04-27, authors notified and program posting on 2026-05-04, manuscript/poster PDF system opening on 2026-06-22, poster PDFs due on 2026-07-29, and manuscripts due on 2026-08-05. | | Optics, photonics, nanoscience, optical engineering, organic photonics/electronics, remote sensing, photonic computing, displays, sensors, and optics/photonics exhibitor signalsを確認できる。 監視テーマ: photonic computing, nanophotonics, optical engineering, organic electronics, sensors, remote sensing, optical metrology, exhibitors |
| KJF-ICOMEP KJF International Conference on Organic Materials for Electronics and Photonicsロジック / デバイス / プロセス統合 KJF-ICOMEP Organizing Committee / The Polymer Society of Korea | 会期開始 2026-08-25 29日後 2026-08-25 to 28 / Hanwha Resorts Haeundae, Busan, Republic of Korea Hanwha Resorts Haeundae / Busan, South Korea | Official KJF-ICOMEP 2026 site lists abstract submission and an abstract template; official KJF-ICOMEP 2025 source pages provide oral/poster program PDFs used for accepted-presentation affiliation signals. Official KJF-ICOMEP 2026 page shows abstract submission through 2026-06-30, early registration/payment through 2026-07-31, and the 2026 Busan conference on 2026-08-25 to 2026-08-28. | | Organic and hybrid materials for electronics and photonics, including OLED materials/devices, organic transistors, memory devices, photovoltaics, molecular photonics, electrochromics, sensors, and bioelectronics. 監視テーマ: OLED materials, organic transistors, organic photovoltaics, perovskites, molecular photonics, electrochromics, bioelectronics, sensors, organic memory |
| ICDCM International Conference on Diamond and Carbon Materialsロジック / デバイス / プロセス統合 Elsevier / International Conference on Diamond and Carbon Materials organising committee | 要旨締切 2026-08-07 11日後 2026-08-30〜2026-09-03 / Kursaal Congress Centre-Auditorium, Donostia - San Sebastian, Spain Kursaal Congress Centre-Auditorium / Donostia - San Sebastian, Spain | Official ICDCM 2026 pages list talk and poster abstract submission, author notification on 2026-05-08, poster abstract submission open until 2026-08-07, and a conference app for presentation records. Official home and participate pages identify ICDCM 2026 as the 36th International Conference on Diamond and Carbon Materials in Donostia - San Sebastian, with posters accepted until 2026-08-07 and topics including diamond devices for power electronics, optoelectronics, sensors, quantum applications, and AI-guided carbon materials. | | diamond、carbon nanotubes、graphene、carbon nitrides、MXenes、boron nitride、diamond devices、power electronics、optoelectronics、sensors、quantum applications、thermal management、carbon-materials manufacturingを確認できる。 監視テーマ: diamond devices, power electronics, optoelectronics, sensors, quantum color centers, carbon nanotubes, graphene, MXenes, CVD diamond substrates, plasma/CVD equipment, thermal management |
| SPSJ Polymer Discussion 高分子討論会 / SPSJ Polymer Discussion Meetingロジック / デバイス / プロセス統合 The Society of Polymer Science, Japan | 会期開始 2026-09-02 37日後 2026-09-02 to 2026-09-04 / Tokyo University of Science Katsushika Campus, Tokyo, Japan Tokyo University of Science, Katsushika Campus / Katsushika, Tokyo, Japan | Official 第75回 guidance identifies research-presentation application and abstract manuscript posting workflows, oral/poster schedule PDFs, and current-cycle committee/exhibition pages. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals; completed-cycle full program PDFs are used for first-listed affiliation rows because current final affiliation lists are not yet public. Official SPSJ sources identify the September 2-4, 2026 Tokyo University of Science Katsushika cycle, May 27, 2026 research-presentation application deadline, July 8, 2026 abstract manuscript posting deadline, current operation committee, public schedule PDFs, exhibition/career-cafe portal, and official completed-cycle product/career-cafe exhibitor lists linked from the current portal. | | Polymer science and materials research covering polymer synthesis, polymer structure/physics, polymer functions, bio-related polymers, environmental polymers, organic semiconductor and optoelectronic materials, next-generation electronics packaging materials, high-performance polymer materials, photoresist and lithography-adjacent materials, analysis/measurement, and industry-academia communication. Relevant to semiconductor process materials, packaging, photonics, organic electronics, device materials, and manufacturing support technologies. 監視テーマ: SPSJ Polymer Discussion Meeting, 高分子討論会, next-generation electronics packaging polymer materials, organic semiconductor polymers, photoresist materials, optochemistry, polymer characterization, industry-academia communication session, product exhibitors, career cafe exhibitors, Mitsubishi Chemical, AGC, Mitsui Chemicals, Resonac, NEC, Bridgestone, Teijin, Toray, UBE, JSR, DIC, Asahi Kasei, SCREEN, and official completed-cycle first-listed affiliation rows |
| ASC Applied Superconductivity Conferenceロジック / デバイス / プロセス統合 Applied Superconductivity Educational Foundation / IEEE Council on Superconductivity / ASC 2026 Organizing Committee | 会期開始 2026-09-06 41日後 2026-09-06〜2026-09-11 / David L. Lawrence Convention Center, Pittsburgh, Pennsylvania, United States David L. Lawrence Convention Center / Pittsburgh, United States | Official ASC 2026 author page lists oral/poster abstracts, Program Committee assignment of presentation format, in-person presentation, optional manuscript submission, and manuscript peer-review consideration only for presented abstracts. Official ASC 2026 important dates list abstract submission opening on 2025-12-10, extended abstract deadline on 2026-02-02, abstract acceptance email on 2026-03-16, ASC 2026 on 2026-09-06 to 2026-09-11, and manuscript submission deadline on 2026-09-30. | | superconducting electronics、quantum systems、SQUIDs、detectors、digital logic、superconducting magnets、fusion magnets、coated conductors、cryogenic systems、large-scale applicationsを確認できる。 監視テーマ: superconducting electronics, quantum systems, digital logic, SQUIDs, superconducting detectors, superconducting magnets, fusion magnets, REBCO, cryogenics, exhibitors |
| ISE Annual Annual Meeting of the International Society of Electrochemistryロジック / デバイス / プロセス統合 International Society of Electrochemistry / 77th Annual Meeting Organizing Committee | 会期開始 2026-09-06 41日後 2026-09-06 to 2026-09-11 / International Convention Centre Sydney, Sydney, Australia International Convention Centre Sydney / Sydney, Australia | Official 77th ISE Annual Meeting page identifies abstract submission, abstract submission deadline, registration deadline for the inclusion of presentations, and presentation guide context. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 77th ISE Annual Meeting source identifies the September 6-11, 2026 Sydney cycle, December 1, 2025 abstract submission opening, March 28, 2026 abstract submission deadline, June 18, 2026 registration deadline for the inclusion of presentations, organizing committee rows, official symposium organizer affiliation rows, and exhibitor/sponsor listing rows. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Electrochemical materials, electroanalytical chemistry, electrocatalysis, batteries, fuel cells, corrosion, single-entity electrochemistry, scanning probe electrochemical microscopy, energy, ammonia synthesis, hydrogen generation, electrochemiluminescence, photoelectrocatalysis, mineral electrochemistry, ionic liquids, solar cells, microbial electrochemical systems, point-of-care electrochemistry, devices, manufacturing, and wearables. 監視テーマ: ISE Annual Meeting, International Society of Electrochemistry, electrochemistry, electrocatalysis, batteries, fuel cells, corrosion, electrochemical sensors, solar cells, devices, manufacturing, Sydney, Deakin University, Osaka University, Tokyo University of Science, Waseda University, Metrohm, PalmSens, Zahner-Elektrik, Hiden Analytical, Admiral Instruments, Pine Research, and official 77th ISE symposium organizer affiliation rows |
| ESSERC IEEE European Solid-State Electronics Research Conference回路 / システム / 設計自動化 IEEE EDS / SSCS / CAS | 会期開始 2026-09-07 42日後 2026-09-07〜10 / Auditorium Palma de Mallorca, Palma de Mallorca, Spain Auditorium Palma de Mallorca / Palma de Mallorca, Spain | paper submission、IEEE Xplore compliant final PDF 旧 ESSDERC-ESSCIRC 系列を引き継ぎ、technology と circuits をまたぐ joint track を持つのが特徴です。 | | technology、circuit、joint track を同じ場で扱い、欧州での devices-to-circuits 接続を比較しやすい会議です。 監視テーマ: process and materials、power / RF devices、AI / ML architectures、wireline / optical、sensors |
| JSAP Spring / Autumn The Japan Society of Applied Physics Spring / Autumn Meetingロジック / デバイス / プロセス統合 The Japan Society of Applied Physics | 会期開始 2026-09-08 43日後 2026-09-08〜11 / Hokkaido University Sapporo Campus + online Hokkaido University Sapporo Campus / online / Sapporo, Japan | 査読なし / 予稿投稿型 / no full peer-reviewed paper 国内主要学会の本体大会として、査読なしの予稿投稿型発表を、査読付き国際会議論文とは別枠に分類する。 | | 応用物理、半導体、薄膜、結晶、フォトニクス、スピントロニクス、パワーデバイスなど国内研究発表を広く確認する。 監視テーマ: semiconductor, applied physics, thin films, photonics, power devices, domestic research |
| SPIE Photomask/EUV SPIE Photomask Technology + Extreme Ultraviolet Lithography露光 / パターニング / 配線 / 量産 SPIE / BACUS Technical Group | 会期開始 2026-09-08 43日後 2026-09-08〜11 / Monterey, California, US Monterey, California / Monterey, United States | abstract submission + SPIE proceedings manuscript Photomask/EUV は ALP より mask に絞り、EUV mask の検査・修復・計測と mask supply chain を深く確認できる。 | | photomask、EUV mask、metrology、inspection/repair、mask business、emerging technologies を mask 専門で追う SPIE 会議。 監視テーマ: photomask, EUV mask, inspection, repair, metrology, mask business, BACUS |
| ESTC IEEE Electronics System-Integration Technology Conference実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society / IMAPS Europe | 会期開始 2026-09-09 44日後 2026-09-09〜11 / Finlandia Hall, Helsinki, Finland Finlandia Hall / Helsinki, Finland | abstract + 5-8 page full paper ECTC / EPTC と並ぶ地域 flagship の一つで、欧州の実装・組立・信頼性テーマの比重がつかみやすい。 | | assembly、interconnection、system-integration、advanced packaging、design optimization を欧州の実装・組立文脈で追える。 監視テーマ: system integration, assembly, interconnection, reliability, design optimization |
| JLCC 日本液晶学会討論会 / Japanese Liquid Crystal Conferenceロジック / デバイス / プロセス統合 Japanese Liquid Crystal Society | 会期開始 2026-09-10 45日後 2026-09-10 to 2026-09-12 / Rembrandt Hotel Oita, Oita, Japan Rembrandt Hotel Oita / Oita, Japan | Official 2026 application guidance identifies presentation application, abstract upload, application/abstract windows, and a current-cycle program page scheduled for mid-August. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 2026 sources identify the September 10-12, 2026 Rembrandt Hotel Oita cycle, June 1-22 presentation-application period, June 1-July 24 abstract upload period, program-detail publication planned for mid-August, current-cycle exchange-session speaker rows, 2025 local organizing committee rows, 2025 public program PDF code rows, support/cooperation rows, official ad links, and the past-meeting archive. | | Liquid crystal and soft-matter research spanning display materials, ferroelectric and nematic phases, polymer/liquid-crystal systems, optical modulation, photonics, sensors, device physics, synthesis, characterization, and industry-academic applied materials sessions. 監視テーマ: 日本液晶学会討論会, Japanese Liquid Crystal Conference, liquid crystals, display materials, photonics, optical modulation, ferroelectric nematic liquid crystals, JNC Petrochemical, Sharp, SCINES, OOC, AIST, RIKEN, Jožef Stefan Institute, Kyoto University, Osaka University, and official first-listed program affiliation rows |
| E-MRS Fall E-MRS Fall Meeting & Exhibitロジック / デバイス / プロセス統合 European Materials Research Society (E-MRS) / Warsaw University of Technology | 会期開始 2026-09-14 49日後 2026-09-14〜17 / Main Campus and Main Building of Warsaw University of Technology, Warsaw, Poland Main Campus / Main Building of Warsaw University of Technology / Warsaw, Poland | Official practical information says submitted abstracts are reviewed by each symposium scientific committee, with acceptance and presentation mode notified by July 15, 2026. Official E-MRS 2026 Fall pages list the September 14-17 Warsaw meeting, 25 parallel symposia, confirmed invited speakers on symposium pages, abstract deadline June 9, 2026, and exhibit/sponsorship listing rows. | | wide bandgap semiconductors、nanocarbon materials、optoelectronic devices、ferroelectric and dielectric materials、perovskites、nitride materials、biointerfaces、nanocomposites、advanced characterizationを横断して確認できます。 監視テーマ: wide bandgap semiconductors, nanocarbon devices, optoelectronics, ferroelectric devices, perovskites, nitrides, biomaterials, nanocomposites, advanced X-ray characterization, exhibitors |
| JPS Annual Meeting 日本物理学会年次大会 / The Physical Society of Japan Annual Meetingロジック / デバイス / プロセス統合 The Physical Society of Japan | 最終原稿締切 2026-08-12 16日後 2026-09-14 to 2026-09-17 / The University of Tokyo Komaba Campus, Tokyo, Japan The University of Tokyo Komaba Campus / Tokyo, Japan | Official JPS Annual Meeting sources identify a general presentation application deadline, proceedings manuscript deadline, public program/proceedings web timing, and in-person annual meeting format. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official JPS 2026 Annual sources identify the September 14-17, 2026 University of Tokyo Komaba cycle and 2026 application/proceedings deadlines. Because the 2026 program was not yet public on this verification date, source-backed organization signals use the latest completed 2025 Annual Area 4 public program, 2025 front-matter committee rows, and JPS Expo Annual 2025 official exhibitor PDF. | | Semiconductor physics, mesoscopic systems, quantum transport, two-dimensional materials, superconducting and topological devices, quantum dots, graphene, optical/electronic properties, and condensed-matter device research presented through the Physical Society of Japan annual meeting Area 4 program. 監視テーマ: JPS Annual Meeting, Area 4 semiconductor, mesoscopic systems, quantum transport, first-listed affiliation organization mix, NTT Basic Research Laboratories, JX Advanced Metals, JPS Expo Annual exhibitor rows, and official JPS annual program/proceedings web |
| SSDM International Conference on Solid State Devices and Materialsロジック / デバイス / プロセス統合 The Japan Society of Applied Physics | 会期開始 2026-09-14 49日後 2026-09-14〜17 / Dejima Messe Nagasaki, Nagasaki, Japan Dejima Messe Nagasaki / Nagasaki, Japan | regular paper abstract submission regular paper submission が早めに開くので、日本の材料・デバイス系テーマを確認する定点として有効です。 | | 材料、device、process を広く対象にする会議で、日本発の材料・構造テーマと企業講演が同じ program に並びます。 監視テーマ: solid-state device、materials、new functional devices、special topic sessions |
| THERMINIC International Workshop on Thermal Investigations of ICs and Systems実装 / 先端パッケージ / 3D integration THERMINIC Steering Committee | 最終原稿締切 2026-08-03 7日後 2026-09-16 to 2026-09-18 / Berlin, Germany NYX Hotel Berlin Köpenick / Berlin, Germany | Official CFP states double-blind abstract review and a workshop-proceedings paper. Graph data is hydrated only from PostgreSQL. Official sources identify April 15 abstract, June 8 acceptance, August 3 proceedings-paper, and September 16-18 workshop dates. | | Thermal and reliability investigations for ICs, power electronics, packaging, measurement, modeling, and cooling systems. 監視テーマ: thermal modeling, thermal metrology, power electronics, reliability, advanced cooling, NXP, Huawei, ASML, Siemens, Infineon, STMicroelectronics, ams OSRAM |
| ESREF European Symposium on Reliability of Electron Devices, Failure Physics and AnalysisMemory / Reliability / Failure Physics TU Wien / ESREF Committee | 会期開始 2026-09-20 55日後 2026-09-20〜24 / Vienna, Austria Vienna, Austria / Vienna, Austria | paper submission + notification + conference presentation 欧州の reliability / FA の定番会議で、device reliability と解析技術の両方を同じ場で比較できる。 | | reliability assessment、nanoelectronics、failure analysis、power device reliability、photonics、MEMS reliability を横断できる。 監視テーマ: reliability assessment, failure physics, power devices, photonics, MEMS, analysis |
| WiPDA-Europe IEEE Workshop on Wide Bandgap Power Devices and Applications in Europeパワー半導体 / Wide-Bandgap IEEE / Aalborg University | 論文締切 2026-08-01 5日後 2026-09-20〜22 / AAU Innovate, Aalborg University, Aalborg, Denmark AAU Innovate, Aalborg University / Aalborg, Denmark | 2-4 page single-column digest without author names + final IEEE paper CFPは2〜4ページdigest、double-blind peer review、accepted by IEEE後のIEEE Xplore収録を案内している。device scientist と application engineer が混ざるため、材料・デバイス側の進展がどの用途に乗るかを追跡しやすい。 | | SiC、GaN、ultra-wide-bandgap、packaging power modules、converters、renewables、transport applications を横断できる。 監視テーマ: SiC, GaN, UWBG, power modules, converters, renewables, transport |
| MNE International Conference on Micro and Nano Engineering露光 / パターニング / 配線 / 量産 International Micro and Nano Engineering Society / Swiss MNT Network | 会期開始 2026-09-21 56日後 2026-09-21〜24 / Congress Kursaal Interlaken, Interlaken, Switzerland Congress Kursaal Interlaken / Interlaken, Switzerland | 2-page abstract submission via Ex Ordo; International Program Committee review 1975年開始のmajor annual international conferenceで、2026年は第52回、600-700人規模見込み。EIPBN/MNCを補完するmicro/nano engineering主要会議に分類する。 | | micro/nano fabrication、manufacturing、micro/nano structures and devices、electronics、photonics、electromechanicsを欧州軸で確認する。 監視テーマ: micro/nano fabrication, nanostructures, devices, lithography, MEMS, photonics, process tools |
| ICSCRM International Conference on Silicon Carbide and Related Materialsパワー半導体 / Wide-Bandgap ICSCRM 2026 Committee | Late News締切 2026-08-17 21日後 2026-09-27〜2026-10-02 / Pacifico Yokohama North, Yokohama, Japan Pacifico Yokohama North / Yokohama, Japan | regular abstract + late news abstract + proceedings 公式Important Daysではregular abstract deadlineが2026年5月18日へ延長、acceptance notificationが2026年7月6日、late news abstract deadlineが2026年8月17日と案内されている。 | | SiC と related materials に特化しており、substrate、epitaxy、defect、device、module を材料起点で追えます。 監視テーマ: SiC substrate、epitaxy、defect、device、module、related materials |
| SCES International Conference on Strongly Correlated Electron Systemsロジック / デバイス / プロセス統合 SCES 2026 Organizing Committee / The Physical Society of Japan | 最終原稿締切 2026-09-20 55日後 2026-09-27〜10-02 / Toyama International Conference Center, Toyama, Japan Toyama International Conference Center / Toyama, Japan | online abstract submission; oral/poster preference considered; final program determined by Program Committee. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official SCES 2026 sources identify the September 27-October 2, 2026 Toyama cycle, May 14 abstract-submission deadline, June 25 acceptance notification, June 15 Program page announcement, current committee pages, speaker affiliations, sponsor listings, and sponsorship prospectus context. | | strongly correlated electron systems、quantum materials、topological materials、two-dimensional materials、superconductivity、magnetism、spectroscopy、device and application-adjacent condensed-matter researchを対象にする国際会議。 監視テーマ: SCES, strongly correlated electron systems, quantum materials, topological materials, two-dimensional materials, superconductivity, RIKEN, Stanford, MPI, University of Tokyo, Springer Nature, CROSS |
| EOS/ESD Symposium EOS/ESD Symposium and ExhibitsMemory / Reliability / Failure Physics EOS/ESD Association, Inc. | 会期開始 2026-09-28 63日後 2026-09-28〜30 / Embassy Suites by Hilton Dallas Frisco Hotel & Convention Center, Frisco, Texas, US Embassy Suites by Hilton Dallas Frisco Hotel & Convention Center / Frisco, United States | 2-4 page abstract + 6-10 page final manuscript 先端ノードや 3D 実装で難しくなる ESD / EOS を正面から見るため、reliability と design rule の接点を抽出できる。 | | EOS / ESD、backside power、2.5D / 3D stacking、WBG ESD、package handling、manufacturing control を failure prevention 側から追える。 監視テーマ: EOS, ESD, backside power, 2.5D/3D stacking, WBG ESD, package handling, manufacturing control |
| IMAPS Symposium International Symposium on Microelectronics実装 / 先端パッケージ / 3D integration IMAPS | 会期開始 2026-09-28 63日後 2026-09-28〜10-01 / Encore Boston Harbor, Boston, Massachusetts, US Encore Boston Harbor / Boston, United States | abstract + peer-reviewed draft / final paper IMAPS 系は assembly と materials 側の実務温度が高く、ECTC より supply chain 寄りの論点を抽出できる。 | | heterogeneous integration、bonding、materials、RF / MW、MEMS / sensors、metrology、AI-enabled design を packaging supply chain 全体で追える。 監視テーマ: heterogeneous integration, bonding, thermal materials, MEMS/sensors, metrology, AI-enabled design, reliability |
| IWJT International Workshop on Junction Technologyロジック / デバイス / プロセス統合 CEA-Leti / IWJT Committee | 会期開始 2026-09-28 63日後 2026-09-28〜29 / Grenoble, France Grenoble, France / Grenoble, France | abstract submission + oral/poster presentation junction 技術に絞っているため、source/drain や contact 前後のドーピング課題を会議単位で比較しやすい。 | | junction formation、implantation、anneal、activation、defect、ultra-shallow junction の論点を集中的に追える。 監視テーマ: junction formation, implantation, anneal, activation, defects, ultra-shallow junction |
| RADECS RADiation and its Effects on Components and Systems ConferenceMemory / Reliability / Failure Physics RADECS Association / local organizing committee | 会期開始 2026-09-28 63日後 2026-09-28〜2026-10-02 / Prague, Czech Republic Czech Technical University in Prague / Prague, Czech Republic | Official RADECS 2025 call used a four-page short paper; the Technical Committee assigns final presentation category, and IEEE Transactions on Nuclear Science submission follows a separate full peer-review process. RADECS 2026 official home lists the September 28 to October 2, 2026 Prague conference. Source review uses the official 2025 call, committee, program PDF, sponsors, exhibitors, and RADECS Association history until 2026 CFP/program details are published. | | radiation effects in electronic components, integrated circuits, photonics, sensors, systems, and space electronics reliabilityを欧州RADECS communityで確認できる。 監視テーマ: single-event effects, total ionizing dose, displacement damage, radiation-hardened electronics, space electronics, component reliability |
| SISPAD International Conference on Simulation of Semiconductor Processes and Devicesロジック / デバイス / プロセス統合 The Japan Society of Applied Physics / IEEE Electron Devices Society | 会期開始 2026-09-28 63日後 2026-09-28〜30 / Kumamoto-Jo Hall, Kumamoto, Japan Kumamoto-Jo Hall / Kumamoto, Japan | abstract submission + final paper TCAD と実デバイスの接点を主題にするので、GAA や新材料のモデル成熟度を conference 単位で比較しやすい。 | | TCAD、process simulation、device modeling、compact model、interconnect / lithography modeling をまとめて追える。 監視テーマ: TCAD, GAA, quantum transport, reliability modeling, process/device/circuit co-simulation |
| DFTS IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology SystemsMemory / Reliability / Failure Physics IEEE / IEEE Computer Society / TTTC | 会期開始 2026-09-30 65日後 2026-09-30〜10-02 / Rome, Italy Rome, Italy / Rome, Italy | regular paper / special session submission 欠陥・故障を設計、製造、信頼性、security にまたがって見るため、IRPS/VTS/ITC の間を埋める学会タグになる。 | | defect、fault tolerance、yield analysis、DFT、aging、radiation effects、hardware security を VLSI/nanotechnology systems として確認する。 監視テーマ: defect tolerance, yield analysis, DFT, aging, radiation effects, hardware security, RISC-V |
| SOCC IEEE International System-on-Chip Conference回路 / システム / 設計自動化 IEEE Circuits and Systems Society / IEEE SOCC Organizing Committee | 会期開始 2026-09-30 65日後 2026-09-30〜2026-10-02 / Old University of Heidelberg, Heidelberg, Germany Old University of Heidelberg / Heidelberg, Germany | Official SOCC 2026 paper-submission guidelines state a double-blind peer-review process; regular papers are four to six pages including figures and references, and industrial papers are one to two pages. IEEE CASS event page lists SOCC 2026 as the 39th IEEE International System-on-Chip Conference in Heidelberg, with an extended paper deadline of 2026-05-04 and financial sponsorship. The official SOCC page describes a three-day technical program with keynote/plenary talks, oral/poster presentations, panels, tutorials, and industrial talks. | | System-on-Chip、System-in-Package、ASIC、logic and circuit design、process technology、test、design tools、chiplets、security、reliability、power、memory、on/off-chip communicationを確認できる。 監視テーマ: SoC, SiP, ASIC, chiplets, EDA, embedded HPC, AI edge devices, test, security, reliability, memory, on-chip communication |
| SOCC IEEE International System-on-Chip Conference回路 / システム / 設計自動化 IEEE / IEEE Circuits and Systems Society | 会期開始 2026-09-30 65日後 2026-09-30 to 2026-10-02 / Heidelberg, Germany Heidelberg, Germany / Heidelberg, Germany | Regular papers receive double-blind peer review; accepted presented papers are submitted to IEEE Xplore subject to IEEE quality requirements. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official SOCC 2026 CFP identifies the 39th edition in Heidelberg, three technical-program days, industrial talks, organizational sponsors, and double-blind review. Completed SOCC 2025 committee and program sources supply the reviewed affiliation signals. | | SoC and SiP architectures, circuits, systems, design tools, process technology, test, packaging, reliability, and applications. 監視テーマ: SoC, SiP, chiplets, AI accelerators, circuits, design tools, test, packaging, reliability, IEEE, CASS |
| 3DIC IEEE 3D Systems Integration Conference実装 / 先端パッケージ / 3D integration IEEE | 会期開始 2026-10-01 66日後 2026-10-01〜02 / Georgia Institute of Technology, Atlanta, Georgia, US Georgia Tech / Atlanta, United States | paper submission + tutorial 2026公式トップは会期を2026年10月1〜2日、Georgia Institute of Technology開催と案内し、CALL FOR PAPERSは詳細公開待ちとしている。 | | monolithic 3D、3D integration、heterogeneous stack を集中的に確認でき、device と package の境界を比較できる会議です。 監視テーマ: 3D integration、monolithic 3D、heterogeneous integration、stack architecture |
| CODES+ISSS International Conference on Hardware/Software Codesign and System Synthesis回路 / システム / 設計自動化 Embedded Systems Week (ESWEEK) | 会期開始 2026-10-04 69日後 2026-10-04〜09 / Barcelona, Spain Barcelona, Spain / Barcelona, Spain | journal-track full paper + late-breaking technical paper 公式CFPでjournal-integrated publicationとin-person presentation requirementを確認。completed programの著者所属一覧は公開sourceからreview-safeに取得できないため、program affiliation graphは推測しない。 | | system-level design、hardware/software co-design、embedded systems、system-on-chip implementation、EDAを横断して確認できる。 監視テーマ: system-level design, hardware/software co-design, embedded systems, system-on-chip, EDA |
| ECCE IEEE Energy Conversion Congress and Expositionパワー半導体 / Wide-Bandgap IEEE Power Electronics Society / IEEE Industry Applications Society | 会期開始 2026-10-04 69日後 2026-10-04〜08 / Vancouver, British Columbia, Canada Vancouver, British Columbia / Vancouver, Canada | double-blind digest + final IEEE paper device 単体ではなく converter / system / application まで scope が広く、power semiconductor の使われ方を俯瞰しやすい。 | | energy conversion 全体を扱い、power devices、packaging integration、thermal、EMI、AI / digital twin、transport electrification を横断できる。 監視テーマ: power devices, packaging integration, thermal management, EMI, digital twins, transportation electrification, AI |
| IIRW IEEE International Integrated Reliability WorkshopMemory / Reliability / Failure Physics IEEE | 論文締切 2026-09-04 39日後 2026-10-04〜08 / Stanford Sierra Conference Center, South Lake Tahoe, California, US Stanford Sierra Conference Center / South Lake Tahoe, United States | regular abstract + full paper + late news 公式Important DatesでRegular Abstract Deadline 2026年6月14日、Author Notification 2026年7月26日、Full Paper Submission Deadline 2026年9月4日、Late News Deadline 2026年9月13日、Final Paper Submission Deadline 2026年9月21日を確認した。 | | device reliability、memory reliability、package reliability、power electronic reliability、failure analysis を深く追える。 監視テーマ: BTI, TDDB, RTN, memory reliability, package reliability, SiC, GaN |
| ISTFA International Symposium for Testing and Failure AnalysisMemory / Reliability / Failure Physics ASM International | 会期開始 2026-10-04 69日後 2026-10-04〜08 / Henry B. Gonzalez Convention Center, San Antonio, Texas, US Henry B. Gonzalez Convention Center / San Antonio, United States | minimum 2-page abstract + manuscript + presentation review failure analysis の実務色が濃く、device / package / board のどこで不良解析が難しくなっているかを追跡しやすい。 | | device / package fault isolation、materials characterization、3D devices、WBG devices、yield diagnostics、trusted electronics を追える。 監視テーマ: fault isolation, characterization, 3D devices, WBG, yield diagnostics, trusted electronics |
| IUS IEEE International Ultrasonics Symposiumロジック / デバイス / プロセス統合 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society | 最終原稿締切 2026-09-20 55日後 2026-10-04〜08 / Raleigh Convention Center, Raleigh, North Carolina, USA Raleigh Convention Center / Raleigh, United States | official 2026 CFPはabstractをTechnical Program Committeeがoriginality、state-of-the-art contribution、ultrasonics community interestでreview/evaluationすると説明している。 official 2026 homeはIUS 2026を63rd editionとして、2026年10月4〜8日のRaleigh開催、author notification 2026-06-22、publication submission 2026-09-20を案内している。 | | medical ultrasonics、ultrasonic sensors、NDE、physical acoustics、acoustic resonators / filters、MEMS / SAW / FBAR、transducers、transducer materialsを確認できる。 監視テーマ: ultrasound imaging, ultrasonic sensing, NDE, acoustic resonators, RF filters, ScAlN, piezoelectric materials, PMUT / CMUT, transducers |
| EuMIC European Microwave Integrated Circuits Conference回路 / システム / 設計自動化 European Microwave Association (EuMA) / GAAS Association | 会期開始 2026-10-05 70日後 2026-10-05 to 2026-10-06 / London, United Kingdom ExCeL London / London, United Kingdom | EuMIC peer-reviewed papers are published in IEEE Xplore. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official EuMIC 2026 material identifies the London cycle, GAAS Association-sponsored get-together, technical programme committee acknowledgement, IEEE Xplore publication, and current integrated-circuit scope. Completed 2025 programme material supplies the reviewed chair and explicit-speaker affiliation evidence. | | RF and microwave integrated circuits, III-V and silicon technologies, nanotechnologies, wide-bandgap devices, microwave photonics, millimeter-wave, terahertz, and RFIC applications. 監視テーマ: RFIC, III-V, silicon, GaAs, InP, SiGe, GaN, SiC, microwave photonics, mm-wave, terahertz, NXP, Qorvo, Keysight, GAAS Association |
| ADMETA 2026 Advanced Metallization Conference 2026露光 / パターニング / 配線 / 量産 ADMETA Committee | 会期開始 2026-10-07 72日後 2026-10-07〜09 / Takeda Hall, University of Tokyo, Tokyo, Japan Takeda Hall, University of Tokyo / Tokyo, Japan | A4 up to 2-page abstract / oral or poster preference / online conference proceedings 2026公式は東京大学武田ホールでのhybrid開催、A4最大2ページabstract、2026-06-19 (UTC-7)締切、accepted abstractsのonline conference proceedings収録予定を案内。JJAP特集号とregistration詳細は公式ページ上では準備中。 | | advanced interconnect、metallization、BEOL materials、advanced packaging、RDL、hybrid bonding、metrologyを確認する。 監視テーマ: metallization, interconnect, BEOL, low-k, RDL, hybrid bonding, HBM, CPO, packaging integration |
| ASDAM International Conference on Advanced Semiconductor Devices and Microsystemsロジック / デバイス / プロセス統合 Slovak University of Technology in Bratislava / SK Chips | 論文締切 2026-08-14 18日後 2026-10-07 to 2026-10-09 / Radisson Blu Carlton Hotel, Bratislava, Slovakia Radisson Blu Carlton Hotel / Bratislava, Slovakia | The official 2026 source identifies abstract submission and a later full-paper deadline; venue-wide peer-review detail is not yet stated, so the review label remains conservative. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ASDAM 2026 sources identify the 16th edition in Bratislava, abstract review, an August 14 full-paper deadline, committee affiliations, and ten named invited speakers with affiliations. | | Advanced semiconductor devices, wide-bandgap materials, microsystems, III-V, nitrides, oxides, diamond, power and microwave devices, characterization, reliability, MEMS, photonics, and microelectronics. 監視テーマ: wide-bandgap, GaN, gallium oxide, III-V, devices, microsystems, MEMS, reliability, power electronics, photonics |
| BCICTS IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium回路 / システム / 設計自動化 IEEE Electron Devices Society / IEEE Solid-State Circuits Society / IEEE Microwave Theory and Technology Society | 最終原稿締切 2026-09-09 44日後 2026-10-11〜14 / Westin Copley Place Boston, MA, USA Westin Copley Place Boston / Boston, United States | Authors submit an abstract of up to 4 pages; papers are selected on the basis of the abstract and accepted authors submit a 4-page camera-ready PDF for the Symposium Digest. Official BCICTS 2026 page shows the extended paper submission deadline 2026-05-22, notice to authors 2026-07-10, final manuscript 2026-09-09, and Boston venue/date information. | | SiGe BiCMOS、compound semiconductor circuits and devices、GaN / InP / SiGe RF・mmWave・THz IC、device physics、modeling、process and device technologyを同じprogramで確認できる。 監視テーマ: BiCMOS, SiGe, GaN HEMT, InP THz power amplifiers, RF/mmWave/THz ICs, compound semiconductor devices, device modeling, process technology |
| IRMMW-THz International Conference on Infrared, Millimeter, and Terahertz Wavesロジック / デバイス / プロセス統合 IRMMW-THz Society / 2026 Local Organizing Committee / University of Utah | 最終原稿締切 2026-08-15 19日後 2026-10-11〜16 / Salt Lake City, Utah, United States University of Utah / Salt Lake City, Utah / Salt Lake City, United States | Official 2026 pages identify abstract submission through Whova, IEEE PDF eXpress conversion, a two-page abstract path for Best Student Paper Award authors, and final extended abstract eligibility for abstracts submitted by May 1, 2026 and accepted by the TPC. Official 2026 pages identify Salt Lake City on October 11-16, 2026, abstract deadline May 1, author notification July 6, final abstract / registration deadline August 15, current conference committee rows, official plenary-speaker affiliations, sponsor/exhibitor listings, and official history from the 1974 start of the series. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | infrared, millimeter-wave, and terahertz waves、THz sources / detectors、quantum-cascade lasers、superconducting detectors、nano / quantum devices、materials spectroscopy、integrated systems、sensing、communicationsを確認できる。 監視テーマ: THz sources, THz detectors, quantum cascade lasers, superconducting detectors, nano and quantum devices, mm-wave electronics, spectroscopy, non-destructive sensing, communications, photonics instrumentation |
| ISOCC International SoC Design Conference回路 / システム / 設計自動化 ISOCC Organizing Committee / Institute of Semiconductor Engineers | 会期開始 2026-10-11 76日後 2026-10-11〜14 / Songdo ConvensiA, Incheon, South Korea Songdo ConvensiA / Incheon, South Korea | full paper submission / technical program committee selection; current 2026 program and sponsor detail pages are still placeholders. ISOCC 2026公式サイトで23rd International SoC Design Conference、2026年10月11〜14日、Songdo ConvensiA開催、organizing/TPC/steering committee公開を確認した。 | | SoC design、analog/digital/RF circuits、AI/ML accelerators、wireline、CAD、advanced packaging周辺のアジア主要SoC会議として確認する。 監視テーマ: SoC design, integrated circuits, AI accelerators, analog, digital, RF, wireline, CAD, packaging |
| ITC International Test ConferenceMemory / Reliability / Failure Physics IEEE Computer Society / ITC Test Week | 会期開始 2026-10-11 76日後 2026-10-11〜16 / Grand Hyatt San Antonio Riverwalk, San Antonio, Texas, US Grand Hyatt San Antonio Riverwalk / San Antonio, United States | complete paper up to 10 pages + abstract、competitive selection AI/HPC と shared silicon challenges の test track があり、検査・計測・ATE 企業の採用テーマへ接続しやすい。 | | electronic test、DFT、ATE、probe card、AI chip test、3D/2.5D、diagnosis、yield analysis を製品ライフサイクルで確認する。 監視テーマ: DFT, ATE, probe card, AI chip test, diagnosis, yield, silicon debug, 3D/2.5D |
| VLSI-SoC IFIP/IEEE International Conference on Very Large Scale Integration SoC回路 / システム / 設計自動化 IFIP TC10 WG5 / IEEE CEDA / IEEE CASS | 会期開始 2026-10-11 76日後 2026-10-11〜14 / St. Raphael Resort, Limassol, Cyprus St. Raphael Resort / Limassol, Cyprus | abstract registration + full paper submission + camera-ready VLSI-SoC 2026公式は34回目のIFIP/IEEE会議としてfull paper submissionとacceptance/camera-ready導線を示すため、CORE/ICORE上はCでもこのTier表ではB帯専門会議に分類する。 | | VLSIとSoC designを中心に、architectures、circuits、devices、EDA、verification、test、securityを横断する。 監視テーマ: SoC design, architectures, circuits, EDA, verification, test, security |
| CAS International Semiconductor Conferenceロジック / デバイス / プロセス統合 National Institute for R&D in Microtechnologies (IMT Bucharest) / IEEE Electron Devices Society | 会期開始 2026-10-14 79日後 2026-10-14 to 2026-10-17 / Sinaia, Romania Sinaia, Romania / Sinaia, Romania | CAS call for papers specifies four-page submissions and Technical Program Committee review. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official CAS 2026 sources identify the 49th edition in Sinaia, IEEE/IEEE EDS participation, official committees, sponsors, and a program whose details are pending. | | Semiconductor devices, integrated circuits, nanotechnologies, microsystems, optoelectronics, sensors, and microelectronics. 監視テーマ: semiconductor devices, integrated circuits, MEMS, sensors, nanotechnology, optoelectronics, reliability, IEEE EDS, IMT Bucharest, Infineon Romania |
| EMS Electronic Materials Symposiumロジック / デバイス / プロセス統合 電子材料シンポジウム運営・実行委員会 | 採択通知 2026-08-31 35日後 2026-10-14〜16 / Grand Mercure Nara Kashihara, Nara, Japan Grand Mercure Nara Kashihara / Kashihara, Japan | 1-2 page English PDF abstract; Paper Committee reviews submissions and reports acceptance in August; poster-centered general presentations plus invited and special sessions 公式EMS-45 submission pageはA4 1-2 page English PDF、論文委員会で採否検討後8月中に通知、投稿締切2026年7月23日正午と案内している。 | | 半導体を中心とする電子材料、混晶半導体、wide-bandgap、photonic / optoelectronic materials、process and device materialsを国内産学で確認できる。 監視テーマ: electronic materials, compound semiconductors, wide-bandgap, nitride semiconductors, diamond, photonic crystals, oxide electronics, spintronics, process materials |
| IEMT IEEE International Electronics Manufacturing Technology Conference実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society Malaysia Chapter | 論文締切 2026-07-31 4日後 2026-10-14 to 2026-10-16 / Putrajaya, Malaysia Le Méridien Putrajaya / Putrajaya, Malaysia | Official conference pages list abstract and full-manuscript milestones; a separate journal extension review is not generalized to the conference. Official 2026 sources identify the 41st event, April 30 abstract, June 3 acceptance, July 31 manuscript, and October 14-16 conference. | | Electronic materials, semiconductor packaging, chiplets, heterogeneous integration, manufacturing, thermal management, and reliability. 監視テーマ: electronics manufacturing, packaging, chiplets, heterogeneous integration, thermal management, reliability, Malaysia and Asia semiconductor ecosystem |
| EPEPS IEEE Conference on Electrical Performance of Electronic Packaging and Systems実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society / IEEE Microwave Theory and Techniques Society / IEEE Antenna and Propagation Society / EPEPS Organizing Committee | 会期開始 2026-10-18 83日後 2026-10-18 to 2026-10-21 / Embassy Suites by Hilton Fort Worth Downtown, Fort Worth, TX, USA Embassy Suites by Hilton Fort Worth Downtown / Fort Worth, Texas, United States | Official EPEPS 2026 call-for-papers guidance identifies a two-column, three-page PDF submission format, IEEE compliance requirements, manuscript review, and special-section invitation context. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official EPEPS 2026 sources identify the October 18-21, 2026 Fort Worth cycle, July 22, 2026 submission deadline line, three-page PDF submission format, official committee membership rows, official sponsor/exhibitor/technical-sponsor listings, and linked EPEPS 2025 EasyChair program rows with first-listed author affiliation pages. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Electronic packaging and systems electrical performance, signal integrity, power integrity, thermal integrity, high-speed interconnects, SerDes, DDR and memory interfaces, RF/wireless/quantum system interconnects, advanced packaging, 3D integration, heterogeneous integration, chiplet interfaces, co-packaged optics, package/PCB design, modeling, simulation, measurement, CAD, and ML/AI-assisted interconnect and packaging workflows. 監視テーマ: EPEPS, IEEE EPS, IEEE MTT-S, IEEE APS, electrical performance of electronic packaging and systems, signal integrity, power integrity, thermal integrity, package design, high-speed interconnects, HBM, chiplets, UCIe, co-packaged optics, 3D integration, heterogeneous integration, Intel, IBM, Samsung Electronics, Nvidia, Texas Instruments, Keysight, Xpeedic, Siemens EDA, Cadence, Synopsys, and official first-listed EasyChair program affiliation rows |
| ACSIN International Conference on Atomically Controlled Surfaces, Interfaces and Nanostructuresロジック / デバイス / プロセス統合 The Japan Society of Applied Physics / JSAP Thin Film and Surface Physics Division | 会期開始 2026-10-19 84日後 2026-10-19〜23 / Arcrea HIMEJI, Himeji, Japan Arcrea HIMEJI / Himeji, Japan | Abstract submission for ACSIN-16 / ICSPM34 oral/poster presentation; poster award applications are made at abstract submission and decisions are made by the program committee. 公式ACSIN-16 / ICSPM34 homeで2026年10月19〜23日のHimeji開催、abstract submission open、extended abstract deadline 2026-07-06、early registration、conference paper deadlineを確認した。 | | atomically controlled surfaces, interfaces, nanostructures, scanning probe microscopy, surface and interface engineering, 1D/2D materials, ALD/ALE, quantum materials, carbon-neutral materialsを確認できる。 監視テーマ: atomically controlled surfaces, interfaces, nanostructures, scanning probe microscopy, ALD/ALE, 2D materials, quantum materials, carbon-neutral materials |
| IMPACT-IAAC International Microsystems, Packaging, Assembly and Circuits Technology Conference実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society / IMAPS Taiwan / ITRI / TPCA | 会期開始 2026-10-19 84日後 2026-10-19〜22 / Grand HiLai Taipei + TaiNEX 2, Taipei, Taiwan Grand HiLai Taipei / Taipei Nangang Exhibition Center II / Taipei, Taiwan | paper submission / oral and poster sessions 公式2026 homeはEnergy-Efficient AIをテーマに、2026年10月19〜22日 Taipei開催と2026年6月30日へのsubmission deadline延長を案内している。 | | advanced packaging、heterogeneous integration、IC substrates、PCB、thermal management、reliability、manufacturing processes、materials を台湾/APAC実装エコシステムで確認できる。 監視テーマ: advanced packaging, heterogeneous integration, IC substrate, PCB, thermal, reliability, materials |
| IEEE APCCAS IEEE Asia Pacific Conference on Circuits and Systems回路 / システム / 設計自動化 IEEE Circuits and Systems Society / APCCAS 2026 Organizing Committee | 最終原稿締切 2026-07-31 4日後 2026-10-25〜28 / ACROS Fukuoka, Fukuoka, Japan ACROS Fukuoka / Fukuoka, Japan | double-blind review / IEEE conference paper / maximum 5 pages including an optional references page 公式Submission Guidelinesでregular paperのdouble-blind review、IEEE template、initial manuscriptの著者・所属非開示、accepted paperのregistration / presentation条件を確認した。 | | circuits and systems、integrated-circuit design、VLSI systems、AI circuits、analog / mixed-signal、power and sensory systemsを横断して確認できる。 監視テーマ: integrated circuits, VLSI systems, AI circuits, analog and mixed-signal, power, sensory systems |
| WiPDA IEEE Workshop on Wide Bandgap Power Devices and Applicationsパワー半導体 / Wide-Bandgap IEEE / PSMA / IEEE PELS / IEEE EDS | 会期開始 2026-10-26 91日後 2026-10-26〜28 / Burlington, Vermont, US Burlington, Vermont / Burlington, United States | CFP公開待ち power device・package・application の距離が近く、ISPSD と PCIM の間をつなぐ WBG 特化観測点として有効。 | | WBG 専門 workshop として、SiC、GaN、packaging、thermal、reliability、grid / EV / data center applications を密に追える。 監視テーマ: SiC, GaN, ultra-wide-bandgap, packaging, thermal, reliability, EV, grid, data centers |
| ICSICT IEEE International Conference on Solid-State and Integrated Circuit Technologyロジック / デバイス / プロセス統合 ICSICT 2026 Organizing Committee | 会期開始 2026-10-27 92日後 2026-10-27〜30 / Hangzhou, China Hangzhou, China / Hangzhou, China | at least 3 pages camera-ready full length paper; accepted papers are planned for IEEE Xplore inclusion subject to scope and quality requirements. ICSICT公式siteで2026年10月27〜30日 Hangzhou開催、paper submission 2026-06-25、acceptance 2026-07-25、IEEE Xplore inclusion予定を確認した。 | | solid-state devices、digital IC and system design、analog、process technologiesを横断するIEEE系国際会議として確認する。 監視テーマ: solid-state devices, integrated circuits, process technologies, analog, systems |
| MICRO IEEE/ACM International Symposium on Microarchitecture回路 / システム / 設計自動化 IEEE Computer Society / ACM SIGMICRO | 会期開始 2026-10-31 96日後 2026-10-31 to 2026-11-04 / Athens, Greece Athens, Greece / Athens, Greece | The official MICRO 2026 regular-track call for papers describes full-paper submission and peer review. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official MICRO sources identify the 2026 Athens cycle and the completed 2025 program, committee affiliations, sponsor listing, technical sponsors, and proceedings. | | Microarchitecture, computer architecture, processor and memory systems, AI accelerators, chips, compilers, hardware/software co-design, and advanced computing systems. 監視テーマ: microarchitecture, computer architecture, processors, memory, AI accelerators, chips, compilers, NVIDIA, Intel, AMD, Arm, Qualcomm, Samsung, SK hynix |
| A-SSCC IEEE Asian Solid-State Circuits Conference回路 / システム / 設計自動化 IEEE Solid-State Circuits Society | 採択通知 2026-08-08 12日後 2026-11-01〜04 / The Lin Hotel Taichung, Taichung, Taiwan The Lin Hotel Taichung / Taichung, Taiwan | 2-page manuscript + optional 1-page supplemental figures 公式投稿システムでsubmission deadlineが2026年6月14日 23:59 UTC-0500、decision notificationが2026年8月8日 23:59 UTC-0500であることを確認した。2026-06-15 UTC時点では締切通過後の採択通知待ちに分類する。 | | IEEE SSCSのA-SSCCとして、solid-state circuits、SoC / system integration、wireless、wireline、memory、FPGA、industry track を公式sourceで確認できる。 監視テーマ: AI processors, memory, wireless, wireline, FPGA, industry program |
| GEC Gaseous Electronics Conferenceロジック / デバイス / プロセス統合 Gaseous Electronics Conference / American Physical Society plasma community | 採択通知 2026-09-04 39日後 2026-11-02〜06 / Hilton Chicago, Chicago, Illinois, United States Hilton Chicago / Chicago, United States | Official GEC 2026 abstract page says abstracts are limited to 1,300 characters, author notices of acceptance are tentatively scheduled for September 4, 2026, and contributed papers may be oral or poster presentations. Official GEC 2026 home identifies the 79th Annual Gaseous Electronics Conference, jointly held with APS DPP, at Hilton Chicago on November 2-6, 2026. The abstract submission deadline is July 22, 2026. | | Low-temperature plasma science, plasma sources, diagnostics, modeling, plasma chemistry, plasma-surface interactions, microelectronics plasma processing, etch, deposition, and semiconductor fabrication applicationsを確認できる。 監視テーマ: low-temperature plasma, plasma etch, plasma deposition, plasma-surface interaction, semiconductor fabrication, DRAM etch, process modeling, plasma diagnostics, AI/ML plasma simulation |
| HMF-26 International Conference on High Magnetic Fields in Semiconductor Physicsロジック / デバイス / プロセス統合 HMF-26 Organizing Committee / ISSP, The University of Tokyo | 会期開始 2026-11-02 98日後 2026-11-02〜2026-11-06 / Kashiwa-No-Ha Conference Center, Kashiwa, Chiba, Japan Kashiwa-No-Ha Conference Center / Kashiwa, Chiba, Japan | Official submission page states that abstract submission has passed and identifies early registration and the November 2-6, 2026 conference cycle. The official program page is still To be announced as of review. Official HMF-26 pages identify the November 2-6, 2026 Kashiwa cycle, Kashiwa-No-Ha Conference Center venue, official committees, invited-speaker list, sponsor/support and endorsement listings, and series history starting in 1972. Reviewed source signals are hydrated from the PostgreSQL public API. | | high magnetic fields in semiconductor physics、magneto-transport、optical spectroscopy、quantum wells、2D materials、topological systems、spin physics、excitons、low-dimensional semiconductor systemsを確認できる。 監視テーマ: high magnetic fields, semiconductor physics, magneto-transport, quantum wells, two-dimensional materials, spin physics, excitons, topological semiconductor systems, pulsed-field measurement |
| MMM Annual Conference on Magnetism and Magnetic MaterialsMemory / Reliability / Failure Physics AIP Publishing and IEEE Magnetics Society | 最終原稿締切 2026-10-05 70日後 2026-11-02〜06 / Hilton Hawaiian Village Waikiki Beach Resort, Honolulu, Hawaii, USA Hilton Hawaiian Village Waikiki Beach Resort / Honolulu, United States | Official MMM 2026 abstract submission uses an online abstract flow with category/subcategory selection, oral/poster preference, Program Committee assignment, and optional AIP Advances manuscript submission. Official MMM 2026 pages list the April 29, 2026 abstract deadline extension, June 12 author notifications, November 2-6 Honolulu conference cycle, invited/contributed presentation program, and AIP Advances manuscript deadline of October 5, 2026. | | magnetism and magnetic materials、spintronics、magnetic recording、magnetic sensors、superconducting and magnetic materialsを、memory / reliability / device側の隣接signalとして確認できます。 監視テーマ: spintronics, magnetic materials, magnetic recording, magnetic sensors, MRAM-adjacent devices, superconducting magnets, magnetism standards |
| ISMP International Symposium on Microelectronics Packaging実装 / 先端パッケージ / 3D integration Korean Microelectronics Packaging Society | 会期開始 2026-11-03 99日後 2026-11-03〜06 / Paradise Hotel Busan, Busan, Korea Paradise Hotel Busan / Busan, South Korea | abstract for oral and poster presentation 公式Overview / Welcome messageはoral and poster presentation向けabstract投稿を案内し、committee・plenary/keynote/invited speaker・sponsorページで産学構成を確認できる。 | | chiplet package design、2.xD/3.xD integration、fine-pitch substrates、interposers、fluxless bonding、hybrid bonding、co-packaged optics を packaging 側から確認する。 監視テーマ: chiplet packaging, 2.xD/3.xD integration, fine-pitch substrates, interposers, hybrid bonding, co-packaged optics, packaging reliability |
| AVS AVS 72nd International Symposium & Exhibition露光 / パターニング / 配線 / 量産 AVS | 会期開始 2026-11-08 104日後 2026-11-08〜13 / David L. Lawrence Convention Center, Pittsburgh, Pennsylvania, US David L. Lawrence Convention Center / Pittsburgh, United States | oral / poster abstract submission microelectronics のみではないが、materials・surface・plasma 側から semiconductor roadmap を補完できるのが強み。 | | vacuum、thin films、plasma、atomic scale processing、EUV、microelectronic devices、advanced packaging をまたいで追える。 監視テーマ: plasma science, thin films, atomic scale processing, EUV lithography, microelectronic devices, advanced packaging, 2D materials |
| ICCAD IEEE/ACM International Conference on Computer-Aided Design回路 / システム / 設計自動化 IEEE / ACM | 会期開始 2026-11-08 104日後 2026-11-08〜12 / San Jose, California, US San Jose, California / San Jose, United States | abstract + regular paper + rebuttal process device レベルから system レベルまで CAD を横断するので、新デバイスが設計フローへ入る時期を比較できる。 | | CAD、post-CMOS design、device-to-system design automation、verification、physical design をフルレンジで追える。 監視テーマ: CAD, verification, physical design, post-CMOS, AI for EDA, system-level design |
| IWN International Workshop on Nitride Semiconductorsロジック / デバイス / プロセス統合 IWN2026 Committee | 会期開始 2026-11-08 104日後 2026-11-08〜13 / Kumamoto-jo Hall, Kumamoto, Japan Kumamoto-jo Hall / Kumamoto, Japan | abstract submission + advance/final program 公式IWN2026サイトでabstract submission extendedと、abstract submission deadlineが2026年6月28日 23:59 JSTへ延長されたことを確認した。 | | III-nitride 材料とデバイスに特化し、GaN、AlN、epitaxy、RF、power、optoelectronic integration を深く追える。 監視テーマ: GaN, AlN, epitaxy, RF devices, power devices, optoelectronics, nitride processing |
| MNC International Microprocesses and Nanotechnology Conference露光 / パターニング / 配線 / 量産 JSAP / MNC Committee | Late News締切 2026-09-01 36日後 2026-11-10〜13 / Hotel New Otani Hakata, Fukuoka, Japan Hotel New Otani Hakata / Fukuoka, Japan | abstract submission + late news paper abstract site open、late news、JJAP special issue まで一連の導線が先に出るので、仮DBとの相性が良い会議です。 | | advanced lithography、patterning materials、nano metrology、ALP、MEMS まで含み、patterning 周辺の裾野を広く見られる会議です。 監視テーマ: advanced lithography、patterning materials、nano metrology、ALP、NIL、MEMS |
| REPP Symposium on Reliability for Electronics and Photonics Packaging実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society | 要旨締切 2026-08-15 19日後 2026-11-12〜13 / UCLA, Los Angeles, California, US University of California, Los Angeles / Los Angeles, United States | 200-300 word abstract or proposal / symposium presentation / no formal paper due 2026 CFPはpresentation proposalの募集、2026-08-30の採択通知、25分発表、formal paper不要を案内しているため、査読付き論文会議ではなく専門シンポジウムに分類する。 | | advanced semiconductor packaging、photonic packaging、MEMS/MOEMS、accelerated testing、probabilistic reliability を reliability 側から確認する。 監視テーマ: advanced packaging reliability, photonic packaging, MEMS, FOAT, accelerated testing, thermo-mechanical reliability |
| MRS Fall MRS Fall Meeting & Exhibitロジック / デバイス / プロセス統合 Materials Research Society (MRS) | 採択通知 2026-08-15 19日後 2026-11-29〜2026-12-04 / Hynes Convention Center and Sheraton Boston Hotel, Boston, Massachusetts, United States Hynes Convention Center and Sheraton Boston Hotel / Boston, United States | Official 2026 call-for-abstracts page lists abstract submission opening on 2026-05-19 and abstract submission deadline on 2026-06-17, with confirmation emails in mid-August 2026. Official 2026 pages list the November 29 to December 4 Boston meeting, the Hynes Convention Center / Sheraton Boston venue, topical clusters, abstract timeline, and exhibit/sponsor resources. The reviewed DAC型signal uses the completed 2025 Program Book and 2025 symposium support recognition source for program and sponsor graphs. | | materials science across quantum materials, electronics, optics and photonics, energy and sustainability, nanomaterials, characterization, AI for materials science, soft materials, and structural / functional materialsを確認できる。 監視テーマ: semiconductor materials, quantum materials, electronics, optics and photonics, nanomaterials, materials characterization, AI for materials science, energy materials, instrumentation suppliers |
| ATS IEEE Asian Test Symposium回路 / システム / 設計自動化 IEEE / IEEE CEDA / National Tsing Hua University / National Sun Yat-sen University | 採択通知 2026-09-14 49日後 2026-12-01〜03 / Hotel Nikko Kaohsiung, Kaohsiung, Taiwan Hotel Nikko Kaohsiung / Kaohsiung, Taiwan | Official ATS 2026 submission guidelines request original unpublished PDF manuscripts, with regular paper submissions limited to 6 pages and accepted papers intended for IEEE Xplore publication subject to requirements. Official ATS 2026 home lists the final paper submission extension as 2026-07-07 AoE, notification of acceptance as 2026-09-14, camera-ready manuscript as 2026-10-13, and the conference in Kaohsiung on 2026-12-01 to 2026-12-03. | | IC testing, design-for-test, reliability, memory test, chiplet/3D IC test, silicon lifecycle management, hardware security, and AI for testをアジア太平洋軸で確認できる。 監視テーマ: design-for-test, IC testing, chiplet test, 3D IC test, memory test, reliability, silicon lifecycle management, AI for test, hardware security |
| EPTC IEEE Electronics Packaging Technology Conference実装 / 先端パッケージ / 3D integration IEEE RS/EPS/EDS Singapore Chapter / IEEE EPS | 採択通知 2026-07-30 3日後 2026-12-01〜04 / Resorts World Convention Centre, Singapore Resorts World Convention Centre / Singapore, Singapore | 500-750 word abstract + full manuscript 公式CFP PDFでabstract締切2026年6月8日、notification 2026年7月30日、Full Manuscript Submission 2026年8月31日、final manuscript for proceedings due 2026年9月15日を確認した。 | | APAC の packaging flagship で、chiplet、bonding、thermal、wide-bandgap packaging、photonics packaging を横断できる。 監視テーマ: chiplet, bonding, thermal, photonics, wide-bandgap packaging, reliability |
| IDW International Display Workshopsロジック / デバイス / プロセス統合 IDW General Incorporated Association / ITE / SID | 採択通知 2026-07-31 4日後 2026-12-02〜04 / ACT CITY Hamamatsu, Hamamatsu, Japan ACT CITY Hamamatsu / Hamamatsu, Japan | Technical summary submission; program assignment to oral or poster presentation; camera-ready manuscript; late-news papers; online proceedings and open-access DOI archive after the conference. 公式author informationはtechnical summary deadline 2026-06-25、acceptance notification 2026-07-31、camera-ready manuscript 2026-09-08、late-news camera-ready manuscript 2026-09-22、late-news acceptance 2026-10-22を案内する。 | | information display technologies、CMOS image sensors、OLED、micro/mini LEDs、quantum dots、AR/VR、automotive displays、MEMS and image-sensing technologiesを公式workshop / topical session横断で確認できる。 監視テーマ: display devices, CMOS image sensors, OLED-on-silicon, micro LED, quantum dots, AR/VR optics, automotive displays, flexible electronics, MEMS displays, image sensing |
| PowerMEMS+ PowerMEMS+ / International Conference on Micro and Miniature Power Systems, Self-Powered Sensors and Energy Autonomous Devicesパワー半導体 / Wide-Bandgap PowerMEMS+ / IEEE / IEEE MEMS Technical Community / IEEE Industrial Electronics Society | 採択通知 2026-09-04 39日後 2026-12-06 to 2026-12-09 / Shaoxing University, Shaoxing, Zhejiang, China Shaoxing University / Shaoxing, Zhejiang, China | Official PowerMEMS+ 2026 selection-criteria page states that the Technical Program Committee selects abstracts according to technical quality, significance, originality, relevance, impact, and clarity criteria. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official PowerMEMS+ 2026 pages identify the December 6-9, 2026 Shaoxing cycle, July 17 abstract-submission deadline, September 4 acceptance notification, conference officials, current-support listings, public program archive rows, and previous-conferences archive back to 2000. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Micro and miniature power systems, energy harvesting and conversion, self-powered sensors, energy-autonomous devices, MEMS, microsystems, power sources, storage, transducers, and sensor platforms. 監視テーマ: PowerMEMS+, micro power systems, miniature energy harvesters, self-powered sensors, MEMS transducers, energy-autonomous devices, IEEE MEMS and IEEE IES sponsor signals, program affiliation mix |
| IEEE ICM IEEE International Conference on Microelectronics回路 / システム / 設計自動化 ICM Organizing Committee / IEEE Circuits and Systems Society technical co-sponsors | 論文締切 2026-08-07 11日後 2026-12-07 to 2026-12-10 / Borneo Cultures Museum, Sarawak, Malaysia Borneo Cultures Museum / Sarawak, Malaysia | Full paper submission; the official ICM 2025 CFP states every paper is reviewed by at least three specialized reviewers and accepted, presented papers are submitted to IEEE Xplore. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ICM 2026 home identifies the December 7-10 Sarawak cycle and August 7 full-paper deadline. The completed ICM 2025 program exposes first-listed author affiliations for 104 presentation rows. | | Circuits and systems, analog and mixed signal, RF, FPGA and SoC, AI hardware, neuromorphic computing, CAD, testing, micro/nanoelectronics, reliability, and packaging. 監視テーマ: analog and mixed signal, RF, FPGA, SoC, AI hardware, neuromorphic, CAD, testing, microelectronics, reliability, packaging |
| MRS-J Annual Meeting The 35th Annual Meeting of MRS-Jロジック / デバイス / プロセス統合 The Materials Research Society of Japan (MRS-J) | 会期開始 2026-12-07 133日後 2026-12-07〜09 / Industry & Trade Center Bldg, Yokohama, Japan Industry & Trade Center Bldg / Yokohama, Japan | English PDF abstract submission through MyPage; up to two presentations per registration; acceptance notification; oral/poster presentation styles; staged abstract release after the meeting 公式36th Annual Meeting siteで2026年12月7〜9日のIndustry & Trade Center Bldg開催を確認。締切は別更新する。 | | materials innovation、semiconductor materials、nanomaterials、oxide and perovskite materials、plasma processes、biomaterials、energy materials、characterization、data-driven materials scienceを横断して確認できる。 監視テーマ: p-type semiconductors, semiconductor superlattices, oxide thin films, perovskites, plasma/nanomaterials, smart interfaces, ceramics, energy materials, biomaterials, materials informatics |
| PCIM India PCIM Asia New Delhi Conferenceパワー半導体 / Wide-Bandgap Mesago Messe Frankfurt India | 論文締切 2026-10-01 66日後 2026-12-09〜10 / Yashobhoomi Exhibition and Convention Center, New Delhi, India Yashobhoomi Exhibition and Convention Center (IICC) / New Delhi, India | paper digest + full paper 新興市場側の採用論点が前面に出るので、地域別に power electronics の要求差を確認できる。 | | power semiconductors、thermal management、advanced packaging、reliability、power converter design をインド市場文脈で追える。 監視テーマ: power semiconductors, thermal management, advanced packaging, reliability, converter design |
| SISC IEEE Semiconductor Interface Specialists Conferenceロジック / デバイス / プロセス統合 IEEE / IEEE Electron Devices Society | 要旨締切 2026-08-07 11日後 2026-12-09〜12 / Catamaran Resort Hotel, San Diego, CA Catamaran Resort Hotel, San Diego, CA / San Diego, United States | 公式submission pageは2ページ以内のabstract提出を求め、program committeeによるblind reviewを案内しています。 2026年San Diego cycle、2026-08-07 abstract deadline、現行committee、invited/tutorial program、IEEE / IEEE EDS sponsor statement、1965年からのhistoryを公式sourceで確認済みです。DAC型signal graphはPostgreSQL researchVisualSignalsを正本にします。 | | semiconductor / insulator interfaces、thin films、gate dielectrics、ferroelectric devices、wide-bandgap devices、reliability、BEOL oxide transistors、advanced packaging interfacesを横断して追う会議です。 監視テーマ: semiconductor interfaces、gate dielectrics、high-k、ferroelectric devices、reliability、SiC、GaN、2D channels、BEOL oxide semiconductors |
| IEDM IEEE International Electron Devices Meetingロジック / デバイス / プロセス統合 IEEE Electron Devices Society | Late News締切 2026-08-18 22日後 2026-12-12〜16 / San Francisco, California, US San Francisco, California / San Francisco, United States | 4-page camera-ready paper + late news 2026サイクルはsubmission siteが2026年5月26日に開き、4-page camera-ready paper締切は2026年7月16日、late news締切は2026年8月18日と公式案内されている。 | | logic、memory、power、package をまたぐ device 会議で、量産直前の新構造と研究段階の差を比較できます。 監視テーマ: GAA、CFET、backside power、advanced memory、heterogeneous integration |
| EDAPS IEEE Electrical Design of Advanced Packaging and Systems Symposium実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society / EDAPS Organizing Committee | 要旨締切 2026-08-21 25日後 2026-12-14〜2026-12-16 / IIT Ropar, Chandigarh, India IIT Ropar, Chandigarh, India / Chandigarh, India | Official EDAPS CFP/submission pages require a two-column, three-page PDF manuscript and state that contributions undergo review; accepted papers are reproduced in proceedings and the CFP says accepted papers will be submitted to IEEE Xplore subject to requirements. Official EDAPS 2026 sources identify the December 14-16, 2026 IIT Ropar / Chandigarh cycle, August 21 paper deadline, September 21 acceptance notification, October 12 final paper deadline, IEEE EPS sponsorship, visible 2026 committee rows, and the EDAPS-linked 2025 EasyChair program. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | electrical design, modeling, simulation, and measurement for chip, package, and system levels; 3D-IC, chiplet, interposer, SiP, SI/PI/EMC, RF/mm-wave/THz package, photonics package, package CAD, substrate, and thermal/multiphysics modelingを確認できる。 監視テーマ: advanced packaging, chiplets, 3D-IC, interposers, signal integrity, power integrity, EMC, antenna-in-package, high-speed channels, package CAD, thermal and multiphysics modeling |
| IEEE ICEE IEEE International Conference on Emerging Electronics回路 / システム / 設計自動化 IEEE Electron Devices Society / INEMI / IEEE VLSI Society | 会期開始 2026-12-19 145日後 2026-12-19 to 2026-12-22 / Bengaluru, India Hilton Manyata, Bengaluru / Bengaluru, India | The official ICEE call for papers describes IEEE Xplore-compatible electronic submission and peer-review workflow. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ICEE sources identify the 2026 Bengaluru cycle, completed 2025 technical program, current committees, named organizer and technical-sponsor listing, and ICEE archive. | | Semiconductor devices, circuits, memory, power electronics, advanced packaging, manufacturing, materials, metrology, reliability, sensors, and emerging electronics. 監視テーマ: semiconductor devices, memory, power, packaging, manufacturing, metrology, reliability, AI hardware, Applied Materials, Lam Research, Micron, Intel, onsemi |
| IEEE MEMS IEEE International Conference on Micro Electro Mechanical Systemsロジック / デバイス / プロセス統合 IEEE MEMS Technical Community | 会期開始 2027-01-17 174日後 2027-01-17〜21 / Big Island, Hawaii, US Big Island, Hawaii / Big Island, United States | technical paper / oral and poster program 公式MEMS 2027 conference infoで2027年1月17〜21日のBig Island, Hawaii開催を確認。締切は次回CFP公開後に別更新する。 | | MEMS、microsystems、sensors、actuators、microfabrication、integration を More-than-Moore の半導体隣接領域として確認する。 監視テーマ: MEMS, sensors, actuators, microfabrication, integration, biomedical devices |
| SPIE Photonics West SPIE Photonics Westロジック / デバイス / プロセス統合 SPIE | 採択通知 2026-10-12 77日後 2027-01-30〜2027-02-04 / The Moscone Center, San Francisco, California, United States The Moscone Center / San Francisco, United States | Official SPIE Photonics West abstract guidelines request author information, a 200-300 word abstract for technical review, a 50-150 word program summary, and manuscript / poster PDF uploads for SPIE Digital Library publication workflows. Official SPIE Photonics West home lists the 2027 San Francisco cycle on 30 January-4 February, more than 100 conferences, more than 1,500 companies, and 24,000 attendees. The official abstract guidelines list abstracts due 2026-07-22 and authors notified / program posting on 2026-10-12. | | Photonics, lasers, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum, photonic chips, vision technologies, and exhibition supplier signalsを確認できる。 監視テーマ: silicon photonics, photonic chips, semiconductor lasers, quantum photonics, displays, industrial lasers, micro/nano optics, optical test and measurement, exhibitors |
| ISSCC IEEE International Solid-State Circuits Conference回路 / システム / 設計自動化 IEEE Solid-State Circuits Society | 論文締切 2026-09-09 44日後 2027-02-14〜18 / San Francisco, California, US San Francisco, California / San Francisco, United States | abstract + draft manuscript、double-blind review 2027サイクルはpaper submission siteが2026年7月1日に開き、electronic submission締切は2026年9月9日 3:00 PM EDTと公式案内されている。 | | AI accelerator、memory、power management、wireline など、製品寄りの最新実装と回路シグナルを拾う主会議です。 監視テーマ: AI SoC、HBM活用、power management、memory、wireline、technology directions |
| SPIE ALP SPIE Advanced Lithography + Patterning露光 / パターニング / 配線 / 量産 SPIE | 会期開始 2027-02-21 209日後 2027-02-21〜25 / San Jose, California, US San Jose, California / San Jose, United States | conference ごとに abstract / manuscript 指定 公式eventページで2027年2月21〜25日のSan Jose開催を確認。締切は次回CFP公開後に別更新する。 | | lithography の主会議で、High-NA、mask、resist、metrology、patterning integration を分けて確認できます。 監視テーマ: High-NA EUV、mask、resist、metrology、advanced patterning |
| APEC IEEE Applied Power Electronics Conference and Expositionパワー半導体 / Wide-Bandgap IEEE IAS / IEEE PELS / PSMA | 予稿締切 2026-08-14 18日後 2027-03-07〜11 / Ernest N. Morial Convention Center, New Orleans, Louisiana, US Ernest N. Morial Convention Center / New Orleans, United States | 3-5 page digest + full manuscript + in-person presentation 2027 technical sessionsはdigest submission portalが2026年5月21日に開き、digest締切が2026年8月14日、採択通知が2026年10月12日、IEEE two-column manuscript upload締切が2026年12月7日。 | | applied power electronics の最大級会議で、SiC / GaN、power IC、thermal、magnetics、data center、motor drive の採用面を追える。 監視テーマ: SiC, GaN, power ICs, thermal management, data centers, motor drives, renewables, industry sessions |
| OFC Optical Fiber Communications Conference and Exhibitionロジック / デバイス / プロセス統合 Optica / IEEE Communications Society / IEEE Photonics Society | 会期開始 2027-03-07 223日後 2027-03-07〜11 / Los Angeles Convention Center, Los Angeles, California, US Los Angeles Convention Center / Los Angeles, United States | technical paper / postdeadline paper / exhibit program 2027会期はLos Angelesで2027年3月7〜11日。Submit a Paperページはsubmission通知待ちだが、submission guidelinesは35-word abstractと3-page summary、blinded peer reviewを案内している。 | | optical communications、silicon photonics、co-packaged optics、pluggable optics、datacenter interconnect を産業寄りに確認する。 監視テーマ: co-packaged optics, silicon photonics, optical engines, datacenter interconnect, AI network |
| EDTM IEEE Electron Devices Technology and Manufacturing Conferenceロジック / デバイス / プロセス統合 IEEE Electron Devices Society | 会期開始 2027-03-08 224日後 2027-03-08〜11 / Fukuoka, Japan Fukuoka International Congress Center / Fukuoka, Japan | 3-page camera-ready paper / oral and poster sessions 2027 CFPはpaper deadlineを2026年10月中旬、acceptanceを2026年12月下旬と月表記で案内しているため、日付の推定ではなく公式更新監視に回します。 | | device technology と manufacturing を同じ軸で見るため、工程、材料、装置、reliability、packaging、yield が同じ CFP に並ぶ会議です。 監視テーマ: materials、process、tools、manufacturing、memory、reliability、packaging、wide-bandgap、testing |
| SEMI-THERM SEMI-THERM Semiconductor Thermal Measurement, Modeling and Management Symposium実装 / 先端パッケージ / 3D integration SEMI-THERM Educational Foundation | 要旨締切 2026-10-05 70日後 2027-03-15 to 2027-03-18 / San Jose, California, United States DoubleTree by Hilton San Jose / San Jose, United States | Official author guidance distinguishes peer-reviewed papers, non-peer-reviewed papers, and presentation-only routes; the venue-wide label remains conservative. Official sources identify the 43rd symposium, October 5 abstract, November 9 acceptance, and March 15-18, 2027 San Jose cycle. | | Semiconductor and electronics thermal measurement, modeling, management, cooling, packaging, and reliability. 監視テーマ: semiconductor thermal, thermal metrology, modeling, cooling, packaging, reliability, Qnity, Nanotest, ThermAvant |
| CSTIC Conference of Science & Technology for Integrated Circuits露光 / パターニング / 配線 / 量産 SEMI / IEEE | 会期開始 2027-03-21 237日後 2027-03-21〜23 / Shanghai New International Expo Centre, Shanghai, China Shanghai New International Expo Centre / Shanghai, China | accepted papers submitted for IEEE Xplore inclusion subject to scope and quality requirements. SEMICON China公式CSTIC 2027ページで2027年3月21〜23日のShanghai開催を確認。締切は次回author kit更新後に別更新する。 | | manufacturing、device design、integration、materials、equipment、emerging semiconductor technologies、circuit designを中国・アジアの包括的半導体技術会議として確認する。 監視テーマ: manufacturing, device design, integration, materials, equipment, AI chips, memory, 3D integration, MEMS |
| IRPS IEEE International Reliability Physics SymposiumMemory / Reliability / Failure Physics IEEE | 要旨締切 2026-10-12 77日後 2027-03-21〜25 / Town and Country Resort, San Diego, California, US Town and Country Resort / San Diego, United States | abstract submission + full manuscript、late news あり 2027 CFPはabstract submission dueを2026年10月12日、late breaking full-length manuscript dueを2027年1月15日として案内している。 | | failure physics、qualification、aging、package reliability を主題にするため、量産の戻し先を reliability 起点で確認できます。 監視テーマ: failure physics、qualification、aging、package reliability、device reliability |
| DATE Design, Automation and Test in Europe Conference回路 / システム / 設計自動化 EDAA / ACM SIGDA / IEEE CEDA | 要旨締切 2026-09-13 48日後 2027-03-22〜24 / Dresden, Germany Dresden, Germany / Dresden, Germany | abstract + full manuscript + camera-ready + video presentation 2027 CFPはtitle / abstract / co-authors登録を2026年9月13日AoE、final paper submissionを2026年9月20日AoEと案内している。 | | EDA、electronic systems design、test、embedded software、open-source EDA、AI活用設計を欧州軸で広く追える。 監視テーマ: EDA, test, embedded systems, hardware-software co-design, open-source EDA, AI for design |
| GOMACTech Government Microcircuit Applications & Critical Technology Conference回路 / システム / 設計自動化 GOMACTech Steering Committee / Palisades Convention Management | 会期開始 2027-03-22 238日後 2027-03-22〜2027-03-25 / Pasadena Convention Center, Pasadena, California, United States Pasadena Convention Center / Pasadena, United States | Official GOMACTech sources expose program sessions through SCOMM and event access/proceedings routes; this record treats oral/poster program rows as program-committee-selected public technical presentations. Official GOMACTech sources identify the March 22-25, 2027 Pasadena cycle, current Technical Program Committee, SCOMM 2026 oral/poster program rows with first-listed affiliation organizations, and the official 2025 exhibitor guide linked from Exhibits & Sponsorships. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | government microelectronics, RF and mixed-signal circuits, radiation-hardened devices, secure and trusted microelectronics, advanced packaging, photonics, WBG power electronics, AI hardware, and defense semiconductor supply-chain topicsを確認できる。 監視テーマ: trusted microelectronics, defense semiconductor supply chain, radiation-hardened design, RF/mmWave, photonics, WBG power, chiplets, advanced packaging, AI hardware, hardware assurance |
| ICMTS IEEE International Conference on Microelectronic Test Structures露光 / パターニング / 配線 / 量産 IEEE Electron Devices Society | 要旨締切 2026-11-01 97日後 2027-04-05〜08 / Udine, Italy Udine, Italy / Udine, Italy | abstract + expanded final paper 2027 CFPはabstract submission deadlineを2026年11月1日、acceptance noticeを2027年1月15日、camera-ready paper deadlineを2027年2月28日として案内している。 | | test structure、device/process characterization、ESD、reliability、power device characterization を一つの会議で追える。 監視テーマ: test structures, process characterization, memory, reliability, ESD, power devices |
| EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems実装 / 先端パッケージ / 3D integration EuroSimE Steering Committee | 要旨締切 2026-10-26 91日後 2027-04-11 to 2027-04-14 / Regensburg, Germany Venue to be announced / Regensburg, Germany | The official 2027 site publishes abstract, acceptance, and full-paper-for-proceedings milestones; full-conference peer-review detail remains conservatively unconfirmed. The official site announces the 28th edition for April 11-14, 2027, with October 26 abstract, December 17 acceptance, and March 2 proceedings-paper dates. | | Thermal, mechanical, and multiphysics simulation and experiments for microelectronics, microsystems, packaging, and reliability. 監視テーマ: thermal management, warpage, mechanical reliability, multiphysics, microelectronics packaging, NXP, imec, Bosch, Infineon, STMicroelectronics, ASML |
| ICMCTF International Conference on Metallurgical Coatings and Thin Films露光 / パターニング / 配線 / 量産 AVS Advanced Surface Engineering Division | 会期開始 2027-04-25 272日後 2027-04-25 to 2027-04-30 / San Diego, California, United States Venue to be announced / San Diego, United States | Official sources document conference abstract selection; later journal-manuscript peer review is not generalized to every presentation. Official 2026 sources identify the 52nd edition, more than 90 invited speakers, over 50 sessions, and the next April 25-30, 2027 dates. | | Thin-film deposition, coatings, characterization, surface engineering, tribology, manufacturing, and semiconductor-adjacent process technology. 監視テーマ: thin-film deposition, PVD, CVD, ALD, coatings, surface engineering, characterization, manufacturing, exhibition ecosystem |
| CLEO Conference on Lasers and Electro-Opticsロジック / デバイス / プロセス統合 Optica / IEEE Photonics Society / APS Division of Laser Science | 会期開始 2027-05-02 279日後 2027-05-02〜06 / Long Beach Convention Center, Long Beach, California, US Long Beach Convention Center / Long Beach, United States | rigorously peer-reviewed contributed talks + invited papers + technical sessions 公式CLEO siteで2027年5月2〜6日のLong Beach開催を確認。締切は次回Call for Papers公開後に別更新する。 | | lasers、electro-optics、photonics、integrated photonicsを対象にする光学・フォトニクス主要会議。光電融合、silicon photonics、optical I/O、co-packaged opticsの上流研究を確認する。 監視テーマ: integrated photonics, lasers, electro-optics, optical devices, silicon photonics, quantum photonics |
| IEEE HOST IEEE International Symposium on Hardware Oriented Security and Trust回路 / システム / 設計自動化 IEEE Computer Society / IEEE HOST Organizing Committee | 会期開始 2027-05-03 280日後 2027-05-03 to 2027-05-06 / Washington, DC, United States Washington, DC, United States / Washington, DC, United States | IEEE HOST accepts original contributions through its official call for papers. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official HOST 2027 material identifies the Washington, DC cycle and organizing committee. Completed HOST 2025 official sources supply reviewed committee, speaker, sponsor, and series-history evidence. | | Hardware security, semiconductor supply-chain assurance, secure IC design and verification, trust, cryptography, embedded systems, test, and security assurance. 監視テーマ: hardware security, root of trust, trusted IC, secure SoC, verification, supply-chain assurance, cryptography, Intel, Qualcomm, Synopsys, Cadence |
| PCIM PCIM Expo & Conferenceパワー半導体 / Wide-Bandgap Mesago Messe Frankfurt | 会期開始 2027-05-11 288日後 2027-05-11〜13 / Nuremberg, Germany Nuremberg, Germany / Nuremberg, Germany | conference abstract + full manuscript PCIM公式ページで2027年5月11〜13日のNuremberg開催を確認。締切は次回CFP公開後に別更新する。 | | power semiconductors、thermal management、packaging reliability、converters、drives、renewables、grid を一気に追える。 監視テーマ: power semiconductors, thermal, packaging reliability, converters, drives, grid, AI |
| CS MANTECH International Conference on Compound Semiconductor Manufacturing Technologyパワー半導体 / Wide-Bandgap CS MANTECH | 会期開始 2027-05-17 294日後 2027-05-17〜20 / Sandestin resort, Northwest Florida, US Sandestin resort, Northwest Florida / Sandestin, United States | 2-page abstract PDF / accepted author full paper up to 4 pages / Technical Digest / Session Chair review and feedback 公式homeで2027年5月17〜20日のSandestin開催を確認。締切は次回Authors/CFP更新後に別更新する。 | | compound semiconductor manufacturingを軸に、GaN HEMT、reliability、wafer processing、advanced packaging、heterogeneous integration、RF/mmWave、optoelectronics、power conversionまで確認できる。 監視テーマ: GaN HEMT, compound manufacturing, wafer processing, reliability, advanced packaging, heterogeneous integration, RF/mmWave, optoelectronics, power conversion |
| EIPBN International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication露光 / パターニング / 配線 / 量産 EIPBN | 会期開始 2027-05-25 302日後 2027-05-25〜28 / DoubleTree Resort by Hilton Hotel Paradise Valley, Scottsdale, Arizona, US DoubleTree Resort by Hilton Hotel Paradise Valley / Scottsdale, United States | 1-page abstract + optional figure page 公式EIPBNページで2027年5月25〜28日のScottsdale開催を確認。締切は次回CFP公開後に別更新する。 | | e-beam、ion beam、optical lithography、nanoimprint、resist、metrology、atomically precise fabrication を横断できる。 監視テーマ: e-beam, ion beam, optical lithography, nanoimprint, resist, metrology, nanofabrication |
| ECTC IEEE Electronic Components and Technology Conference実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society | 会期開始 2027-06-01 309日後 2027-06-01〜04 / Aurora, Colorado, US Aurora, Colorado / Aurora, United States | abstract submission + accepted contribution manuscript IEEE EPS公式conference listで2027年6月1〜4日のAurora開催を確認。締切は次回CFP反映時に別更新する。 | | advanced packaging の主会議で、hybrid bonding、chiplet、substrate、thermal、assembly process を広く確認できます。 監視テーマ: hybrid bonding、chiplet、substrate、thermal、assembly reliability |
| ITherm IEEE ITherm Conference実装 / 先端パッケージ / 3D integration IEEE Electronics Packaging Society | 会期開始 2027-06-01 309日後 2027-06-01〜04 / Aurora, Colorado, US Aurora, Colorado / Aurora, United States | extended abstract + draft paper + final IEEE paper IEEE EPS公式conference listで2027年6月1〜4日のAurora開催を確認。締切は次回CFP反映時に別更新する。 | | thermal、thermomechanical reliability、advanced packaging、liquid cooling、data center cooling、power electronics cooling を横断できる。 監視テーマ: thermal management, liquid cooling, advanced packaging, data centers, reliability, power electronics, digital twins |
| ICM International Conference on MagnetismMemory / Reliability / Failure Physics ICM 2027 Organizing Committee / AIP Publishing / IEEE Magnetics Society / IUPAP support | 会期開始 2027-06-14 322日後 2027-06-14〜2027-06-18 / Puerto Rico Convention Center, San Juan, Puerto Rico Puerto Rico Convention Center / San Juan, Puerto Rico | Official ICM 2027 pages identify an abstract submissions page for the June 14-18, 2027 San Juan cycle. The reviewed DAC型signal uses official ICM 2024 committee, plenary/semi-plenary speaker, sponsor, and program context sources. Official ICM 2027 pages identify the 23rd International Conference on Magnetism, June 14-18, 2027 in San Juan, sponsored jointly by AIP Publishing and IEEE Magnetics Society with IUPAP support. Official ICM 2024 pages provide reviewed committee, plenary/semi-plenary program, sponsor, web-app, abstract, publication, and history/edition evidence. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | fundamental and applied magnetism, spintronics, magnetic recording, magnetic sensors, quantum materials, magnetic devices, and experimental techniquesを確認できる。 監視テーマ: spintronics, magnetic memory, magnetic recording, magnetic sensors, quantum materials, magnetic devices, cryogenic measurement, magnetics instrumentation, research publishers |
| ALD/ALE AVS International Conference on Atomic Layer Deposition and Atomic Layer Etching Workshop露光 / パターニング / 配線 / 量産 AVS | 会期開始 2027-06-20 328日後 2027-06-20〜23 / Dresden, Germany Dresden, Germany / Dresden, Germany | 2,700-character abstract + optional 1-page supplemental PDF 公式ALD/ALE 2027ページで2027年6月20〜23日のDresden開催を確認。締切は次回deadline refreshで別更新する。 | | ALD と ALE の材料、装置、selectivity、surface chemistry、manufacturing analytics を深く追える。 監視テーマ: ALD, ALE, selective processing, atomic layer cleaning, metrology, AI for manufacturing |
| Transducers International Conference on Solid-State Sensors, Actuators and Microsystemsロジック / デバイス / プロセス統合 Transducer Research Foundation / IEEE MEMS Technical Community | 会期開始 2027-06-20 328日後 2027-06-20〜24 / Stockholm Waterfront, Stockholm, Sweden Stockholm Waterfront / Stockholm, Sweden | initial abstract PDF + manuscript + late news / open poster tracks 公式Transducers 2027 siteとSave the Date flyerで2027年6月20〜24日のStockholm開催を確認。締切は別更新する。 | | MEMS、microsensors、microactuators、micro/nano systems、physical / chemical / biological transducers、microfabrication and packagingを横断して確認できる。 監視テーマ: MEMS sensors, microactuators, microsystems, RF MEMS, resonators, bio/chemical/physical sensors, microfluidics, energy harvesting, packaging |
| VLSI Symposium on VLSI Technology and Circuitsロジック / デバイス / プロセス統合 IEEE / JSAP | 会期開始 2027-06-20 328日後 2027-06-20〜24 / Rihga Royal Hotel, Kyoto, Japan Rihga Royal Hotel, Kyoto / Kyoto, Japan | regular paper + late news 公式Future Symposiaで2027年6月20〜24日の京都開催を確認。締切は次回CFP公開後に別更新する。 | | device と circuit が同じ program に並ぶ会議で、DTCO / STCO の動きと near-term product 化の温度差を確認できます。 監視テーマ: logic-memory co-optimization、advanced logic、memory scaling、circuit integration |
| EMPC European Microelectronics & Packaging Conference実装 / 先端パッケージ / 3D integration IMAPS Europe | 会期開始 2027-09-14 414日後 2027-09-14 to 2027-09-16 / Ingolstadt, Germany Venue to be announced / Ingolstadt, Germany | Official completed-cycle sources document abstract selection; full-conference peer review remains conservatively unconfirmed. IMAPS Europe announces September 14-16, 2027 in Ingolstadt; detailed submission milestones remain pending. | | Microelectronics packaging, interconnection, assembly, reliability, materials, manufacturing, and long-term academic solutions. 監視テーマ: advanced packaging, interconnect, assembly, reliability, manufacturing, IMAPS Europe, Murata, European packaging ecosystem |
| MRM Materials Research Meetingロジック / デバイス / プロセス統合 The Materials Research Society of Japan (MRS-J) | 会期開始 2027-12-13 504日後 2027-12-13〜17 / Kobe International Conference Center & Exhibition Hall and Kobe Portopia Hotel, Kobe, Japan Kobe International Conference Center & Exhibition Hall and Kobe Portopia Hotel / Kobe, Japan | English abstract PDF submission through the online system; notification of acceptance follows peer review; oral/poster/late-breaking presentations are scheduled in Confit 公式MRM2025 siteでMRM2027は2027年12月13〜17日にKobeで開催予定と確認。締切は次回CFP公開後に別更新する。 | | advanced materials、device-development materials、quantum/nanomaterials、oxide thin films、plasma processing、data-driven materials、energy materials、water science、soft/bio materialsを横断して確認できる。 監視テーマ: nanomaterials, quantum materials, oxide thin films, plasma processing, perovskites, data-driven materials, energy materials, materials characterization |
| NSREC IEEE Nuclear and Space Radiation Effects ConferenceMemory / Reliability / Failure Physics IEEE Nuclear and Plasma Sciences Society (NPSS) Radiation Effects Steering Group (RESG) | 会期終了 2026-07-24 3日前 2026-07-20〜24 / Puerto Rico Convention Center, San Juan, Puerto Rico, USA Puerto Rico Convention Center / San Juan, United States | Official NSREC 2026 call for papers uses a two-to-four page summary submission; the Technical Program Committee determines final presentation category, and accepted technical-program papers are expected to be submitted to IEEE Transactions on Nuclear Science for standard full peer review. Official NSREC 2026 pages list a paper summary deadline of 2026-02-06 and a July 20-24, 2026 conference at the Puerto Rico Convention Center in San Juan, with oral/poster technical sessions, Radiation Effects Data Workshop, short course, and industrial exhibit. | | radiation effects in electronic and photonic materials, devices, circuits, sensors, systems, semiconductor processing technology, and radiation-tolerant device / integrated-circuit design techniquesを確認できる。 監視テーマ: single-event effects, total ionizing dose, displacement damage, rad-hard ICs, FinFET / GaN / SiC reliability, photonic devices, space electronics |
| IVNC International Vacuum Nanoelectronics Conferenceロジック / デバイス / プロセス統合 Division of Future Vacuum Electronics, Japan Society of Vacuum and Surface Science | 最終原稿締切 2026-10-15 80日後 2026-07-13〜17 / Hitachi Baba Memorial Hall, Tokyo, Japan Hitachi Baba Memorial Hall / Tokyo, Japan | 1-page A4 PDF short abstract with affiliations; program committee review; JVST B post-conference manuscript route 公式abstract pageは1-page A4 PDF short abstract、authors names and affiliations、program committee review、acceptance notification around April 2, 2026を案内している。 | | vacuum electron and ion devices、electron emission、vacuum nanoelectronics、wide-bandgap semiconductor cathodes、field emitter arrays、X-ray / imaging、microscopy and surface analysisを確認できる。 監視テーマ: vacuum nanoelectronics, field emission, electron sources, ion sources, wide-bandgap semiconductor cathodes, GaN photocathodes, X-ray sources, microscopy, harsh-environment devices |
| ICMBE International Conference on Molecular Beam Epitaxyロジック / デバイス / プロセス統合 ICMBE 2026 Organizing Committee / University of Michigan | 最終原稿締切 2027-01-15 172日後 2026-07-12〜16 / Sheraton Ann Arbor, Ann Arbor, Michigan, USA Sheraton Ann Arbor / Ann Arbor, United States | Abstract and extended abstract submission; acceptance notification in March 2026; presented papers may be submitted to JVST A peer review 公式Important Datesはabstract、extended abstract、late-news、conference datesを示し、JVST A pageはpresented papersのSpecial Topic Collection投稿とpeer reviewを案内する。 | | molecular beam epitaxy fundamentals、III-V / II-VI / IV / nitride / oxide growth、quantum and topological materials、2D materials、heterogeneous integration、heterostructures、nanostructures、MBE production topicsを確認できる。 監視テーマ: molecular beam epitaxy, compound semiconductors, Ga2O3, III-V on silicon, nitrides, oxides, 2D materials, quantum materials, topological materials, heterogeneous integration |
| IPFA IEEE International Symposium on the Physical and Failure Analysis of Integrated CircuitsMemory / Reliability / Failure Physics IEEE | 会期終了 2026-07-16 11日前 2026-07-13〜16 / Marina Bay Sands, Singapore Marina Bay Sands / Singapore, Singapore | accepted abstract + minimum 4-page full manuscript failure analysis を中心にしつつ memory、package、security まで入るので、不良解析の現場論点を直接拾いやすい。 | | physical failure analysis、memory reliability、package-level FA、ESD、hardware security、advanced diagnostics を追える。 監視テーマ: failure analysis, memory reliability, package FA, ESD, hardware security, diagnostics |
| AWAD Asia-Pacific Workshop on Advanced Semiconductor Devicesロジック / デバイス / プロセス統合 The Institute of Electronics and Information Engineers (IEIE), Korea / IEICE Electronics Society, Japan / IEEE EDS Seoul Section Chapter / Ajou University BK21 Intelligence Semiconductor Sensor Education-Research Program | 会期終了 2026-07-14 13日前 2026-07-12 to 2026-07-14 / Asti Hotel Busan, Busan, South Korea Asti Hotel Busan / Busan, South Korea | Official AWAD 2026 sources list paper submission, acceptance notification, author registration, advance registration, and an advance-program schedule. The graph uses official listed presentation rows with first listed affiliation organization where visible. Official AWAD 2026 pages identify the July 12-14, 2026 Busan cycle, May 7 final paper-submission deadline, May 21 acceptance notification, June 10 author-registration deadline, committee rows, advance-program listed presentation rows, sponsored-by listings, organizer rows, and since-1993 / 33rd-series history evidence. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Advanced semiconductor devices and materials, MOS logic and memory devices, characterization and simulation, quantum devices, compound semiconductors, optoelectronics, imagers, 2D materials, power devices, neuromorphic devices, and advanced packaging technologies. 監視テーマ: AWAD Korea-Japan device workshop, MOS logic and memory, compound semiconductors, neuromorphic devices, physical AI devices, quantum devices, optoelectronics, AIST/Samsung/NTT/Toyota/NCT/Aixtal program participation, sponsored-by listing |
| AM-FPD International Workshop on Active-Matrix Flatpanel Displays and Devicesロジック / デバイス / プロセス統合 International Society of Functional Thin Film Materials & Devices / AM-FPD Committee | 会期終了 2026-07-10 17日前 2026-07-07 to 2026-07-10 / Ryukoku University Fukakusa Campus Jojukan, Kyoto, Japan Ryukoku University Fukakusa Campus Jojukan / Kyoto, Japan | Official AM-FPD 2026 sources identify paper submission / camera-ready handling, acceptance notice, late-news submission, electronic proceedings, IEEE Xplore publication, and J-EDS / ECS JSS endorsement-letter consideration for selected papers. Official AM-FPD 2026 pages identify the July 7-10, 2026 Ryukoku University Kyoto cycle, March 31 camera-ready submission deadline, acceptance notice by the end of April, May 7 late-news deadline, official committee rows, advance-program presentation rows, sponsorship / technical sponsorship / cooperation listings, and official history from 1994. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | active-matrix flatpanel displays, TFT technologies, display materials, flexible electronics, photovoltaics, thin-film devices, and FPD-related materials signalsを確認できる。 監視テーマ: active-matrix displays, TFT backplanes, oxide semiconductors, flexible electronics, automotive displays, perovskite photovoltaics, thin-film materials, IEEE Xplore proceedings, Japanese display ecosystem |
| ISVLSI IEEE Computer Society Annual Symposium on VLSI回路 / システム / 設計自動化 IEEE Computer Society / IEEE Technical Committee on VLSI | 会期終了 2026-07-10 17日前 2026-07-07〜10 / ITC Sonar, Kolkata, India ITC Sonar, Kolkata / Kolkata, India | 6-page full paper + blind review + IEEE conference proceedings ISVLSI 2026公式CFPはoriginal unpublished full paper、blind review、IEEE Xplore収録候補を明示しているため、VLSI隣接の査読付きB帯として独立ID化する。 | | VLSI circuits、system design、CAD、FPGA、post-CMOS、hardware security、AI/IoT向けVLSIを横断するIEEE系専門会議。 監視テーマ: VLSI circuits, CAD, FPGA, SoC, hardware security, post-CMOS, AI accelerators |
| IEEE-NANO IEEE International Conference on Nanotechnologyロジック / デバイス / プロセス統合 IEEE Nanotechnology Council / Nanjing University / Nanjing University of Aeronautics and Astronautics / Southeast University | 会期終了 2026-07-08 19日前 2026-07-05〜08 / Nanjing International Conference Hotel, Nanjing, China Nanjing International Conference Hotel / Nanjing, China | Official IEEE-NANO 2026 submission pages list full-paper submission, presentation-only abstract submission, Technical Program Committee decisions, final paper submission, and PaperCept submission links. Official home lists full paper deadline extended to 2026-03-15, decisions 2026-04-22, final paper submission 2026-05-10, presentation-only abstract deadline 2026-04-20, and abstract decisions 2026-05-01. | | nanorobotics, nano-biomedicine, nanofabrication, nano-optics, spintronics, nanoelectronics, nanosensors, nanomaterials, nanopackaging, nanomagnetics, chiplets, plasma nanotechnologiesを横断して確認できる。 監視テーマ: nanoelectronics, nanofabrication, spintronics, nanomaterials, nanosensors, nanopackaging, heterogeneous integration and chiplets, plasma nanotechnologies |
| IOLTS IEEE International Symposium on On-Line Testing and Robust System DesignMemory / Reliability / Failure Physics Politecnico di Torino / IEEE CEDA / IEEE Computer Society TTTC | 会期終了 2026-07-03 24日前 2026-07-01〜2026-07-03 / Polignano a Mare (BA), Italy Polignano a Mare (BA), Italy / Polignano a Mare, Italy | Official IOLTS 2026 pages identify paper submission, final paper, author notification, camera-ready preparation, proceedings access, best accepted papers, and a public technical program with presentation rows. Official IOLTS 2026 sources identify the July 1-3, 2026 Polignano a Mare cycle, March 1 abstract/authors deadline, March 8 full-paper deadline, April 26 author notification, visible committee rows, official technical-program affiliation rows, and IEEE / CEDA / IEEE Computer Society TTTC sponsor listings. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | on-line testing, robust system design, design-for-reliability, fault tolerance, self-test, runtime validation, hardware security, compute-in-memory reliability, AI accelerator reliabilityを確認できる。 監視テーマ: on-line testing, design-for-reliability, robust systems, self-test, runtime validation, hardware security, AI accelerator reliability, compute-in-memory reliability, fault-tolerant architectures |
| ISCA ACM/IEEE International Symposium on Computer Architecture回路 / システム / 設計自動化 ACM SIGARCH / IEEE Computer Society TCCA | 会期終了 2026-07-01 26日前 2026-06-27 to 2026-07-01 / Raleigh, North Carolina, United States Raleigh, North Carolina / Raleigh, United States | The official ISCA 2026 call for papers describes full-paper submission and peer review. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ISCA sources identify the 2026 Raleigh cycle and the completed 2025 program, committee affiliations, sponsor listing, technical sponsors, and proceedings. | | Computer architecture, processors, memory systems, accelerators, chips, systems, hardware/software co-design, and advanced computing. 監視テーマ: computer architecture, processors, memory, AI accelerators, chips, NVIDIA, Intel, AMD, Arm, Google, Microsoft, Samsung |
| EMC Electronic Materials Conferenceロジック / デバイス / プロセス統合 Electronic Materials Conference (EMC) Organizing Committee | 会期終了 2026-06-26 31日前 2026-06-24〜26 / The University of Michigan, Ann Arbor, Michigan, USA The University of Michigan / Ann Arbor, Michigan, United States | Official EMC 2026 Call for Papers invited researchers to submit work for presentation or publication; the page lists extended abstracts due February 20, 2026 and a Late News deadline April 24, 2026. Official CFP describes EMC as the premier annual forum on preparation, characterization, and applications of electronic materials, co-located with DRC during the same week, and lists topical sessions plus a poster session. | | electronic materials preparation, characterization, applications, nanoscale science, organic materials, oxide semiconductors, dielectrics, wide-bandgap semiconductors, and energy materialsを確認できる。 監視テーマ: electronic materials, wide-bandgap semiconductors, oxide semiconductors, organic materials, nanoscale science, energy storage and conversion materials, AI-enabled nanomaterials synthesis |
| ILCC International Liquid Crystal Conference (ILCC)ロジック / デバイス / プロセス統合 International Liquid Crystal Society / ILCC 2026 Organizing Committee | 会期終了 2026-06-26 31日前 2026-06-21 to 2026-06-26 / Université Laval, Québec City, Québec, Canada Université Laval / Pavillon Alexandre-Vachon / Québec City, Québec, Canada | Official ILCC 2026 sources identify abstract submission, paper acceptance notice, a detailed program PDF, Fourwaves schedule, and abstract-number presentation rows. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ILCC 2026 sources identify the June 21-26, 2026 Université Laval cycle, February 22, 2026 abstract deadline, March 2026 paper acceptance notice, May 8, 2026 early-bird presenting-author registration deadline, Scientific Board rows, detailed program PDF first-listed author affiliation rows, Fourwaves session cross-check, official Partners page logo/link rows, and ILCS history source. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Liquid crystals and soft matter spanning display materials, ferroelectric/nematic/smectic/cholesteric phases, photonics, AR/VR optics, organic electronics, sensors, optical modulation, adaptive optics, smart windows, liquid-crystal elastomers, soft robotics, topology, biological liquid crystals, synthesis, modeling, and characterization. 監視テーマ: International Liquid Crystal Conference, ILCC, International Liquid Crystal Society, liquid crystals, display materials, ferroelectric nematics, photonics, AR/VR optics, organic electronics, smart windows, liquid crystal elastomers, Université Laval, Kent State University, Taylor & Francis, ProtoXRD, Syndiant, Seurat Technologies, Meta, Merck Chemicals, and official detailed program PDF first-listed affiliation rows |
| DRC Device Research Conferenceロジック / デバイス / プロセス統合 Device Research Conference Committee | 会期終了 2026-06-24 33日前 2026-06-21〜24 / Ann Arbor, Michigan, US Ann Arbor, Michigan / Ann Arbor, United States | 1-page text + 1-page figures abstract、Late News 同形式 device physics 寄りの会議だが、lab-to-fab transition focus もあり、量産へ近づくデバイスの温度差を確認できる。 | | device science の古典的 flagship で、memory、power、WBG、heterogeneous integration、optoelectronic devices を広く追える。 監視テーマ: memory devices, power devices, wide-bandgap, heterogeneously integrated devices, optoelectronics, 2D materials |
| GLSVLSI ACM Great Lakes Symposium on VLSI回路 / システム / 設計自動化 ACM SIGDA / IEEE CEDA | 会期終了 2026-06-24 33日前 2026-06-22〜24 / Finger Lakes, New York, US Finger Lakes, New York / Finger Lakes, United States | 6-page full paper + blind review + ACM proceedings GLSVLSI 2026公式CFPはoriginal unpublished full-length paper、blind review、ACM publication導線を示すため、VLSI隣接の査読付きB帯として独立ID化する。 | | VLSI circuits、hardware design、AI hardware、IoT、CAD、testing、post-CMOS、hardware securityを地域専門会議として確認する。 監視テーマ: VLSI circuits, hardware design, AI hardware, CAD, testing, hardware security |
| ICICDT International Conference on IC Design and Technology回路 / システム / 設計自動化 Fraunhofer Institute for Photonic Microsystems IPMS | 会期終了 2026-06-24 33日前 2026-06-22 to 2026-06-24 / Dresden, Germany Fraunhofer IPMS / Dresden, Germany | ICICDT technical program. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ICICDT 2026 sources identify the completed Dresden programme, committee, sponsor list, and 23rd-edition history. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Integrated-circuit design, semiconductor technology, chiplets, devices, circuits, design technology co-optimization, packaging, and systems. 監視テーマ: chiplets, DTCO, CMOS, GAA, 3D integration, RFIC, memory, AI hardware, Infineon, GlobalFoundries, Tokyo Electron |
| Cat-CVD Cat-CVD研究会 / Cat-CVD Workshopロジック / デバイス / プロセス統合 Cat-CVD研究会 / 第23回Cat-CVD研究会実行委員会 | 会期終了 2026-06-19 38日前 2026-06-18〜2026-06-19 / Former Dalian Route Terminal, Kitakyushu, Japan Former Dalian Route Terminal, Mojiko / Kitakyushu, Japan | The official current-cycle submission page accepts a PDF presentation abstract and oral/poster format requests. The public source does not state a paper peer-review process, so peer review remains review-unclear. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official sources identify the June 18-19, 2026 Kitakyushu cycle, May 15 abstract deadline, four committee rosters, current S/O/P presentation affiliations, and the complete host/co-host/supporter/advertising-supporter listing. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Catalytic chemical vapor deposition, hot-wire CVD, thin-film deposition, Si/SiC/diamond devices, passivation, radical surface treatment, doping, solar cells, sensors, barrier films, equipment development, and semiconductor process applications. 監視テーマ: Cat-CVD, HWCVD, thin films, passivation, silicon nitride, silicon oxide, SiC, diamond devices, radical treatment, ALD/CVD process, ULVAC, Tokyo Electron, Mitsubishi Electric, Panasonic, ExtenD, Deevec, Kisoh Seicho, ALS Technology, Techno Research, Komiyama Electron |
| M&BE International Conference on Molecular Electronics and Bioelectronicsロジック / デバイス / プロセス統合 The Division of Molecular Electronics and Bioelectronics, The Japan Society of Applied Physics (JSAP) | 会期終了 2026-06-17 40日前 2026-06-15 to 17 / Kobe International Conference Center, Hyogo, Japan Kobe International Conference Center / Kobe, Japan | Official M&BE12 submission page states that one-page A4 abstracts were submitted through the online system; official M&BE12 program page links oral and poster program PDFs used for accepted-presentation affiliation signals. Official M&BE12 submissions page shows oral abstract submission through 2026-04-12, poster abstract submission through 2026-05-11, and the 2026 Kobe conference on 2026-06-15 to 2026-06-17. | | Molecular electronics and bioelectronics, including organic devices, functional materials, fabrication and characterization, biotechnology and medical applications, organic solar cells and energy harvesting, and perovskite / hybrid materials. 監視テーマ: molecular electronics, bioelectronics, organic semiconductors, organic devices, sensors, perovskites, organic photovoltaics, functional materials |
| EDSSC IEEE International Conference on Electron Devices and Solid-State Circuits回路 / システム / 設計自動化 IEEE Guangzhou Section / South China University of Technology / IEEE Hong Kong ED/SSC Joint Chapter | 会期終了 2026-06-12 45日前 2026-06-09〜12 / Guangzhou, China South China University of Technology / Guangzhou / Guangzhou, China | Official EDSSC 2026 program states every accepted manuscript underwent rigorous peer review, and official CFP/program sources say accepted and presented papers are submitted to IEEE Xplore and indexed by EI Compendex. Official EDSSC 2026 sources identify the June 9-12, 2026 Guangzhou cycle, April 15 full-paper deadline, April 27 acceptance notification, official committee/program PDF, official Sponsors By logo block, and 17th-edition history signal. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | electron devices, solid-state circuits, nanoelectronics, memory, RF / microwave devices, power devices, analog / digital circuits, EDA / AI, sensors, and silicon photonicsを確認できる。 監視テーマ: nanoelectronics, memory devices, RF and microwave devices, wide-bandgap power devices, analog circuits, digital circuits, EDA and AI, sensors, silicon photonics |
| IEEE MTT-S IMS IEEE MTT-S International Microwave Symposium回路 / システム / 設計自動化 IEEE Microwave Theory and Technology Society (MTT-S) | 会期終了 2026-06-12 45日前 2026-06-07 to 2026-06-12 / Boston, Massachusetts, United States Thomas M. Menino Convention & Exhibition Center / Boston, United States | IEEE MTT-S International Microwave Symposium technical program. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official IMS2026 sources identify the Boston cycle, published technical program, Steering Committee, MTT-S sponsor, complete exhibitor list, and series history. | | RF, microwave, millimeter-wave, terahertz, integrated circuits, packaging, materials, test and measurement, and RF systems. 監視テーマ: RFIC, microwave circuits, mm-wave, terahertz, semiconductor devices, packaging, test and measurement, RF systems, Qorvo, Skyworks, Analog Devices, Synopsys, Raytheon |
| PVSC IEEE Photovoltaic Specialists Conferenceロジック / デバイス / プロセス統合 IEEE Electron Devices Society / IEEE PVSC Organizing Committee | 会期終了 2026-06-12 45日前 2026-06-07 to 2026-06-12 / Hyatt Regency New Orleans, New Orleans, Louisiana, United States Hyatt Regency New Orleans / New Orleans, United States | Official PVSC 54 Program Chair invitation requests a 3-page maximum evaluation abstract plus a 300-word short abstract. It states technical evaluation abstracts are reviewed to decide acceptance and oral versus poster format, with optional longer proceedings manuscript by May 29, 2026. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official PVSC 54 sources identify the June 7-12, 2026 New Orleans cycle, January 16, 2026 abstract deadline, late-March acceptance notice timing, May 29, 2026 optional proceedings manuscript deadline, current organizing committee, public technical program, official technical sponsors, sponsor/exhibit prospectus, and official PVSC history. | | Photovoltaic materials and devices, III-V and concentrator technologies, crystalline silicon, CdTe and II-VI materials, perovskite and tandem solar cells, space photovoltaics, PV modules, reliability, characterization, manufacturing, and PV systems. Relevant to semiconductor devices, compound materials, wide-bandgap materials, photonics, module reliability, and manufacturing equipment research. 監視テーマ: PVSC, photovoltaics, solar cells, III-V tandem PV, CdTe, silicon PV, perovskites, TOPCon, heterojunction, space PV, PV characterization, PV module reliability, PV manufacturing equipment, First Solar, Qcells, DNV, Sinton Instruments, Semilab, Tau Science, NREL, Fraunhofer ISE, and official first-listed affiliation rows |
| RFIC IEEE Radio Frequency Integrated Circuits Symposium回路 / システム / 設計自動化 IEEE Microwave Theory and Technology Society | 会期終了 2026-06-09 48日前 2026-06-07〜09 / Thomas Michael Menino Convention and Exhibition Center, Boston, Massachusetts, US Thomas Michael Menino Convention and Exhibition Center / Boston, United States | technical paper submission / symposium presentation ISSCC/CICCよりRF集積回路へ寄せて、通信・ミリ波・高周波SoCの実装シグナルを追える。 | | RF integrated circuits、mmWave、wireless front-end、data converters、power amplifier、wireline/RF mixed-signalを確認する。 監視テーマ: RFIC, mmWave, wireless, PA, LNA, data converters, silicon RF |
| IITC IEEE International Interconnect Technology Conference露光 / パターニング / 配線 / 量産 IEEE | 会期終了 2026-06-04 53日前 2026-06-01〜04 / San Jose, California, US San Jose, California / San Jose, United States | paper submission / short course interconnect に軸を絞った会議なので、配線抵抗、barrier、liner、integration change を追うときの一次監視先です。 | | interconnect に特化しており、BEOL、MOL、new conductor、low-k、packaging connection を狭く深く追えます。 監視テーマ: BEOL、MOL、new conductor、low-k、advanced interconnect |
| IWLS International Workshop on Logic & Synthesis回路 / システム / 設計自動化 IWLS Organizing Committee | 会期終了 2026-05-31 57日前 2026-05-29 to 2026-05-31 / Hong Kong Marco Polo Hongkong Hotel / Hong Kong, China | Official CFP requests complete original papers and states double-blind review. Graph data is hydrated only from PostgreSQL. Official 2026 sources identify March 20 abstract, March 27 paper, May 3 acceptance, and May 20 final-paper milestones. | | Logic synthesis, verification, optimization, machine learning for design automation, and hardware security. 監視テーマ: logic synthesis, EDA, verification, optimization, hardware security, Synopsys, AMD, Cadence, Huawei, IBM, Google, Siemens EDA |
| E-MRS Spring E-MRS Spring Meeting & Exhibitロジック / デバイス / プロセス統合 European Materials Research Society (E-MRS) | 会期終了 2026-05-29 59日前 2026-05-25〜29 / Convention & Exhibition Centre of Strasbourg, Strasbourg, France Convention & Exhibition Centre of Strasbourg / Strasbourg, France | Official practical information says submitted abstracts are reviewed by each symposium scientific committee, with acceptance and presentation mode notified by March 6, 2026. Official E-MRS 2026 Spring pages list the May 25-29 Strasbourg meeting, 24 parallel symposia, confirmed invited speakers on symposium pages, abstract deadline January 28, 2026, and exhibit/sponsorship listing rows. | | thin films、oxide films、photonic devices、ferroelectric thin films、neuromorphic technologies、photovoltaics、nanomaterials、energy materials、materials characterizationを横断して確認できます。 監視テーマ: thin-film processing, hybrid photonics, oxide and ferroelectric films, neuromorphic materials, photovoltaics, nanocarbons, materials instrumentation, exhibitors |
| CSW Compound Semiconductor Weekロジック / デバイス / プロセス統合 CSW Steering Committee / ISCS and IPRM communities | 会期終了 2026-05-28 60日前 2026-05-24〜28 / Kumamoto-Jo Hall, Kumamoto, Japan Kumamoto-Jo Hall / Kumamoto, Japan | CSW abstract submission + late news abstract + oral/poster program 公式CSW2026は52nd ISCSと37th IPRMのjoint venueで、abstract submission、late news、online program、Advance Program PDFを公開している。 | | ISCS と IPRM のjoint venueとして、compound semiconductors、III-V、nitride、optoelectronics、RF/high-frequency、power devices、materials growthを横断して確認できる。 監視テーマ: compound semiconductors, III-V, nitride semiconductors, optoelectronics, RF devices, power devices, epitaxy, materials growth |
| ECS Meeting The Electrochemical Society Meetingロジック / デバイス / プロセス統合 The Electrochemical Society (ECS) | 会期終了 2026-05-28 60日前 2026-05-24〜2026-05-28 / Seattle Convention Center - Arch and Sheraton Grand Seattle, Seattle, WA, United States Seattle Convention Center - Arch and Sheraton Grand Seattle / Seattle, United States | Official ECS 249th Meeting deadlines identify abstract submission, organizer preliminary abstract review, online abstract scheduling, technical-program finalization, and notification to presenting authors of abstract acceptance or rejection. Official ECS 249th Meeting deadlines list meeting abstracts due to ECS on 2025-12-19, technical program final on 2026-02-13, notification to presenting authors of abstract acceptance or rejection on 2026-02-16, and the Seattle meeting on 2026-05-24 to 2026-05-28. | | electrochemistry、solid state science、battery、fuel cell、electrolysis、electrochemical deposition、electronic / photonic devices、sensors、CMPを横断的に確認できる。 監視テーマ: electrochemistry, solid state science, batteries, fuel cells, electrolyzers, electrochemical deposition, CMP, sensors, electronic and photonic devices, exhibitors |
| IPRM International Conference on Indium Phosphide and Related Materialsロジック / デバイス / プロセス統合 Compound Semiconductor Week / IPRM International Steering Committee | 会期終了 2026-05-28 60日前 2026-05-24〜28 / Kumamoto-Jo Hall, Kumamoto, Japan Kumamoto-Jo Hall / Kumamoto, Japan | CSW abstract submission + late news abstract + oral/poster program CSWがISCS/IPRMを束ねるため、CSWカードだけでは見えにくいInPユーザー向け入口として独立IDを持たせる。 | | InP and related materials、III-V photonic components、high-frequency electronics、compound semiconductor materialsをCSW内で確認する。 監視テーマ: InP, III-V, photonic components, high-frequency electronics, compound semiconductors, optoelectronics |
| ISPSD International Symposium on Power Semiconductor Devices and ICsパワー半導体 / Wide-Bandgap IEEE | 会期終了 2026-05-28 60日前 2026-05-24〜28 / Las Vegas, Nevada, US Las Vegas, Nevada / Las Vegas, United States | 4-page full paper power semiconductor devices と ICs を同時に見るので、材料・構造と駆動側要求を同じ場で比較できます。 | | power device の回路、構造、材料、module まで対象にするため、Si、SiC、GaN の差を同じ場で比較できます。 監視テーマ: power IC、SiC、GaN、module、high-voltage device |
| ISCAS IEEE International Symposium on Circuits and Systems回路 / システム / 設計自動化 IEEE Circuits and Systems Society (IEEE CASS) | 会期終了 2026-05-27 61日前 2026-05-24〜27 / Shanghai International Convention Center, Shanghai, China Shanghai International Convention Center / Shanghai, China | Final-submission system; accepted papers must be registered and presented for proceedings publication. Official author instructions say submissions are not double-blind and use a maximum five-page manuscript including references. Official ISCAS 2026 author instructions list a full-paper submission deadline of 2025-10-12 and decision notification of 2026-01-19. The official final program reports 1858 submissions, 869 regular papers in the 1009-paper final program, and 122 lecture plus 72 poster sessions. | | circuits and systems、AI/deep learning、ultra-low-power circuits、communications、power and energy circuits、neuromorphic systems、sensors、visual signal processing、CAS educationを横断して確認できる。 監視テーマ: AI circuits, ultra-low-power circuits, mixed-signal systems, power and energy circuits, neuromorphic engineering, sensors, hardware security, visual signal processing |
| JSM Microscopy Annual Meeting Japanese Society of Microscopy Annual Meetingロジック / デバイス / プロセス統合 Japanese Society of Microscopy / 82nd Annual Meeting Executive Committee | 会期終了 2026-05-27 61日前 2026-05-25 to 2026-05-27 / Sendai International Center Exhibition Building, Sendai, Japan Sendai International Center Exhibition Building / Sendai, Japan | Official 2026 presentation application page states that presenters register first, prepare an abstract manuscript with the prescribed template, convert it to PDF, and upload the abstract PDF through the application system. Official 2026 presentation application page lists the presentation application period from 2025-12-16 to the extended deadline 2026-02-09 23:59. The official home lists the 82nd Annual Meeting on 2026-05-25 to 2026-05-27 at Sendai International Center Exhibition Building. | | electron microscopy, optical microscopy, STEM/TEM, advanced imaging, sample preparation, NanoTerasu synchrotron imaging, AI/ML microscopy, and materials / device analysis signalsを確認できる。 監視テーマ: electron microscopy, STEM, TEM, metrology, inspection, sample preparation, synchrotron imaging, AI microscopy, materials analysis, microscopy suppliers |
| SPSJ Annual 高分子学会年次大会 / SPSJ Annual Meetingロジック / デバイス / プロセス統合 The Society of Polymer Science, Japan | 会期終了 2026-05-15 73日前 2026-05-11 to 2026-05-15 / online; final-day award session at Institute of Science Tokyo O-okayama Campus, Tokyo, Japan Online; award session at Institute of Science Tokyo O-okayama Campus Digital Multipurpose Hall / Online / Tokyo, Japan | Official 第75回 guidance identifies research-presentation application, program committee adoption/program organization authority, proceedings manuscript posting workflow, and oral/on-demand presentation formats. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals and uses current-cycle official oral/on-demand program PDFs for first-listed affiliation rows. Official SPSJ sources identify the May 11-15, 2026 online cycle, January 30, 2026 research-presentation application deadline, March 5, 2026 proceedings manuscript posting deadline, current operation/program committee, public oral/on-demand program PDFs, and official online product-exhibit/career-cafe/live-seminar listing rows. | | Polymer science and materials research covering polymer synthesis, structure/physics, functions, bio-related polymers, environmental polymers, organic semiconductor and optoelectronic materials, polymer electrolytes, energy materials, photoresist and lithography-adjacent materials, analysis/measurement, materials informatics, and industry-academia communication. Relevant to semiconductor process materials, packaging, photonics, organic electronics, device materials, and manufacturing support technologies. 監視テーマ: SPSJ Annual Meeting, 高分子学会年次大会, polymer electronics, polymer semiconductors, photoresist-adjacent polymers, materials informatics, chemical industry DX, product exhibitors, career cafe, live streaming seminar, Kao, Sekisui Chemical, Toagosei, Taiyo Holdings, Sumitomo Chemical, UBE, Epson Technoform, and official current-cycle first-listed affiliation rows |
| ASMC SEMI Advanced Semiconductor Manufacturing Conference露光 / パターニング / 配線 / 量産 SEMI | 会期終了 2026-05-14 74日前 2026-05-11〜14 / Hilton Albany, Albany, New York, US Hilton Albany / Albany, United States | abstract submission + draft manuscript + final manuscript abstract から final manuscript まで author kit が細かく出ており、Breaking News 枠もあるので量産寄りの更新点を拾いやすい会議です。 | | 量産プロセス、process control、yield、factory operation を主題にするpeer-reviewed technical manufacturing conferenceで、Fab実務の国際主要会議として確認します。 監視テーマ: APC、advanced patterning、metrology、smart manufacturing、yield enhancement、wafer level packaging |
| IMW IEEE International Memory WorkshopMemory / Reliability / Failure Physics IEEE Electron Devices Society | 会期終了 2026-05-13 75日前 2026-05-10〜13 / Leuven, Belgium Leuven, Belgium / Leuven, Belgium | single final paper submission、late news あり workshop 形式なので community が凝縮されており、memory だけを追いたいときの一次監視先として有効な会議です。 | | memory に特化しており、DRAM、NAND、emerging memory の構造、device、system impact を確認できます。 監視テーマ: DRAM、NAND、emerging memory、memory scaling、system impact |
| Display Week Display Week / SID International Symposium, Seminar and Exhibitionロジック / デバイス / プロセス統合 Society for Information Display (SID) | 会期終了 2026-05-08 80日前 2026-05-03 to 2026-05-08 / Los Angeles Convention Center, Los Angeles, California, United States Los Angeles Convention Center / Los Angeles, California, United States | Official Display Week authors/presenters page identifies abstract/technical summary submission, late-news technical summary submission, accept/reject letters, revised digest paper submission, oral/poster presenter guidance, and the Symposium as a peer-reviewed technical program. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official Display Week 2026 sources identify the May 3-8, 2026 Los Angeles cycle, December 1, 2025 abstracts/technical summaries deadline, January 20, 2026 late-news technical summaries deadline, January 31, 2026 accept/reject letters, March 1, 2026 revised digest paper submission, 675+ technical papers/sessions, hundreds of peer-reviewed papers across eight tracks, Program Committee rows, Executive Committee rows, Event Sponsor logo rows, and SID Company history source. | | Display technology research and industry sessions spanning OLED, MicroLED, quantum-dot displays, display electronics, active-matrix backplanes, manufacturing, measurement, AR/VR/MR, AI for displays, heterogeneous integration on glass substrates, sustainable display materials, and exhibitor/sponsor signals. Relevant to semiconductor photonics, thin-film devices, advanced packaging, electronic materials, sensors, and display manufacturing equipment. 監視テーマ: Display Week, SID International Symposium, OLED, MicroLED, quantum-dot displays, active-matrix backplanes, display electronics, display manufacturing, heterogeneous integration on glass, glass interposers, AR/VR/MR displays, BOE, TCL CSOT, Tianma, Samsung Display, LG Display, Apple, Meta, Google, Applied Materials, Intel, Universal Display Corporation, Visionox, and official Program Committee affiliation rows |
| MRS Spring MRS Spring Meeting & Exhibitロジック / デバイス / プロセス統合 Materials Research Society (MRS) | 会期終了 2026-05-01 87日前 2026-04-26〜2026-05-01 / Honolulu, Hawai'i, United States Honolulu, Hawai'i / Honolulu, United States | Official 2026 call-for-papers page lists topical clusters and says the 2026 Spring Meeting program would be posted by late February; official symposium sessions page says the full technical program is live and links the Abstract Book PDF. The official 2026 Symposium Organizer Handbook lists the abstract submission deadline as 2025-10-16, 11:59 pm ET. Official 2026 pages list the April 26 to May 1 Honolulu meeting, topical clusters, the live technical program, Abstract Book PDF, and symposium support recognition. The official 2026 Symposium Organizer Handbook lists the 2025-10-16 abstract deadline. The reviewed DAC型signal uses the completed 2026 Program Book and 2026 symposium support recognition source for program and sponsor graphs. | | materials science across electronics, optics and photonics, energy and sustainability, manufacturing, characterization, nanomaterials, quantum materials, soft materials, and structural / functional materialsを確認できる。 監視テーマ: semiconductor materials, electronics and photonics, nanomaterials, quantum materials, manufacturing, materials characterization, energy materials, instrument and equipment suppliers |
| VTS IEEE VLSI Test SymposiumMemory / Reliability / Failure Physics IEEE Test Technology Technical Council | 会期終了 2026-04-29 89日前 2026-04-27〜29 / Napa, California, US Napa, California / Napa, United States | regular paper PDF + late-breaking results + innovative practices VTS は test/security/reliability の研究会議として、ITC より学術寄りの test 技術変化を抽出しやすい。 | | test、validation、yield、reliability、security を microelectronic circuits and systems の研究側から確認する。 監視テーマ: silicon lifecycle, yield, reliability, security, photonic circuits test, 3D integration test |
| CICC IEEE Custom Integrated Circuits Conference回路 / システム / 設計自動化 IEEE Solid-State Circuits Society / IEEE Circuits and Systems Society | 会期終了 2026-04-23 95日前 2026-04-19〜23 / Hyatt at Olive 8, Seattle, Washington, US Hyatt at Olive 8 / Seattle, United States | 4-page regular paper + blind review SSCS と CAS の両方に近い実装寄り回路会議で、製品制約を含んだ設計テーマの比重が高い。 | | custom IC に寄せた回路会議で、analog、data converter、digital、power、wireless、wireline、biomedical まで追える。 監視テーマ: analog, digital IC, power management, wireline, wireless, biomedical, chiplets |
| ICEP-HBS International Conference on Electronics Packaging joined with Hybrid Bonding Symposium実装 / 先端パッケージ / 3D integration JIEP / IEEE EPS / IMAPS / SMTA | 会期終了 2026-04-18 100日前 2026-04-14〜18 / International Conference Center Hiroshima, Hiroshima, Japan International Conference Center Hiroshima / Hiroshima, Japan | 2-page abstract + 2-page final paper Hybrid Bonding Symposium と一体開催なので、bonding テーマを substrate、thermal、assembly reliability と同じ場で比較できる。 | | advanced packaging、hybrid bonding、materials and processes、thermal management、power electronics integration を広く対象にする。 監視テーマ: hybrid bonding, chiplet packaging, materials and processes, thermal, reliability |
| COOL Chips 29 IEEE Symposium on Low-Power and High-Speed Chips and Systems回路 / システム / 設計自動化 IEEE Computer Society technical committees / COOL Chips 29 Organizing Committee | 会期終了 2026-04-17 101日前 2026-04-15 to 2026-04-17 / Takeda Hall, The University of Tokyo, Tokyo, Japan Takeda Hall, The University of Tokyo / Tokyo, Japan | Official COOL Chips 29 guidance identifies reviewed six-page full papers, reviewed extended abstracts up to three pages, and separately reviewed poster abstracts. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 2026 sources identify the April 15-17 Tokyo cycle, February 16 extended paper/abstract deadline, March 13 acceptance notification, March 31 final-manuscript deadline, three committee sections, the completed final program, and four technical sponsor/cooperation rows. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Low-power and high-speed processor and system design, AI accelerators, memory systems, FPGA, vector processing, heterogeneous computing, quantum-classical systems, sensors, neuromorphic hardware, hardware security, and 3D integration. 監視テーマ: COOL Chips, low-power chips, high-speed chips, processors, AI accelerators, memory systems, FPGA, vector processing, heterogeneous systems, quantum computing, neuromorphic hardware, hardware security, 3D integration, Fujitsu, SK hynix, NVIDIA, NEC, Socionext, Hitachi, IBM, Sony Semiconductor Solutions |
| INTERMAG IEEE International Magnetics ConferenceMemory / Reliability / Failure Physics IEEE Magnetics Society | 会期終了 2026-04-17 101日前 2026-04-13〜17 / Manchester Central, Manchester, U.K. Manchester Central / Manchester, United Kingdom | Official INTERMAG 2026 call uses a two-page digest; accepted digests are published in IEEE Xplore with DOI, and full papers are published in IEEE Transactions on Magnetics subject to peer review. Official INTERMAG 2026 pages list the April 13-17, 2026 Manchester cycle, a two-page digest process, IEEE Xplore DOI publication for accepted digests, and invited/contributed oral plus poster sessions. | | fundamental and applied magnetism、spintronics、magnetic recording、magnetic sensors、integrated magneticsを、memory / reliability / device側の隣接signalとして確認できます。 監視テーマ: spintronics, MRAM-related devices, magnetic tunnel junctions, magnetic recording, magnetic sensors, integrated magnetics, altermagnets, magnetic materials |
| VLSI TSA International VLSI Symposium on Technology, Systems and Applications回路 / システム / 設計自動化 Industrial Technology Research Institute (ITRI) | 会期終了 2026-04-17 101日前 2026-04-13〜17 / Ambassador Hotel Hsinchu, Hsinchu, Taiwan Ambassador Hotel Hsinchu / Hsinchu, Taiwan | paper submission、IEEE Xplore 対応 final paper 台湾の量産・設計コミュニティの優先テーマを確認でき、TSA / DAT の scope が広いのが特徴です。 | | advanced process、heterogeneous integration、AI / quantum、next-generation memory を台湾の量産・設計論点としてまとめて追える会議です。 監視テーマ: advanced process、AI chip、heterogeneous integration、memory、yield、metrology |
| VLSI-DAT International Symposium on VLSI Design, Automation and Test回路 / システム / 設計自動化 Industrial Technology Research Institute (ITRI) | 会期終了 2026-04-17 101日前 2026-04-13〜17 / Ambassador Hotel Hsinchu, Hsinchu, Taiwan Ambassador Hotel Hsinchu / Hsinchu, Taiwan | regular paper submission + IEEE Xplore final paper 回路だけでなく設計自動化とテスト方法論が同じ場に入るので、設計フロー側の変化を conference 単位で比較できる。 | | EDA、AI for design automation、mixed-signal、memory、SoC、heterogeneous integration の設計論点を台湾圏の実装温度で追える。 監視テーマ: EDA, AI for design automation, mixed-signal, memory, SoC, heterogeneous integration |
| SiPhotonics IEEE Silicon Photonics Conferenceロジック / デバイス / プロセス統合 IEEE Photonics Society | 会期終了 2026-04-16 102日前 2026-04-13〜16 / Malaga, Spain Malaga, Spain / Malaga, Spain | contributed and invited papers + oral/poster presentations formerly Group IV Photonics として、シリコンフォトニクスの材料・デバイス・集積・製造技術を同じ会議で確認できる。 | | silicon photonics、Group IV photonic materials、heterogeneous integration、fabrication technologies を silicon platform 上で確認する。 監視テーマ: silicon photonics, heterogeneous integration, photonic devices, materials, fabrication, co-packaged optics |
| SPIE Photonics Europe SPIE Photonics Europeロジック / デバイス / プロセス統合 SPIE | 会期終了 2026-04-16 102日前 2026-04-12〜2026-04-16 / Palais de la Musique et des Congres, Strasbourg, France Palais de la Musique et des Congres / Strasbourg, France | Official SPIE Photonics Europe author page lists abstract submission, author notification, manuscript/poster PDF submission, and chair/editor assessment for technical merit and suitability of content; SPIE manuscript guidelines state proceedings review before publication approval. Official SPIE Photonics Europe pages identify the event as the premier European optics and photonics research and development event, scheduled for 12-16 April 2026 in Strasbourg. The official abstract page lists the extended abstract due date as 2025-12-05 and author notification/program posting as 2026-01-26. | | Optics and photonics R&D, digital optics, quantum technologies, optical imaging, sensing, metrology, THz photonics, 3D printed optics, photonic glasses, photosensitive materials, biophotonics, silicon photonics, and European photonics industry sessionsを確認できる。 監視テーマ: silicon photonics, integrated photonics, quantum photonics, optical sensing, metrology, imaging, THz photonics, biophotonics, photonic materials, European photonics industry |
| PMJ Photomask Japan露光 / パターニング / 配線 / 量産 Photomask Japan / SPIE | 会期終了 2026-04-10 108日前 2026-04-08〜10 / PACIFICO Yokohama Annex Hall, Yokohama, Japan PACIFICO Yokohama Annex Hall / Yokohama, Japan | 1-page abstract + SPIE proceedings manuscript mask 技術に特化しつつ chiplet や semiconductor manufacturing まで scope を広げており、露光周辺の bottleneck を細かく追える。 | | photomask、EUV / NIL masks、mask writer、inspection / repair、ILT / DTCO、AI for mask R&D を深く追える。 監視テーマ: photomask, EUV mask, NIL mask, mask writer, inspection, repair, ILT, DTCO, AI for HVM |
| JPS Spring Meeting 日本物理学会春季大会 / The Physical Society of Japan Spring Meetingロジック / デバイス / プロセス統合 The Physical Society of Japan | 会期終了 2026-03-26 123日前 2026-03-23 to 2026-03-26 / Online (Zoom) Online (Zoom) / Online, Japan | Official JPS Spring Meeting sources identify a general presentation application deadline, proceedings PDF submission deadline, and public program/proceedings web. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official JPS 2026 Spring sources identify the March 23-26, 2026 online cycle, Area 4 representatives and operating-committee rows in the program front matter, Area 4 oral/poster public program rows, official sponsor rows, future-meeting schedule context, and JPS planning/review process context. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Semiconductor physics, mesoscopic systems, quantum transport, two-dimensional materials, superconducting devices, spintronics, nanostructures, optical/electronic properties, and condensed-matter device research presented through the Physical Society of Japan spring meeting Area 4 program. 監視テーマ: JPS Spring Meeting, Area 4 semiconductor, mesoscopic systems, quantum transport, first-listed affiliation organization mix, NTT Basic Research Laboratories, SoftBank Advanced Technology Research Institute, Sony Semiconductor Solutions sponsor row, and official JPS program/proceedings web |
| Catalysis Society Meeting 触媒討論会 / Catalysis Society of Japan Meetingロジック / デバイス / プロセス統合 Catalysis Society of Japan | 会期終了 2026-03-24 125日前 2026-03-23 to 2026-03-24 / Institute of Science Tokyo Ookayama Campus, Tokyo, Japan Institute of Science Tokyo, Ookayama Campus / Tokyo, Japan | Official 第137回 application guidance identifies oral presentations (B1, B2, B3) and poster presentations, one submission per presenter across oral/poster formats, Catalysis Society individual-membership and participant-registration requirements, committee responsibility for acceptance and program organization, and separate proceedings-file submission after acceptance guidance. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 第137回 sources identify the March 23-24, 2026 Institute of Science Tokyo cycle, October 23-November 7, 2025 presentation-application period, January 15-30, 2026 proceedings-file submission period, January 16 program publication, March 13 proceedings publication target, committee rows, official public program code rows, and luncheon/exhibitor listing rows. | | Catalysis research covering heterogeneous catalysts, molecular catalysts, photocatalysis, electrocatalysis, catalyst supports, CO2 conversion, hydrogen, synthetic fuels, polymer and fine-chemical catalysts, reactor analysis, operando/in-situ spectroscopy, catalyst characterization, and materials-informatics workflows. Relevant to semiconductor process materials, energy and power devices, chemical sensors, catalyst-enabled environmental technology, and manufacturing support research. 監視テーマ: 触媒討論会, Catalysis Society of Japan Meeting, catalysts, photocatalysis, electrocatalysis, CO2 conversion, hydrogen, synthetic fuels, catalyst characterization, operando analysis, MI-6, HORIBA, Shimadzu, Toyota Central R&D Labs, Honda R&D, Sumitomo Metal Mining, ENEOS, Resonac, Umicore Shokubai Japan, Tokyo Gas, and official first-listed program affiliation rows |
| APS March APS March Meeting / APS Global Physics Summitロジック / デバイス / プロセス統合 American Physical Society (APS) | 会期終了 2026-03-20 129日前 2026-03-15〜2026-03-20 / Denver, Colorado, United States and online Colorado Convention Center / Hyatt Regency Denver / Denver, United States | Official APS Global Physics Summit abstract pages describe contributed oral/poster abstracts and invited abstracts, with contributed abstracts accepted when they comply with official guidelines and invited abstracts submitted by invitation. Official APS Global Physics Summit pages identify the March 15-20, 2026 Denver/online meeting, public schedule, abstract pages, sorting categories, meeting chairs, and full sponsor/exhibitor listings. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | condensed matter physics, quantum materials, semiconductors/insulators/dielectrics, superconductivity, magnetism, surfaces/interfaces/thin films, quantum information, photonics, and materials/device physicsを確認できる。 監視テーマ: quantum materials, semiconductors and dielectrics, superconductivity, spintronics, 2D materials, thin films, surfaces/interfaces, quantum computing hardware, cryogenic and measurement suppliers |
| ECSJ Meeting 電気化学会大会 / Electrochemical Society of Japan Meetingロジック / デバイス / プロセス統合 The Electrochemical Society of Japan | 会期終了 2026-03-19 130日前 2026-03-17 to 2026-03-19 / Tokyo University of Science Noda Campus, Noda, Chiba, Japan Tokyo University of Science, Noda Campus / Noda, Chiba, Japan | Official ECSJ 93rd Meeting sources identify member-only presentation registration, abstract manuscript submission, public Confit session pages, and a completed March 2026 in-person cycle. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ECSJ/Confit sources identify the March 17-19, 2026 Tokyo University of Science Noda cycle, presentation registration deadline, abstract manuscript period, executive committee list, public session pages for micro-nano device formation and electronic materials/nano-functional devices, company exhibition/PR/banner listing rows, and official convention archive evidence. | | Electrochemistry and materials-device research covering electronic materials, nano-functional devices, wet process and interconnect surface stability, CMP before hybrid bonding, Ru/graphene caps, porous silicon, GaAs and oxide formation, plating and electroless deposition, battery/electrode materials, sensors, and micro-nano fabrication. Relevant to semiconductor materials, FEOL/BEOL wet process, advanced packaging, device materials, and process characterization. 監視テーマ: ECSJ Meeting, electronic materials and nano-functional devices, micro-nano structure materials, device formation nano process, hybrid bonding CMP, porous silicon, GaAs, TSV-like plating, first-listed affiliation sample, official company exhibition rows, PR poster rows, banner advertiser rows, and ECSJ convention archive |
| JSPE Spring Meeting 2026年度精密工学会春季大会学術講演会 / JSPE Spring Meeting露光 / パターニング / 配線 / 量産 The Japan Society for Precision Engineering | 会期終了 2026-03-19 130日前 2026-03-17 to 2026-03-19 / Saitama University Main Campus, Saitama, Japan Saitama University, Main Campus / Saitama, Saitama, Japan | Official JSPE 2026 Spring sources identify presentation application, PDF manuscript/proceedings submission, a public program PDF, and a completed March 2026 academic meeting. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official JSPE 2026 Spring sources identify the March 17-19, 2026 Saitama University cycle, presentation application deadline, program PDF, event-page talk count, executive committee list, equipment/catalog exhibitor listing, website banner advertiser rows, and semiconductor manufacturing technology symposium context. | | Precision engineering and manufacturing research covering micro/nano machining, CMP and planarization, precision positioning, metrology, optical/X-ray measurement, laser processing, surface nanostructures, automation, and semiconductor manufacturing equipment development. Relevant to semiconductor process control, wafer processing, inspection/metrology, and production-equipment research. 監視テーマ: JSPE Spring Meeting, precision engineering, micro/nano machining, CMP and planarization, precision positioning, metrology, semiconductor manufacturing equipment symposium, official program PDF presenter-affiliation extract, official equipment exhibitor rows, catalog exhibitor rows, and banner advertiser rows |
| TMS Annual TMS Annual Meeting & Exhibitionロジック / デバイス / プロセス統合 The Minerals, Metals & Materials Society (TMS) | 会期終了 2026-03-19 130日前 2026-03-15 to 2026-03-19 / San Diego Convention Center and Hilton San Diego Bayfront, San Diego, California, United States San Diego Convention Center and Hilton San Diego Bayfront / San Diego, California, United States | Official ProgramMaster pages list abstract submission tools and approved abstract title links for the 2026 annual meeting. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official TMS2026 / ProgramMaster sources identify the March 15-19, 2026 San Diego cycle, broad symposium list, official symposium organizer affiliation rows, approved abstract title links, and the official exhibit directory PDF. The reviewed graph records that ProgramMaster abstract pages checked in this run did not expose affiliation organizations, so program organization and country/region rows stay Unknown rather than inferred. | | Materials science and engineering research spanning electronic packaging and interconnection materials, thin films and coatings, interfaces, advanced characterization, additive manufacturing, nuclear and energy materials, microstructure, thermodynamics, kinetics, and materials processing. Relevant to semiconductor packaging, interconnect metallurgy, diffusion barriers, thermal interfaces, reliability, and process characterization. 監視テーマ: TMS Annual Meeting, ProgramMaster symposium organizers, approved abstract title rows, Electronic Packaging and Interconnection Materials, Thin Films and Coatings, Chemistry and Physics of Interfaces, advanced characterization, official exhibitor directory, national labs, instrument vendors, and materials software exhibitors |
| ISPD International Symposium on Physical Design回路 / システム / 設計自動化 ACM SIGDA / IEEE CEDA / IEEE / ISPD Committee | 会期終了 2026-03-18 131日前 2026-03-15〜2026-03-18 / University Club Bonn, Bonn, Germany University Club Bonn / Bonn, Germany | Official 2026 pages identify title/abstract submission, full manuscript submission, acceptance notification, camera-ready paper and speaker registration deadlines, plus ACM DL archive/proceedings coverage. Official ISPD 2026 pages identify the March 15-18, 2026 University Club Bonn cycle, September 21 title/abstract deadline, September 28 full-manuscript deadline, November 5 acceptance notification, January 7 camera-ready deadline, official organization table, accepted-paper program rows, sponsor/technical-sponsor/supporter listings, and official archive coverage. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | physical design、placement、routing、timing closure、3D IC planning、chiplet / advanced packaging routing、photonic IC routing、transistor-level layout、analog placement、quantum compilation、EDA methodologyを確認できる。 監視テーマ: physical design, placement, routing, timing closure, 3D IC, chiplets, advanced packaging, photonic IC routing, analog layout automation, AI for EDA, quantum compilation |
| IEEJ Annual Meeting 電気学会全国大会 / IEEJ Annual Meetingロジック / デバイス / プロセス統合 一般社団法人 電気学会 / The Institute of Electrical Engineers of Japan | 会期終了 2026-03-14 135日前 2026-03-12 to 2026-03-14 / Tohoku Gakuin University Itsutsubashi Campus, Sendai, Miyagi, Japan Tohoku Gakuin University, Itsutsubashi Campus / Sendai, Japan | Official IEEJ 2026 sources identify presentation application, proceedings manuscript upload, published program HTML, general and symposium presentation rows, and official exhibitor/career-session listings. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official IEEJ 2026 sources identify the March 12-14, 2026 Tohoku Gakuin University Itsutsubashi Campus cycle, January 8, 2026 presentation/proceedings manuscript deadline, February 2, 2026 program publication, official chair rows from the prospectus, public program first-listed affiliation rows, and official exhibitor/career listing rows. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Broad electrical engineering annual meeting spanning basic materials, semiconductor materials, electronic devices, electronic circuits, quantum electronics, power semiconductor devices, power electronics, sensors, micro-machines, control, power systems, magnetic materials, plasma, measurement, photonics, and industry-academic electrical engineering infrastructure. 監視テーマ: 電気学会全国大会, IEEJ Annual Meeting, semiconductor materials, electronic devices, electronic circuits, power semiconductor devices, power electronics, sensors, micro-machines, TOSHIBA, Mitsubishi Electric, Hitachi, Tokyo Electric Power, TMEIC, CRIEPI, AIST, NTT R&D, Toshiba Energy Systems, exhibitor guidebook, and official first-listed program affiliation rows |
| IEICE General 電子情報通信学会総合大会 / IEICE General Conference回路 / システム / 設計自動化 一般社団法人 電子情報通信学会 / The Institute of Electronics, Information and Communication Engineers | 会期終了 2026-03-13 136日前 2026-03-09〜2026-03-13 / 九州産業大学（福岡市） 九州産業大学（福岡市） / Fukuoka, Japan | Official 2026 General Conference sources identify online lecture/presentation application, general public sessions, planned sessions, Confit program publication, and proceedings publication. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official 2026 sources identify the March 9-13, 2026 Kyushu Sangyo University cycle, January 6 presentation application deadline, February 9 web-program publication, February 24 proceedings release, committee tables, Confit presentation search rows, and IEICE EXPO 2026 sponsor/exhibitor listings. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | electronics, information and communication engineering, circuits, devices, communications, systems, human communication, junior/student posters, planned sessions, and corporate exhibition signalsを横断して確認できる。 監視テーマ: communications, electronics, circuits, photonics, information networks, human communication, student posters, corporate exhibition, recruitment exhibition, sponsored sessions, Japanese semiconductor ecosystem signals |
| JIMM Spring Meeting 日本金属学会春期講演大会 / The Japan Institute of Metals and Materials Spring Meetingロジック / デバイス / プロセス統合 The Japan Institute of Metals and Materials | 会期終了 2026-03-13 136日前 2026-03-11 to 2026-03-13 / Chiba Institute of Technology, Shin-Narashino Campus, Narashino, Chiba, Japan Chiba Institute of Technology, Shin-Narashino Campus / Narashino, Chiba, Japan | Official JIMM 2026 Spring sources identify web-based presentation and participation registration, public Confit program/session pages, proceedings PDF access, and a completed March 2026 meeting cycle. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official JIMM/Confit 2026 Spring sources identify the March 11-13, 2026 Chiba Institute of Technology cycle, presentation application period, public Confit session pages, official 18-row exhibitor list, and source-backed graph records for organizer, visible program sample, and sponsor/exhibitor rows. | | Metals and materials research covering electric, electronic and optical materials, thermoelectric materials, computational materials science, alloy processing, diffusion, microstructure, joining, characterization, corrosion, and reliability. Relevant to semiconductor materials, advanced packaging, interconnect metallurgy, diffusion barriers, thermal and electromigration reliability, and process integration. 監視テーマ: JIMM Spring Meeting, metals and materials science, electric/electronic/optical materials, thermoelectric materials, computational science, first-listed affiliation sample, Nippon Steel, Toshiba, official exhibitor rows, analytical instrument vendors, and official Confit program pages |
| JIEP Spring JIEP Spring Convention実装 / 先端パッケージ / 3D integration Japan Institute of Electronics Packaging (JIEP) | 会期終了 2026-03-12 137日前 2026-03-10〜12 / Tokyo Tama Mirai Messe, Hachioji, Japan Tokyo Tama Mirai Messe / Hachioji, Japan | presentation abstract / proceedings manuscript for oral and poster sessions 公式概要は第40回大会を2026年3月10〜12日にハイブリッド開催し、講演150件、ポスター10件、企業展示30社程度を予定すると説明している。 | | エレクトロニクス実装技術の国内主要講演大会として、advanced packaging、基板、材料、接合、熱、信頼性、実装プロセスを産学横断で確認できる。 監視テーマ: advanced packaging, electronics packaging, substrate, materials, bonding, thermal management, reliability, manufacturing process |
| NVMW Non-Volatile Memories WorkshopMemory / Reliability / Failure Physics UC San Diego CMRR / NVSL | 会期終了 2026-03-10 139日前 2026-03-09〜10 / UC Santa Cruz Silicon Valley Campus, Santa Clara, California, US UC Santa Cruz Silicon Valley Campus / Santa Clara, United States | 2-page extended abstract 新規結果だけでなく既発表成果の整理も受けるので、memory 業界の論点を短期間で俯瞰しやすい。 | | NAND、emerging NVM、coding、architecture、systems、industry memory product discussion をまとめて追える。 監視テーマ: NAND, ReRAM, PCM, FeFET, coding, architecture, storage systems |
| CSJ Annual Meeting 日本セラミックス協会年会 / The Ceramic Society of Japan Annual Meetingロジック / デバイス / プロセス統合 The Ceramic Society of Japan | 会期終了 2026-03-06 143日前 2026-03-04 to 2026-03-06 / Yokohama National University Tokiwadai Campus, Yokohama, Kanagawa, Japan Yokohama National University Tokiwadai Campus / Yokohama, Kanagawa, Japan | Official CSJ Annual Meeting 2026 submission page states that research-presentation applications were handled online, proceedings PDF submission ran in January 2026, and participant/invitee access controlled proceedings PDFs. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official CSJ Annual Meeting 2026 sources identify the March 4-6, 2026 Yokohama National University cycle, official committee tables, English program oral/award/poster presentation rows, public exhibitor list, advertising and exhibition recruitment PDFs, and the society meeting archive. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Ceramic materials, electronic ceramics, dielectric materials, magnetic materials, glass and photonics materials, energy materials, carbon-neutral ceramics, powder processing, synthesis, characterization, informatics, bioceramics, cement, and engineering ceramics relevant to semiconductor and electronic-materials research. 監視テーマ: CSJ Annual Meeting, electronic ceramics, dielectric materials, oxide and oxoate materials, MLCC, glass photonics, ceramic processing, program affiliation mix, Nippon Electric Glass/PRECI/Kyocera/Murata/Shiraishi/AGC company rows, official exhibitor rows |
| DPC IMAPS Device Packaging Conference実装 / 先端パッケージ / 3D integration International Microelectronics Assembly and Packaging Society (IMAPS) | 会期終了 2026-03-05 144日前 2026-03-02〜05 / Sheraton Grand at Wild Horse Pass, Phoenix, Arizona, US Sheraton Grand at Wild Horse Pass / Phoenix, United States | 500+ word abstract + extended abstract booklet formal paper 必須ではないため、量産現場の packaging 実務トピックが上がりやすい。 | | advanced packaging content に特化し、2.5D / 3D、optical、assembly、interconnect、design、reliability を密に追える。 監視テーマ: 2.5D/3D, optical packaging, interconnect, assembly, design, reliability |
| IEICE CPM IEICE Technical Committee on Electronic Components and Materialsロジック / デバイス / プロセス統合 The Institute of Electronics, Information and Communication Engineers / IEICE CPM | 会期終了 2026-03-02 147日前 2025年度 / 2025-05-30〜2026-03-02 / Japan venues IEICE KEN FY2025 CPM meeting venues / Multiple Japan venues, Japan | IEICE KEN technical meeting presentation / 発表申込 + 技報原稿アップロード; peer-review wording is not normalized in this task. IEICE KEN FY2025 CPM schedule lists seven CPM meetings with official program links and host/co-host/co-located research groups across SDM, ED, R, LQE, OPE, EMD, MRIS, EE, OME and ITE-MMS. | | 電子部品・材料、機能性デバイス材料、薄膜プロセス、光電子デバイス、固体メモリ、エネルギー技術を日本のIEICE研究会軸で確認する。 監視テーマ: electronic components, functional device materials, thin-film process, optoelectronic devices, solid-state memory, energy devices |
| SPIE DTCO SPIE DTCO and Computational Patterning露光 / パターニング / 配線 / 量産 SPIE | 会期終了 2026-02-26 151日前 2026-02-22〜26 / San Jose, California, US San Jose, California / San Jose, United States | SPIE ALP conference abstract + proceedings manuscript 設計側のルール変更と露光側の制約を同じ topic にまとめるため、EDA と量産 patterning の接続点を抽出しやすい。 | | design-technology co-optimization、computational lithography、OPC、ILT、EPE を設計/製造境界で確認する。 監視テーマ: DTCO, computational patterning, OPC, ILT, EPE, AI for patterning |
| SPIE Etch SPIE Advanced Etch Technology and Process Integration for Nanopatterning露光 / パターニング / 配線 / 量産 SPIE | 会期終了 2026-02-26 151日前 2026-02-22〜26 / San Jose, California, US San Jose, California / San Jose, United States | SPIE ALP conference abstract + proceedings manuscript 露光だけでは解けない寸法制御を etch と process integration の側で確認でき、装置/材料/量産DBの接続点になる。 | | etch、pattern transfer、process integration、ALE、plasma process を lithography 後の形状転写として確認する。 監視テーマ: etch, pattern transfer, ALE, plasma, process integration, profile control |
| SPIE Materials SPIE Advances in Patterning Materials and Processes露光 / パターニング / 配線 / 量産 SPIE | 会期終了 2026-02-26 151日前 2026-02-22〜26 / San Jose, California, US San Jose, California / San Jose, United States | SPIE ALP conference abstract + proceedings manuscript 材料企業、露光装置、計測、etch の間に出るボトルネックを材料側から分解できる。 | | photoresist、underlayer、developer、stochastic defect、dry resist など、露光材料とプロセス窓を確認する。 監視テーマ: resist, underlayer, dry resist, stochastic defect, process window, sustainability |
| SPIE Metrology SPIE Metrology, Inspection, and Process Control露光 / パターニング / 配線 / 量産 SPIE | 会期終了 2026-02-26 151日前 2026-02-22〜26 / San Jose, California, US San Jose, California / San Jose, United States | SPIE ALP conference abstract + proceedings manuscript High-NA や先端配線の課題を、計測・検査・工程制御でどこまで閉じ込められるかを確認する topic。 | | metrology、inspection、process control、defect review を patterning の量産性評価として追跡する。 監視テーマ: metrology, inspection, process control, defect review, overlay, AI inspection |
| SPIE Optical/EUV SPIE Optical and EUV Nanolithography露光 / パターニング / 配線 / 量産 SPIE | 会期終了 2026-02-26 151日前 2026-02-22〜26 / San Jose, California, US San Jose, California / San Jose, United States | SPIE ALP conference abstract + proceedings manuscript SPIE ALP は Optical and EUV Nanolithography、DTCO、Metrology、Novel Patterning、Materials、Etch を分けているため、露光周辺のボトルネックを細分化できる。 | | optical lithography、EUV、High-NA、scanner/resist/mask の露光限界を同じ面で確認する SPIE ALP 内の中核トピック。 監視テーマ: High-NA EUV, optical lithography, stochastic defects, imaging, overlay |
| FPGA ACM/SIGDA International Symposium on Field-Programmable Gate Arrays回路 / システム / 設計自動化 ACM SIGDA / FPGA Organizing Committee | 会期終了 2026-02-24 153日前 2026-02-22 to 2026-02-24 / Seaside, California, United States Embassy Suites by Hilton Monterey Bay Seaside / Seaside, United States | Official CFP describes original papers, rebuttal, ACM proceedings, and an industry track. Graph data is hydrated only from PostgreSQL. Official sources identify the 34th edition, September 24 abstract deadline, October 1 paper deadline, and February 22-24, 2026 symposium. | | Field-programmable gate arrays, FPGA architecture, CAD, applications, reconfigurable computing, systems, and industrial deployment. 監視テーマ: FPGA architecture, logic synthesis, placement and routing, reconfigurable computing, datacenter acceleration, Altera, Microsoft, MangoBoost |
| WLPS / IWLPC Wafer-Level Packaging Symposium実装 / 先端パッケージ / 3D integration Surface Mount Technology Association (SMTA) | 会期終了 2026-02-19 158日前 2026-02-17〜19 / Hyatt Regency San Francisco Airport, Burlingame, California, US Hyatt Regency San Francisco Airport / Burlingame, United States | extended abstract + presentation; technical committee selection; SMTA DOI/indexing for accepted technical papers IWLPC系のadvanced wafer-level packaging実務会議。ECTC/IMAPS/ICEP-HBSの間を埋めるが、年次により査読・manuscript要件が変わるためA下限に分類する。 | | wafer-level packaging、3D integration、advanced manufacturing & test、fan-out、hybrid bonding周辺を実務寄りに確認する。 監視テーマ: wafer-level packaging, 3D integration, advanced manufacturing, test, fan-out, hybrid bonding |
| KCS Korean Conference on Semiconductorsロジック / デバイス / プロセス統合 Korean semiconductor academic and industry community | 会期終了 2026-01-30 178日前 2026-01-27〜30 / High1 Resort Grand Hotel Convention Tower, South Korea High1 Resort Grand Hotel Convention Tower / Jeongseon, South Korea | official overview confirms event identity/date/venue; submission and review wording is not normalized in this task. KCS公式2026 overviewでThe 33rd Korean Conference on Semiconductors、2026-01-27〜30、High1 Resort開催を確認した。 | | 韓国半導体コミュニティの主要国内学会として、device/process/circuit側の研究室発表evidenceを確認する。 監視テーマ: Korean semiconductor research community, device, process, circuits, AI-era semiconductor topics |
| ASP-DAC Asia and South Pacific Design Automation Conference回路 / システム / 設計自動化 ACM SIGDA / IEEE CEDA / ASP-DAC Committee | 会期終了 2026-01-22 186日前 2026-01-19〜22 / Hong Kong Disneyland Hotel Conference Center, Hong Kong SAR Conference Center at Hong Kong Disneyland Hotel / Hong Kong, Hong Kong SAR | double-blind full paper up to 6 pages + 1 page references EDA の定番会議だが、advanced packaging や manufacturing-aware design も入るので front-end と back-end の橋渡しに有効。 | | EDA、physical design、hardware security、AI hardware、chiplet、advanced packaging co-design をアジア圏の設計コミュニティで追える。 監視テーマ: EDA, physical design, AI hardware, security, chiplet, advanced packaging co-design |
| LSJ Annual Meeting レーザー学会学術講演会年次大会 / Annual Meeting of the Laser Society of Japanロジック / デバイス / プロセス統合 The Laser Society of Japan / LSJ46 Annual Meeting Executive Committee | 会期終了 2026-01-15 193日前 2026-01-13 to 2026-01-15 / Osaka Nanko ATC, Osaka, Japan Osaka Nanko ATC O-s Building South Wing, 6F conference rooms / Osaka, Japan | Official LSJ46 outline states that general and poster presentations are submitted through the Web, presenter eligibility is limited to Laser Society member categories, presentation format is selected during application, the application deadline was extended to September 26, 2025, and the proceedings manuscript deadline was planned for October 16, 2025. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official LSJ46 sources identify the January 13-15, 2026 Osaka cycle, execution/local/program/symposium committee rows, public Confit presentation pages, Laser Solution 2026 exhibitor rows, banner-advertiser listings, and the official support-page statement that the annual meeting has run since 1981. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Laser science, laser physics and chemistry, laser equipment, high-intensity and high-energy laser applications, laser processing, laser measurement, optical functional materials and devices, optical communications, optical wireless, optical information processing, biomedical laser applications, photonics-electronics convergence, and laser fusion topics. 監視テーマ: LSJ Annual Meeting, Laser Solution exhibitors, blue semiconductor laser processing, photonics-electronics convergence, optical functional devices, QD Laser/OXIDE/Hamamatsu/Mitsubishi Electric/NTT program participation, official exhibitor and banner-advertiser listings |
| SANKEN Intl SANKEN International Symposium / Handai Nanoscience and Nanotechnology International Symposiumロジック / デバイス / プロセス統合 SANKEN, The University of Osaka | 会期終了 2026-01-09 199日前 2026-01-07〜2026-01-09 / The University of Osaka Nakanoshima Center Nakanoshima Center, The University of Osaka / Osaka, Japan | Official 2026 sources identify invited oral lectures and poster presentations; public speaker affiliations are available for the oral program, while poster first-author affiliation rows are not publicly listed. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official sources identify the January 7-9, 2026 Osaka cycle, November 20, 2025 poster deadline, organizing committee, 16 invited oral lectures, 63 poster presenters, and two supporting organizations under Sponsorship. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | nanoscience, nanotechnology, chemistry, bioengineering, quantum devices, photonics, materials, and interdisciplinary SANKEN research signalsを横断して確認できる。 監視テーマ: nanoscience, molecular engineering, bioengineering, quantum computing, spintronics, photonics, advanced materials, SANKEN collaboration signals |
| VLSID International Conference on VLSI Design回路 / システム / 設計自動化 VLSI Society of India | 会期終了 2026-01-07 201日前 2026-01-03〜07 / Pune, Maharashtra, India MIT World Peace University / JW Marriott Pune / Pune, India | 6-page full paper + blind review + IEEE proceedings format VLSID 2026公式CFPはfull-length original unpublished paper、blind review、IEEE proceedings仕様を示す。CORE/ICOREではNational: India扱いだが、このTier表では地域主要B帯として独立して分類する。 | | VLSI design、embedded systems、EDA、analog/mixed-signal、test/reliability、hardware security、advanced packagingをインド/アジア軸で確認する。 監視テーマ: VLSI design, embedded systems, EDA, analog/mixed-signal, reliability, hardware security, packaging |
| Pacifichem International Chemical Congress of Pacific Basin Societies / Pacifichemロジック / デバイス / プロセス統合 Pacifichem, Inc. / Canadian Society for Chemistry host society / seven joint sponsoring societies | 会期終了 2025-12-20 219日前 2025-12-15 to 2025-12-20 / Honolulu, Hawaii, United States Hawaii Convention Center and Waikiki partner hotels / Honolulu, United States | Official completed-cycle sources describe symposium proposals and technical papers considered for presentation. The complete accepted-presentation affiliation roster is not publicly exposed, so reviewed program graph data is limited to the official Topic Plenary roster and is hydrated from PostgreSQL researchVisualSignals. Official sources identify the December 15-20, 2025 Honolulu cycle, 114 board/committee source rows, 22 Topic Plenary speaker affiliation rows, 14 corporate sponsors, 7 joint sponsors, and 9 Official Participating Organizations. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Analytical, biological, computational and theoretical, inorganic, macromolecular, materials, organic, physical, sustainability, life-science and health-care, and science-education chemistry, including semiconductor materials, polymers, photonics, energy conversion, catalysis, measurement, and process-adjacent research. 監視テーマ: Pacifichem, semiconducting polymers, electronic materials, photonics, spectroscopy, mass spectrometry, sustainable materials, catalysis, A*STAR, Merck, American Elements, Bruker, Elsevier, Wiley, Newomics, Proto, Winmostar, Shimadzu |
| OPJ Optics & Photonics Japanロジック / デバイス / プロセス統合 The Optical Society of Japan (OSJ) / OPJ2025 Organizing Committee | 会期終了 2025-12-11 228日前 2025-12-09 to 2025-12-11 / Tokushima Prefectural Culture Hall, Tokushima, Japan Tokushima Prefectural Culture Hall / Tokushima, Japan | Official OPJ2025 call guidance identifies oral-or-poster and poster presentation options, presenter membership requirements, abstract release timing, and program-committee allocation for oral/poster selection. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official OPJ2025 sources identify the December 9-11, 2025 Tokushima cycle, September 12, 2025 application due line, October 3, 2025 abstract due line, official organizing/program committee rows, official program HTML presentation-code rows with first-listed affiliation text, official supporting-company listings, proceedings publication date, and archive links back to OPJ2015. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Optics and photonics research presentations across nanophotonics, quantum electronics, optical design, optical devices, optical metrology, information photonics, visual optics, display, illumination, optical environment, bio-photonics, medical optics, X-ray optics, EUV optics, and industry-facing optical science applications. 監視テーマ: OPJ, Optics & Photonics Japan, OSJ, optical society, nanophotonics, quantum electronics, optical metrology, information photonics, bio-photonics, medical optics, X-ray optics, EUV optics, Tokushima University, Institute of Science Tokyo, University of Tsukuba, Hamamatsu Photonics, Mitsubishi Electric, Canon, Toshiba, Konica Minolta, NICHIA, Keysight, Menlo Systems, and official OPJ2025 program first-listed affiliation rows |
| ISS International Symposium on Superconductivityロジック / デバイス / プロセス統合 International Symposium on Superconductivity (ISS) / ISS-Board | 会期終了 2025-12-04 235日前 2025-12-02〜04 / Dejima Messe Nagasaki, Nagasaki, Japan Dejima Messe Nagasaki / Nagasaki, Japan | Official ISS2025 registration page used Confit for presentation title and abstract submissions; proceedings manuscripts used Morressier and the official proceedings page describes Program Committee peer review for JPCS papers. Official ISS2025 archive shows abstract submission deadline 2025-08-20, presenter notification / program number notices on 2025-09-20, and symposium dates 2025-12-02 to 2025-12-04. | | superconductivity、high-temperature superconductors、SQUIDs、superconducting electronic devices、wires and bulk、HTS magnets、fusion magnets、large-scale applicationsを確認できる。 監視テーマ: superconducting electronics, SQUIDs, high-temperature superconductors, REBCO, HTS wires, fusion magnets, superconducting joints, large-scale applications |
| JSPF Annual Annual Meeting of the Japan Society of Plasma Science and Nuclear Fusion Research / プラズマ・核融合学会年会ロジック / デバイス / プロセス統合 Japan Society of Plasma Science and Nuclear Fusion Research | 会期終了 2025-12-04 235日前 2025-12-01〜2025-12-04 / Kyoto Institute of Technology, Matsugasaki Campus Kyoto Institute of Technology, Matsugasaki Campus / Kyoto, Japan | Official 2025 sources publish general oral/poster program codes and first-listed affiliation organizations. Reviewed organization/program/sponsor signals are hydrated from PostgreSQL researchVisualSignals. Official sources identify the December 1-4, 2025 Kyoto cycle, 33 annual-meeting/area committee rows, 531 general oral/poster codes checked, 512 visible first-listed affiliation rows, one co-sponsor, and all 45 exhibitors. Reviewed signals are hydrated from PostgreSQL. | | fusion plasma, applied plasma, plasma diagnostics, plasma processing, materials, radiation, reactor engineering, and semiconductor-adjacent plasma technologyを横断して確認できる。 監視テーマ: plasma processing, EUV and light sources, thin films, surface treatment, diagnostics, fusion engineering, Panasonic, Sony Semiconductor Solutions, QST, NIFS |
| IEEE ICECS IEEE International Conference on Electronics, Circuits and Systems回路 / システム / 設計自動化 IEEE Circuits and Systems Society / ICECS Organizing Committee | 会期終了 2025-11-19 250日前 2025-11-17 to 2025-11-19 / Marrakech, Morocco Kenzi Rose Garden Hotel, Marrakech, Morocco / Marrakech, Morocco | Original IEEE double-column contributions; reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official sources identify ICECS as IEEE CASS Region 8 flagship and record the completed 2025 Marrakech program. | | Electronic circuits, systems, RF, mixed-signal, VLSI, EDA, test, reliability, sensors, and embedded systems. 監視テーマ: circuits, VLSI, EDA, test, reliability, RF, sensors, neuromorphic, IEEE CASS |
| ISCSI International Symposium on Control of Semiconductor Interfacesロジック / デバイス / プロセス統合 ISCSI-X / ICSI/ISTDM 2025 Organizing Committee | 最終原稿締切 2026-02-28 149日前 2025-11-10 to 2025-11-13 / Institute of Science Tokyo Suzukakedai Campus, Yokohama, Kanagawa, Japan Institute of Science Tokyo, Suzukakedai Campus, SUZUKAKE Hall / Yokohama, Kanagawa, Japan | Official abstract-submission guidance states that paper acceptance is based on abstract submission, the work must be original and unpublished, and authors submit a two-page English PDF abstract. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ISCSI10 sources identify the November 10-13, 2025 Institute of Science Tokyo Suzukakedai Campus cycle, September 30, 2025 ISCSI-X poster-session abstract deadline, official committee membership rows, official Technical Program presentation rows with first-listed affiliation text, official Sponsors/Exhibitors/Endorsement listings, and MSSP special-issue publication context. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Semiconductor interface control, silicon epitaxy, SiGe and GeSn technologies, SiC, diamond, compound semiconductors, III-nitrides, oxide semiconductors, high-k / low-k dielectrics, epitaxial growth, CVD, MBE, ALD, surface passivation, contacts, nanostructures, microfabrication, SOI/SGOI, III-V on Si, CMOS, HBT, BiCMOS, LEDs, photonic devices, quantum technology, and group-IV semiconductor engineering. 監視テーマ: ISCSI, ICSI, ISTDM, semiconductor interfaces, silicon epitaxy, SiGe, GeSn, SiC, diamond, III-nitrides, oxide semiconductors, high-k dielectrics, ALD, MBE, CVD, surface passivation, contacts, nanostructures, Applied Materials, KIOXIA, Samco, GlobalWafers Japan, STMicroelectronics, IMEC, IHP, AIST, NIMS, and official first-listed program affiliation rows |
| Sensor Symposium Sensor Symposium on Sensors, Micromachines and Applied Systemsロジック / デバイス / プロセス統合 電気学会 センサ・マイクロマシン部門 | 会期終了 2025-11-13 256日前 2025-11-10〜13 / Utsunomiya, Japan ライトキューブ宇都宮 / Utsunomiya, Japan | 発表申込 + 本論文投稿 + 速報ポスター枠 公式2025年サイトで発表申込締切、採否通知、本論文投稿締切、速報ポスター募集締切、プログラムPDF、スポンサー/技術展示リストを確認した。 | | MEMS、センサ、マイクロマシン、バイオ/ケミカル/フィジカルセンサ、実装・材料・システム応用を横断して確認できる。 監視テーマ: MEMS sensors, micromachines, bio/chemical/physical sensors, micro-nano systems, sensor packaging, applied systems |
| ICCD IEEE International Conference on Computer Design回路 / システム / 設計自動化 IEEE Computer Society / ICCD Organizing Committee | 会期終了 2025-11-12 257日前 2025-11-10 to 2025-11-12 / Dallas, Texas, United States Dallas, Texas / Dallas, United States | ICCD technical program. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ICCD 2025 sources identify the completed Dallas program, committee, speaker affiliations, IEEE Computer Society conference organization, review conditions, and prior-edition archive. | | Computer architecture, AI hardware, electronic design automation, circuits, verification, security, systems, memory, accelerators, and silicon photonics. 監視テーマ: ICCD, AI hardware, EDA, RTL, physical design, verification, memory, accelerators, Synopsys, NVIDIA, AMD, Intel, Google, Meta, Qualcomm |
| Chukaren 56 中部化学関係学協会支部連合秋季大会 / 56th Annual Meeting of Union of Chemistry-Related Societies in Chubu Area, Japanロジック / デバイス / プロセス統合 中部化学関係学協会支部連合協議会 | 会期終了 2025-11-09 260日前 2025-11-08 to 2025-11-09 / Gifu University, Gifu, Japan Gifu University / Gifu, Japan | Official Chukaren56 outline and submission pages identify presentation application, abstract manuscript deadline, program publication, and public Confit search/program rows. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official Chukaren56 Confit sources identify the November 8-9, 2025 Gifu University cycle, July 28 presentation application deadline, September 19 abstract manuscript deadline, October 8 program publication, execution committee rows, public search/program rows, and sponsor/ad/poster listing pages. | | Cross-society chemistry and materials sessions covering polymers, adhesives, rubber, colorants, oils, electrochemistry, analysis, surface/plasma technology, catalysis, energy and chemical engineering. Relevant to semiconductor process chemicals, coatings, slurry/dispersion control, advanced packaging polymers, surface treatment, battery/electrode materials, and materials/analysis supplier signals. 監視テーマ: 中部化学関係学協会支部連合秋季大会, 中化連, Chukaren, Chubu chemistry autumn meeting, polymers, adhesives, rubber, colorants, electrochemistry, analytical chemistry, surface technology, plasma, battery/electrode, JSR, Mitsubishi Chemical, Ferrotec, Shimadzu, Tokai Carbon, FiberCraze, Aisin, Bridgestone, Gifu University, Nagoya Institute of Technology, Nagoya University, and official Confit first-listed affiliation rows |
| ICPT International Conference on Planarization/CMP Technologyロジック / デバイス / プロセス統合 Chinese Tribology Institute, CMES / Tsinghua University / ICPT 2025 Organizing Committee | 会期終了 2025-11-01 268日前 2025-10-29〜11-01 / Hong Kong Science Park, Hong Kong, China Hong Kong Science Park / Hong Kong, Hong Kong, China | English abstract submission; accepted presenters submit full-length papers with 4-8 pages for oral presenters and 3-4 pages for poster presenters; preferred oral/poster format and topic area are specified at submission. Official ICPT 2025 pages list abstract deadline 2025-06-30, notification 2025-08-08 on the home page, full-length paper deadline 2025-08-31 on the abstract page, and poster/oral presentation inclusion in proceedings for registered presenters. | | chemical mechanical planarization / polishing、FEOL CMP、BEOL CMP、post-CMP cleaning、CMP consumables、equipment / metrology、3D IC / TSV / packaging、SiC / GaN / diamond substrate polishingを確認できる。 監視テーマ: CMP slurry, post-CMP cleaning, FEOL CMP, BEOL CMP, hybrid bonding, 3D IC / TSV, process control, metrology, consumables, SiC, GaN, diamond polishing |
| IEEE ISICAS IEEE International Symposium on Integrated Circuits and Systems回路 / システム / 設計自動化 IEEE Circuits and Systems Society / ISICAS Organizing Committee | 会期終了 2025-10-27 273日前 2025-10-26〜27 / Qingdao, China Hyatt Regency Qingdao / Qingdao, China | Official CFP accepts peer-reviewed journal-track submissions; graph data is hydrated from PostgreSQL researchVisualSignals. Official 2025 committee, program and homepage sponsor-logo sources checked. | | Integrated circuits, circuits and systems, AI hardware, chiplets and intelligent devices. 監視テーマ: integrated circuits, circuits and systems, AI hardware, chiplets, EDA |
| ASICON IEEE International Conference on ASIC回路 / システム / 設計自動化 IEEE Beijing Section / Fudan University / Yunnan University / National IC Innovation Center | 会期終了 2025-10-24 276日前 2025-10-21〜24 / Crowne Plaza Kunming City Centre, Kunming, China Crowne Plaza Kunming City Centre / Kunming, China | paper submission + technical program committee review ASICON 2025公式CFPは2025年10月21〜24日のKunming開催、IEEE Beijing Section sponsored by、Fudan University / Yunnan University / National IC Innovation Center co-sponsored byを案内している。 | | ASIC、integrated circuits、EDA、device / process、memory、sensor、bio-medical IC まで、アジアの回路・ASIC実装テーマを確認できる。 監視テーマ: ASIC, integrated circuits, EDA, memory, sensors, analog, digital, SoC |
| CSJ Chemistry Festa CSJ化学フェスタ / CSJ Chemistry Festaロジック / デバイス / プロセス統合 The Chemical Society of Japan | 会期終了 2025-10-24 276日前 2025-10-22 to 2025-10-24 / Tower Hall Funabori, Tokyo, Japan Tower Hall Funabori / Tokyo, Japan | Official CSJ Chemistry Festa 2025 sources identify student poster presentation application, public program/timetable publication, oral/plenary/festa/student-poster program surfaces, R&D exhibition guidance, advertisement circular, and official guide-map exhibitor listings. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official CSJ Chemistry Festa 2025 sources identify the October 22-24, 2025 Tower Hall Funabori cycle, July 3 student-poster presentation application deadline, September 25 web abstract publication timing, committee table, public program, top-page banner organizations, and R&D exhibitor guide-map source. | | Chemistry and materials research covering organic, inorganic, polymer, catalyst, battery, photonic, nanomaterial, analytical, smart-lab, materials-informatics, and manufacturing-related sessions. Relevant to semiconductor process chemicals, electronic materials, resist-adjacent chemistry, packaging materials, sensor materials, energy devices, and manufacturing support technologies. 監視テーマ: CSJ Chemistry Festa, CSJ化学フェスタ, chemical materials, polymer materials, catalysts, batteries, nanomaterials, materials informatics, smart lab, Sony Semiconductor Solutions, JACI, Zeon, Teijin, Shikoku Chemicals, Osaka Organic Chemical, Mitsubishi Gas Chemical, Nissan Chemical, Toagosei, JST, Mitsui Chemicals, Asahi Kasei, ENEOS, Kao, ADEKA, Tri Chemical, JSR, NEDO, MEXT ARIM, and official current-cycle public program affiliation rows |
| AVIC International Conference on Analog VLSI Circuits回路 / システム / 設計自動化 IEEJ Research Committee on Electronic Circuits | 会期終了 2025-10-22 278日前 2025-10-20〜22 / Kunibiki Messe, Matsue, Japan Kunibiki Messe / Matsue, Japan | paper submission via Microsoft CMT + author notification + final paper AVIC 2025公式はpaper submission、acceptance notification、final paper submissionを示し、IEEJ International Analog VLSI Workshopの後継として長期継続しているためB帯専門会議に分類する。 | | analog / mixed-signal IC、ADC/DAC、PLL/RF、energy harvesting、analog VLSI design automation、sensor/biomedical応用を専門的に追う。 監視テーマ: analog VLSI, mixed-signal IC, ADC, DAC, PLL, RF IC, analog design automation |
| IEEE SENSORS IEEE SENSORS Conferenceロジック / デバイス / プロセス統合 IEEE Sensors Council | 会期終了 2025-10-22 278日前 2025-10-19〜22 / Vancouver, Canada Parq Vancouver / Vancouver, Canada | Option A conference proceedings paper or Option B IEEE Sensors Letters paper + final paper 公式Important DatesとInitial Author InstructionsでOption A / Option B paper deadlines、acceptance notification、final paper deadlineを確認した。 | | sensors and sensing technologies、MEMS、biosensors、optical / chemical / physical sensors、AI sensors、industrial sensor systemsを横断して確認できる。 監視テーマ: MEMS sensors, biosensors, optical sensors, AI sensors, industrial sensor systems, sensor materials |
| IEEE SENSORS IEEE SENSORS Conferenceロジック / デバイス / プロセス統合 IEEE Sensors Council | 会期終了 2025-10-22 278日前 2025-10-19 to 22 / Vancouver, Canada Vancouver, Canada / Vancouver, Canada | IEEE SENSORS accepts peer-reviewed technical contributions. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official completed-cycle sources identify committee affiliation rows, named plenary affiliations, patron/exhibitor rows, and annual history. | | Sensors, MEMS, sensing systems, optical sensing, edge AI sensors, and microsystems. 監視テーマ: sensors, MEMS, edge AI, sensing systems, STMicroelectronics, Sony Semiconductor Solutions |
| JVSS Annual Meeting of the Japan Society of Vacuum and Surface Scienceロジック / デバイス / プロセス統合 The Japan Society of Vacuum and Surface Science (JVSS) | 会期終了 2025-10-22 278日前 2025-10-20〜2025-10-22 / Tsukuba International Congress Center, Tsukuba, Japan Tsukuba International Congress Center / Tsukuba, Japan | Official JVSS 2025 call-for-abstracts page says abstracts are entered directly on the web in English, with title, authors, affiliations, contents, summary, and an optional uploaded figure file. Official JVSS 2025 pages identify October 20-22, 2025 at Tsukuba International Congress Center, abstract submission from June 17 to the extended August 15 17:00 deadline, public Confit session/search pages, official committees, sponsor/exhibitor listings, supporting organizers, and the semiconductor/electronic-device program category. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | surface science, vacuum science and technology, surface analysis, thin films, low-dimensional materials, semiconductor / magnetic / electronic / photonic devices, electronic material processing, plasma science, and energy/environmental materialsを確認できる。 監視テーマ: surface analysis, vacuum equipment, thin-film processing, electronic material processing, semiconductor devices, photonic devices, spintronics, plasma processing, analytical equipment suppliers |
| 電子材料研究討論会 電子材料研究討論会ロジック / デバイス / プロセス統合 日本セラミックス協会電子材料部会 | 会期終了 2025-10-21 279日前 2025-10-20〜21 / 慶應義塾大学 日吉キャンパス 慶應義塾大学 日吉キャンパス / Yokohama, Japan | 講演申込 + 要旨PDF / 口頭・ポスター発表 公式第45回ページは2025年10月20〜21日の開催、講演申込締切2025年9月5日、口頭・ポスター・招待講演のprogramを案内している。 | | 電子材料、デバイス、作製プロセス技術、強誘電体・誘電体・セラミックス材料を日本の電子材料コミュニティで確認できる。 監視テーマ: electronic materials, ferroelectrics, dielectric ceramics, oxide thin films, MLCC, process materials, battery and sensor materials |
| IEEE BioCAS IEEE Biomedical Circuits and Systems Conference回路 / システム / 設計自動化 IEEE Circuits and Systems Society / BioCAS 2025 Organizing Committee | 会期終了 2025-10-18 282日前 2025-10-16〜18 / Khalifa University, Abu Dhabi, United Arab Emirates Khalifa University / Abu Dhabi, United Arab Emirates | IEEE conference paper / full author registration and presentation required for proceedings eligibility 公式programは公開済み。session-chair affiliationは確認できるが、accepted paperのfirst-listed author affiliationを安全に対応付けられるrosterは公開sourceから確認できないため推測しない。 | | biomedical circuits and systems、biosensor interfaces、implantable and wearable devices、neuromorphic circuits、BioMEMS、power managementを横断して確認できる。 監視テーマ: biosensor interfaces, implantables, wearables, neuromorphic circuits, BioMEMS, power management |
| MANA Symposium MANA International Symposiumロジック / デバイス / プロセス統合 Research Center for Materials Nanoarchitectonics (MANA), National Institute for Materials Science (NIMS) | 会期終了 2025-10-17 283日前 2025-10-16 to 2025-10-17 / Tsukuba, Ibaraki, Japan NIMS WPI-MANA Namiki Site / Tsukuba, Japan | The official completed-cycle site publishes a complete public presenter list with current affiliations across plenary, invited, NIMS, and poster categories. It does not expose a complete multi-author accepted-paper affiliation roster. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official sources identify the October 16-17, 2025 Tsukuba cycle, 8 organizing-committee rows, 70 public presenter affiliation rows, one host-organization row, and the 18th annual symposium. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Materials nanoarchitectonics, quantum materials, thermal transport, semiconductors, two-dimensional materials, nanophotonics, energy materials, surface and interface science, and nanoscale measurement. 監視テーマ: MANA, NIMS, nanoarchitectonics, quantum materials, thermal transport, semiconductors, 2D materials, nanophotonics, energy materials, surface and interface science |
| FMCAD Formal Methods in Computer-Aided Design回路 / システム / 設計自動化 FMCAD Association / IEEE CEDA technical co-sponsor | 会期終了 2025-10-10 290日前 2025-10-06 to 2025-10-10 / SRI Headquarters, Menlo Park, CA, USA SRI Headquarters / Menlo Park, California, United States | Official FMCAD 2025 call-for-papers guidance identifies regular papers up to 8 pages and short papers up to 4 pages, EasyChair submission, original-research expectations, single-blind review, rebuttal, and review by at least four program-committee members. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official FMCAD 2025 sources identify the October 6-10, 2025 Menlo Park cycle, April 30 abstract deadline, May 5 paper deadline, July 1 author notification, August 15 camera-ready deadline, official organizing/program/steering committee rows, official accepted-paper rows, EasyChair program-person affiliation rows, supporter/co-sponsor logo rows, and TU Wien proceedings context. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Formal methods in computer-aided design, hardware and system verification, model checking, SAT and SMT solving, temporal logic, runtime monitoring, synthesis, theorem proving, formal verification of accelerators, memory-management verification, compiler translation validation, neural-network robustness, LLM-assisted formalization, and tool-supported reasoning for computing systems. 監視テーマ: FMCAD, formal methods, hardware verification, system verification, EDA, model checking, SAT, SMT, synthesis, theorem proving, runtime monitoring, software verification, AWS, Cadence, Futurewei, GE Aerospace, Siemens, SRI, TU Wien, Stanford, University of Texas at Austin, Carnegie Mellon University, CISPA, and official EasyChair accepted-paper first-listed affiliation rows |
| FNTG Symposium Fullerenes-Nanotubes-Graphene General Symposium / フラーレン・ナノチューブ・グラフェン総合シンポジウムロジック / デバイス / プロセス統合 The Fullerenes, Nanotubes, Graphene Research Society | 会期終了 2025-09-26 304日前 2025-09-24 to 2025-09-26 / National Taiwan Normal University, Taipei, Taiwan National Taiwan Normal University / Taipei, Taiwan | Official FNTG69 submission source identifies one-page English PDF abstract upload through the submission website, oral or poster presentation format, English slides/posters and English presentation language, and an abstract-book publication date. The official award page identifies document screening for award applicants; the general presentation review form is not otherwise asserted. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official FNTG69 sources identify the September 24-26, 2025 National Taiwan Normal University cycle, June 2 opening, July 11 extended presentation-application deadline, one-page PDF abstract format, public online program, invited/special and award affiliation rows, and official organizer/co-organizer/support/sponsor rows. | | Nanocarbon and atomic-layer-materials research covering fullerenes, carbon nanotubes, graphene, TMDs, van der Waals materials, 2D electronics, CNT FETs, wafer-scale crystal growth, CVD, optical and transport measurements, gate-stack engineering, and device-material integration. Relevant to semiconductor materials, FEOL-adjacent 2D device research, photonics/material characterization, and wide-bandgap-adjacent process/device topics. 監視テーマ: FNTG General Symposium, carbon nanotube FET, 2D electronics, graphene, TMDs, van der Waals gate stacks, wafer-scale TMD growth, TSMC Corporate Research special lecture, National Taiwan Normal University, University of Tokyo, Seoul National University, KAIST, AIST, NIMS, and official organizer/co-organizer/support/sponsor rows |
| CSJ Fall Meeting 日本セラミックス協会秋季シンポジウム / The Ceramic Society of Japan Fall Meetingロジック / デバイス / プロセス統合 The Ceramic Society of Japan | 会期終了 2025-09-19 311日前 2025-09-17 to 2025-09-19 / Gunma University Aramaki Campus, Maebashi, Gunma, Japan Gunma University Aramaki Campus / Maebashi, Gunma, Japan | Official CSJ Fall 38 submission page states that presentation applications were accepted online from May 9 to May 23, 2025, proceedings manuscripts from July 1 to July 18, 2025, and oral/poster presentation formats were available. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official CSJ Fall 38 pages identify the September 17-19, 2025 Gunma University cycle, 24 accepted special sessions, official session-organizer blocks, English program presentation rows, session support/co-host organization list, corporate exhibition rows, and R&D career-booth rows. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Ceramic materials, electronic ceramics, dielectric materials, oxide and oxoate materials, energy conversion and storage ceramics, sensors and transducers, photoceramics, structural ceramics, powders, sintering, processing, informatics, resource recycling, and analysis methods relevant to semiconductor and electronic-materials research. 監視テーマ: CSJ Fall Meeting, electronic ceramics, dielectric materials, oxides, ceramic sensors, powder processing, sintering, electronic-materials program affiliation mix, Murata/Taiyo Yuden/Shinagawa/Krosaki/TDK/Tosoh exhibitor and program signals |
| ICDS International Conference on Defects in Semiconductorsロジック / デバイス / プロセス統合 ICDS-33 Organizing Committee / Fudan University / Chinese Academy of Sciences | 会期終了 2025-09-19 311日前 2025-09-14〜19 / Fudan University, Shanghai, China Yifu Building of Science and Technology, Fudan University / Shanghai, China | Official abstracts page requested abstracts for oral or poster presentations; the abstract deadline was 2025-04-30 and final acceptance notice was before 2025-05-10. Official ICDS-33 abstracts page shows oral/poster abstract submission, 2025-04-30 final abstract deadline, 2025-05-10 final acceptance notice, and poster upload / printing guidance. | | defects in semiconductors、point defects、wide-bandgap materials、SiC/GaN、quantum defects、photovoltaic materials、device reliability、first-principles defect modelingを確認できる。 監視テーマ: semiconductor defects, point defects, quantum defects, SiC reliability, GaN defects, oxide defects, photovoltaic materials, first-principles calculations, defect spectroscopy |
| IVC International Vacuum Congressロジック / デバイス / プロセス統合 IUVSTA / Vacuum Society of Australia / IVC-23 Local Organising Committee | 会期終了 2025-09-19 311日前 2025-09-15〜2025-09-19 / Sydney Masonic Centre, Sydney, Australia Sydney Masonic Centre / Sydney, Australia | Official IVC-23 public programme sources expose presentation codes and presenter surnames; the public pages do not expose accepted-presentation affiliation strings. Registration/event pages identify the completed 2025 Sydney cycle. Official IVC-23 sources identify the September 15-19, 2025 Sydney Masonic Centre cycle, local organising committee, public printable programme, IUVSTA/Ebara awardee pages, vacuum short course, sponsors/exhibitors, and sponsorship prospectus. | | Vacuum science and technology、surface science、thin films、plasma processing、deposition、etching、mass spectrometry、XPS/surface analysis、nanofabrication、semiconductor vacuum equipment、materials researchを確認できる。 監視テーマ: vacuum systems, dry vacuum pumps, thin film deposition, etching, plasma modification, XPS, mass spectrometry, semiconductor process tools, nanofabrication, surface science |
| JIMM Autumn Meeting 日本金属学会秋期講演大会 / The Japan Institute of Metals and Materials Autumn Meetingロジック / デバイス / プロセス統合 The Japan Institute of Metals and Materials | 会期終了 2025-09-19 311日前 2025-09-17 to 2025-09-19 / Hokkaido University Sapporo Campus, Sapporo, Hokkaido, Japan Hokkaido University Sapporo Campus / Sapporo, Hokkaido, Japan | Official JIMM 2025 Autumn guide identifies online presentation application windows and public Confit session pages. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official JIMM 2025 Autumn sources identify the September 17-19, 2025 Hokkaido University cycle, presentation application and registration windows, official executive-chair row, public session sample rows, official completion counts, event archive context, and 18 official exhibitor rows. | | Metals and materials research covering alloys, phase transformations, microstructure, diffusion, corrosion, mechanical properties, functional materials, powder metallurgy, joining, processing, characterization, and computational materials science. Relevant to semiconductor materials, advanced packaging, interconnect metallurgy, diffusion barriers, reliability, and process integration. 監視テーマ: JIMM Autumn Meeting, metals and materials science, metallurgy, alloy processing, microstructure, diffusion, interconnect/reliability materials, official chair row, visible first-listed affiliation sample, official completed-cycle presentation count, and official exhibitor rows |
| JSPE Autumn Meeting 2025年度精密工学会秋季大会学術講演会 / JSPE Autumn Meeting露光 / パターニング / 配線 / 量産 The Japan Society for Precision Engineering | 会期終了 2025-09-19 311日前 2025-09-17 to 2025-09-19 / Kyoto University Yoshida Campus, Kyoto, Japan Kyoto University, Yoshida Campus / Kyoto, Kyoto, Japan | Official JSPE 2025 Autumn sources identify presentation application, PDF manuscript/proceedings submission, public program PDF, electronic program/abstract book, and a completed September 2025 academic meeting. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official JSPE 2025 Autumn sources identify the September 17-19, 2025 Kyoto University cycle, May 15-June 5 presentation application window, July 7 manuscript deadline, program PDF, event-page talk count, executive committee list, final equipment exhibitor map, website banner advertiser rows, and semiconductor manufacturing technology symposium context. | | Precision engineering and manufacturing research covering micro/nano machining, CMP and planarization, MEMS commercialization, precision positioning, metrology, optical/X-ray measurement, laser processing, surface nanostructures, CAD/CAM, additive manufacturing, and semiconductor manufacturing equipment development. Relevant to semiconductor process control, wafer processing, inspection/metrology, manufacturing equipment, and process-integration research. 監視テーマ: JSPE Autumn Meeting, precision engineering, micro/nano machining, CMP and planarization, MEMS commercialization, precision positioning, metrology, semiconductor manufacturing symposium, official program PDF presenter-affiliation extract, official equipment exhibitor rows, website banner advertiser rows, Tokyo Seimitsu, DMG Mori, Mitsubishi Electric, Allied Material, Shimadzu, and JTEKT |
| MSJ Annual Meeting Magnetics Society of Japan Annual Meetingロジック / デバイス / プロセス統合 Magnetics Society of Japan / 49th Annual Meeting Executive Committee | 会期終了 2025-09-19 311日前 2025-09-16〜2025-09-19 / Ehime University Johoku Campus, Matsuyama, Japan Ehime University Johoku Campus / Matsuyama, Japan | Official 2025 meeting outline states oral and poster presentation formats and lists the general / symposium abstract manuscript deadline as 2025-06-16. Official 2025 pages identify the September 16-19 Ehime University cycle, web abstract/program pages, executive committee, exhibitor/recruit exhibition, and supporting-member presentation sources. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | magnetic materials, spintronics, magnetic recording, HDD/storage, magnetic sensors, power electronics magnetic cores, measurement, thin films, ferrites, and magnetics applicationsを確認できる。 監視テーマ: spintronics, magnetic memory, HDD, magnetic sensors, power electronics, soft magnetic materials, ferrites, thin-film magnets, magnetic measurement equipment |
| IEEE NAP IEEE International Conference "Nanomaterials: Applications & Properties"ロジック / デバイス / プロセス統合 IEEE Nanotechnology Council / IEEE NAP Organizing Committee | 会期終了 2025-09-12 318日前 2025-09-07〜12 / Crowne Plaza Hotel, Bratislava, Slovakia Crowne Plaza Hotel, Bratislava / Bratislava, Slovakia | 2025公式archiveは、4ページ以上のmanuscriptがpeer reviewを受け、original researchはIEEE Xplore / Scopus収録候補になると説明しています。 2025年Bratislava cycleの公式committee、scientific program、Book of Abstracts、partner / sponsor / endorsed-by / support listings、2011年からの年次開催historyを確認済みです。DAC型signal graphはPostgreSQL researchVisualSignalsを正本にします。 | | Nanomaterials、MXenes、nanoscale materials、semiconductor materials、sensors、quantum / low-power electronics、advanced materials processingを横断して追う会議です。 監視テーマ: nanomaterials、MXenes、low-power electronics、semiconductor materials、sensors、quantum materials、thin films、nanoelectronics |
| IEICE Society 電子情報通信学会ソサイエティ大会 / IEICE Society Conference回路 / システム / 設計自動化 一般社団法人 電子情報通信学会 / The Institute of Electronics, Information and Communication Engineers | 会期終了 2025-09-12 318日前 2025-09-08〜2025-09-12 / 岡山大学 津島キャンパス 岡山大学 津島キャンパス / Okayama, Japan | Official 2025 Society Conference sources identify online presentation registration/submission, general and organized sessions, Confit web-program publication, and proceedings publication. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official 2025 sources identify the September 8-12, 2025 Okayama University cycle, June 27 presentation registration/submission deadline, August 1 web-program publication, August 26 proceedings release, committee tables, Confit presentation search rows, and IEICE EXPO 2025 sponsor/exhibitor/advertiser listings. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | electronics, information and communication engineering, communications, circuits, photonics, networks, EMC, antennas, satellite communications, student sessions, and corporate exhibition signalsを横断して確認できる。 監視テーマ: communications, electronics, circuits, photonics, wireless, optical networks, EMC, antennas, satellite communications, corporate exhibition, recruiting exhibition, sponsored sessions, Japanese semiconductor ecosystem signals |
| MolSci Annual 分子科学討論会 / Annual Meeting of Japan Society for Molecular Scienceロジック / デバイス / プロセス統合 Japan Society for Molecular Science | 会期終了 2025-09-12 318日前 2025-09-09 to 2025-09-12 / International Conference Center Hiroshima, Hiroshima, Japan International Conference Center Hiroshima / Hiroshima, Japan | Official 2025 presentation guidance identifies one general presentation per presenter, oral and poster formats, a 300-character program abstract at application time, presentation-application modification/cancellation during the application period, and password-controlled abstract access for registered participants. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals and uses official public oral/poster pages for first-listed affiliation rows. Official 2025 sources identify the September 9-12, 2025 Hiroshima cycle, April 14-May 27 presentation-application period, July 15-August 1 abstract-submission period, July 14 program publication, August 29 abstract publication target, committee rows, official sponsor listing, and public oral/poster program affiliation rows. | | Molecular science research covering molecular spectroscopy, chemical physics, clusters and interfaces, photochemistry, energy transfer, biomolecular chemistry, quantum chemistry, computational molecular science, functional molecular materials, optical measurement, and chemical analysis. Relevant to semiconductor photonics, optoelectronic materials, molecular electronics, process and surface chemistry, sensors, measurement tools, and device-adjacent materials modeling. 監視テーマ: 分子科学討論会, Annual Meeting of Japan Society for Molecular Science, molecular spectroscopy, photochemistry, clusters, interfaces, quantum chemistry, computational chemistry, functional molecular materials, optical measurement, RIKEN, Institute for Molecular Science, Hiroshima University, Institute of Science Tokyo, DIC, DENSO, Toyota Central R&D Labs, Ayabo, Tokyo Instruments, Spectra-Physics, HPCTECH, X-Ability, MSH Systems, LUMIBIRD Japan, and official oral/poster first-listed affiliation rows |
| POC 基礎有機化学討論会 / Symposium on Physical Organic Chemistryロジック / デバイス / プロセス統合 基礎有機化学会 / Society of Physical Organic Chemistry, Japan | 会期終了 2025-09-11 319日前 2025-09-09 to 2025-09-11 / Nagoya University Higashiyama Campus, Nagoya, Japan Nagoya University, Higashiyama Campus / Nagoya, Japan | Official POC35 outline and program sources identify presentation application, poster-extension deadline, abstract manuscript submission period, public oral/poster program PDFs, oral and poster presentation formats, and a completed September 2025 program. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official POC35 sources identify the September 9-11, 2025 Nagoya University Higashiyama Campus cycle, May 13-June 10 presentation application period, poster-only extension to June 17, July 3-15 abstract manuscript submission period, August 20 updated oral/poster program PDFs, 15 organizing committee rows, 401 public program code rows, and 31 official sponsor/support organization rows. | | Physical organic chemistry and molecular materials research spanning structural organic chemistry, organic reaction chemistry, host-guest chemistry, supramolecular chemistry, organic electronics, photophysics, radical and spin chemistry, porous organic frameworks, organic semiconducting molecules, analytical instrumentation, chemical suppliers, and company-academic materials R&D signals. 監視テーマ: 基礎有機化学討論会, Symposium on Physical Organic Chemistry, POC35, structural organic chemistry, organic reaction chemistry, host-guest chemistry, supramolecular chemistry, organic electronics, photophysics, Tokyo Chemical Industry, JASCO, Rigaku, JSR, DIC, Tosoh, Daicel, EneCoat Technologies, Royal Society of Chemistry, and official first-listed program affiliation rows |
| Photochemistry 光化学討論会 / Annual Meeting on Photochemistryロジック / デバイス / プロセス統合 The Japanese Photochemistry Association | 会期終了 2025-09-06 324日前 2025-09-04 to 2025-09-06 / Rikkyo University Ikebukuro Campus, Tokyo, Japan Rikkyo University, Ikebukuro Campus / Tokyo, Japan | Official 2025 English page identifies oral and poster presentation types, presentation registration, abstract submission, recommendation submission, and possible pre-screening for student award candidates when applications are numerous. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 2025 sources identify the September 4-6, 2025 Rikkyo University Ikebukuro cycle, April 25-June 9 presentation-registration period, June 23-July 7 abstract-submission period, committee rows, official sponsor listing, and Confit public general oral/poster program affiliation rows. | | Photochemistry research covering photophysics, organic and inorganic photochemistry, bio-related photochemistry, light energy conversion, artificial photosynthesis, photofunctional materials, luminescent materials, spectroscopy, optical measurement, and photonic or optoelectronic materials. Relevant to semiconductor photonics, compound/organic optoelectronics, light-emitting materials, optical sensors, solar-energy materials, measurement tools, and device-adjacent materials research. 監視テーマ: Annual Meeting on Photochemistry, 光化学討論会, photofunctional materials, luminescent materials, artificial photosynthesis, light energy conversion, spectroscopy, optical measurement, Hamamatsu Photonics, Shimadzu, JASCO, TOPTICA, Spectra-Physics, Tokyo Instruments, HORIBA, CCS, AIP Publishing, Chemical Physics Reviews, and official Confit first-listed affiliation rows |
| FPL FPL / International Conference on Field-Programmable Logic and Applications回路 / システム / 設計自動化 International Conference on Field-Programmable Logic and Applications / FPL Steering Committee | 会期終了 2025-09-05 325日前 2025-09-01 to 2025-09-05 / Leiden, The Netherlands Leiden, The Netherlands / Leiden, Netherlands | Official FPL 2025 call-for-papers source identifies original unpublished IEEE-format long and short paper submissions, strict page limits, IEEE Xplore proceedings, EasyChair submission, and double-blind review. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official FPL 2025 sources identify the September 1-5, 2025 Leiden cycle, March 21 extended abstract deadline, March 30 extended full-paper deadline, May 27 acceptance notification, Program Committee source, official program page, and Gold Sponsor listing source. | | Field-programmable logic and reconfigurable computing research covering FPGA architectures and technology, design methods and tools, application acceleration, system software, high-performance computing, safety-critical applications, security, embedded processors, AI accelerators, routing, soft cores, and programmable datapaths. Relevant to semiconductor design automation, configurable hardware, accelerator architecture, SoC/FPGA prototyping, and EDA research. 監視テーマ: FPL, field-programmable logic, reconfigurable computing, FPGA architectures, design methods and tools, application acceleration, high-performance computing, system software, security of reconfigurable systems, Program Committee affiliation mix, keynote and industry-event affiliation rows, AMD, Altera, Xilinx, Optiver, IMC, and official Gold Sponsor listing |
| LT30 International Conference on Low Temperature Physicsパワー半導体 / Wide-Bandgap LT30 Organizing Committee / International Union of Pure and Applied Physics (IUPAP) | 最終原稿締切 2026-02-10 167日前 2025-08-07 to 13 / Bilbao Exhibition Centre, Bilbao, Spain Bilbao Exhibition Centre / Bilbao, Spain | Official LT30 proceedings and abstracts page lists web abstract submission, committee-selected invited and contributed presentation slots, and a Journal of Low Temperature Physics collection submission window. Official LT30 home lists 2025-04-03 as the extended abstract deadline, 2025-08-07 to 2025-08-13 as the Bilbao conference dates, and 2026-02-10 as the proceedings collection submission close. | | Low-temperature physics, superconductivity, quantum materials, nanophysics, quantum transport, cryogenic techniques, and quantum information technologies relevant to cryogenic semiconductor and quantum-device research. 監視テーマ: superconductivity, superconducting quantum circuits, cryogenic instrumentation, quantum materials, quantum transport, low-temperature nanophysics |
| ICNS International Conference on Nitride Semiconductorsロジック / デバイス / プロセス統合 ICNS International Advisory Committee | 会期終了 2025-07-11 381日前 2025-07-06〜11 / MalmoMassan, Malmo, Sweden MalmoMassan / Malmo, Sweden | abstract submission / program committee selection GaN/窒化物半導体全般の旗艦級会議として、power専用ではない材料・デバイス動向を拾える。 | | nitride semiconductors、GaN、AlN、epitaxy、optoelectronics、RF、power devicesを材料・デバイス横断で確認する。 監視テーマ: GaN, AlN, nitride semiconductors, epitaxy, RF, optoelectronics, power devices |
| OECC OECC / OptoElectronics and Communications Conference回路 / システム / 設計自動化 IEICE Communications Society and IEICE Electronics Society / OECC/PSC 2025 Organizing Committee | 会期終了 2025-07-03 389日前 2025-06-29 to 2025-07-03 / Sapporo Convention Center, Sapporo, Japan Sapporo Convention Center / Sapporo, Japan | Official submission guidance identifies IEEE PDF eXpress use, Conference ID 65029X, paper-submission templates, copyright-transfer and upload workflow, and proceedings publication timing. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals; the public Program Book and Technical Digest are marked as registrant-only, so program affiliation rows use public speaker/workshop/organizer surfaces and the official presentation total is stored separately. Official OECC/PSC 2025 sources identify the June 29-July 3, 2025 Sapporo cycle, extended March 12, 2025 paper submission deadline, end-of-April acceptance notice target, May 14 program online timing, June 23 publication date, OECC organizing/TPC/IAC rows, and sponsor/exhibitor/support/technical-co-sponsor/cooperation listings. | | Optoelectronics and optical communications research covering optical transmission and networking, access/PON, coherent optics, photonic devices, silicon photonics, optical modules, fiber components, datacenter interconnects, optical sensing, photonic-electronic convergence, and AI-era communications infrastructure. Relevant to semiconductor photonics, compound/device processes, optical packaging, high-speed circuits, and system-level communications research. 監視テーマ: OECC, OECC/PSC 2025, optoelectronics, optical communications, silicon photonics, coherent optics, data center interconnects, photonic-electronic convergence, optical transceivers, PON, NTT, NEC, Fujitsu, KDDI, Mitsubishi Electric, Santec, Keysight Technologies, NTT Innovative Devices, and official public speaker/organizer affiliation plus sponsor/exhibitor rows |
| ISEC International Superconductive Electronics Conference回路 / システム / 設計自動化 ISEC 2025 organizers / IEEE Council on Superconductivity support | 会期終了 2025-06-19 403日前 2025-06-15〜19 / Erfurt, Germany Erfurt, Germany / Erfurt, Germany | abstract review by Program Committees; presenting author institution and country are required in the official submission form. ISEC 2025 official submissions page confirms abstract review by Program Committees, acceptance notification, and IEEE Council on Superconductivity support. | | superconducting electronics、single photon detection、quantum computing、SQUID、superconducting digital circuits、cryogenic EDA、Josephson junction fabricationを確認する。 監視テーマ: superconducting electronics, SFQ, AQFP, SQUID, superconducting qubits, SNSPD, cryogenic digital control, superconducting EDA, Josephson junction fabrication |
| EM-NANO International Symposium on Organic and Inorganic Electronic Materials and Related Nanotechnologiesロジック / デバイス / プロセス統合 EM-NANO 2025 Organizing Committee / The Japan Society of Applied Physics | 会期終了 2025-06-14 408日前 2025-06-11〜2025-06-14 / Fukui, Japan Fukui, Japan / Fukui, Japan | Official call-for-paper page lists A4 PDF abstract submission in English, including title/authors/affiliations/address/email/article text, and says the final program is determined by the Program Committee. Official EM-NANO 2025 pages identify the 10th symposium, June 11-14, 2025 in Fukui, official committee tables, public plenary/invited speakers, sponsor logos, supporting organizations, and sponsorship package context. The reviewed DAC型signal uses PostgreSQL researchVisualSignals for DAC型 graphs. | | organic and inorganic electronic materials, wide bandgap semiconductor devices, oxide materials, photovoltaics, spintronics, silicon LSI emerging technologies, nanotechnologies, and related device materialsを確認できる。 監視テーマ: wide bandgap semiconductors, SiC/GaN/oxide devices, organic electronics, nanotechnologies, photovoltaics, spintronics, silicon LSI emerging technologies, semiconductor materials suppliers |
| ETS IEEE European Test Symposium回路 / システム / 設計自動化 Tallinn University of Technology (TalTech) / Testonica | 会期終了 2025-05-30 423日前 2025-05-26 to 2025-05-30 / Tallinn, Estonia Swissotel Tallinn / Tallinn, Estonia | Regular research papers, industrial papers, special sessions, tutorials, panels, and formal IEEE Xplore proceedings. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official ETS'25 sources identify the completed May 26-30 Tallinn cycle, committee, technical program, corporate supporters, technical sponsors, and annual series history. | | Circuit and system test, DFT, validation, reliability, yield, safety, security, ATE, chiplet, and post-silicon debug research. 監視テーマ: DFT, ATE, validation, yield, reliability, hardware security, chiplet test, silicon lifecycle management |
| Nano Society Annual Meeting ナノ学会大会 / Annual Meeting of the Society of Nano Science and Technologyロジック / デバイス / プロセス統合 The Society of Nano Science and Technology / Nano 2025 Executive Committee | 会期終了 2025-05-16 437日前 2025-05-14 to 2025-05-16 / Tokyo Metropolitan University Minami-Osawa Campus, Hachioji, Tokyo, Japan Tokyo Metropolitan University Minami-Osawa Campus / Hachioji, Tokyo, Japan | Official Nano Society 2025 presentation-application page lists oral or poster presentation format, Japanese or English presentation language, and one-page PDF proceedings manuscript submission. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official Nano Society 2025 pages identify the May 14-16, 2025 Tokyo Metropolitan University cycle, April 7 presentation-application/proceedings-manuscript deadline, executive committee rows, official public program PDF presentation rows, sponsor/advertising/banner/exhibition listings, and the Society archive listing the founding meeting in 2003. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Nanoscience and nanotechnology, nanoclusters, nanoparticles, nanomaterials, catalysis, spectroscopy, sensors, bio/nano materials, photonic and electronic properties, and molecular/material synthesis topics relevant to semiconductor-adjacent materials research. 監視テーマ: Nano Society annual meeting, nanoclusters, nanoparticles, nanoelectronics, nanomaterials, catalysts, sensors, AIST/NIMS/Tokyo Metropolitan University/University of Tokyo/Kyoto University program participation, sponsor advertising and exhibition listings |
| AICAS IEEE International Conference on Artificial Intelligence Circuits and Systems回路 / システム / 設計自動化 IEEE Circuits and Systems Society / AICAS 2025 Organizing Committee | 会期終了 2025-04-30 453日前 2025-04-28 to 2025-04-30 / ENSEIRB-MATMECA of Bordeaux, Talence, France ENSEIRB-MATMECA of Bordeaux / Bordeaux, France | Official AICAS 2025 paper-submission guidance identifies five-page full-length papers, IEEE conference templates, anonymous submission, blind review, and original unpublished work requirements. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official AICAS 2025 sources identify the April 28-30, 2025 Bordeaux cycle, October 17, 2024 unique extended paper deadline, December 18, 2024 regular-paper acceptance notification, January 10, 2025 camera-ready deadline, organizing committee source, public keynote/session-chair source, and bronze sponsor source links. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Artificial intelligence circuits and systems, AI accelerators, compute-in-memory and in-memory computing, neuromorphic and bioinspired processors, hardware/software co-design, circuit/system design automation for AI, edge AI, emerging AI devices and materials, and AI-enabled circuit/system applications. 監視テーマ: AICAS, IEEE CASS, artificial intelligence circuits and systems, AI accelerators, in-memory computing, compute-in-memory, neuromorphic processors, bioinspired circuits, edge AI, design automation for AI systems, T-HEAD, Arm, STMicroelectronics, Thales TRT, University of Bordeaux, University of Lille, CEA-Leti, Xidian University, Shanghai Jiao Tong University, ETH Zurich, and official session-chair affiliation rows |
| CSJ Spring Annual 日本化学会春季年会 / Chemical Society of Japan Spring Annual Meetingロジック / デバイス / プロセス統合 The Chemical Society of Japan | 会期終了 2025-03-29 485日前 2025-03-26 to 2025-03-29 / Kansai University Senriyama Campus, Suita, Osaka, Japan Kansai University, Senriyama Campus / Suita, Japan | Official 第105春季年会 sources identify presentation application, abstract manuscript posting, public program publication, session detail pages, and proceedings publication timing. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 第105春季年会 sources identify the March 26-29, 2025 Kansai University Senriyama Campus cycle, November 1-28, 2024 presentation application period, December 5, 2024-January 14, 2025 abstract manuscript submission period, January 23, 2025 program publication date, March 12, 2025 proceedings publication date, committee rows, Confit public session rows, top-page ad-banner organizations, and exhibition cooperation evidence. | | Chemistry and materials research covering organic, inorganic, polymer, physical, analytical, electrochemical, photochemical, catalysis, chemical biology, education, and industry-academic program tracks. Relevant to semiconductor process chemicals, electronic and optical materials, packaging polymers, catalysts, batteries, sensors, process analysis, and chemical manufacturing support technologies. 監視テーマ: 日本化学会春季年会, Chemical Society of Japan Spring Annual Meeting, CSJ 105th, chemical materials, polymers, catalysts, electrochemistry, photochemistry, analytical chemistry, Sony Semiconductor Solutions, Toray Research Center, Rigaku, CAS, ACS Publications, FUJIBO, ISHIFUKU, KIRIYAMA, Asahi Lab Trading, and official first-listed Confit program affiliation rows |
| ISPlasma International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterialsパワー半導体 / Wide-Bandgap ISPlasma / IC-PLANTS Committee | 会期終了 2025-03-07 507日前 2025-03-03〜07 / Chubu University, Nagoya, Japan Chubu University / Nagoya, Japan | online abstract submission + late news PDF abstract + oral/poster program + proceedings download 公式Important DatesとLate News Submissionでabstract / late news submission、公式Programでoral/poster sessionsとConfit finalized program導線を確認した。 | | nitride semiconductors、wide band gap semiconductors、plasma processing、nanomaterials、bio applicationsを同じ場で確認できる。 監視テーマ: nitride semiconductors, WBG, plasma processing, nanomaterials, topical sessions |
| Joint MMM-Intermag Joint MMM-Intermag ConferenceMemory / Reliability / Failure Physics AIP Publishing and IEEE Magnetics Society | 会期終了 2025-01-17 556日前 2025-01-13 to 2025-01-17 / Hyatt Regency New Orleans, New Orleans, Louisiana, United States Hyatt Regency New Orleans / New Orleans, Louisiana, United States | Official abstract-submission source identifies ScholarOne abstract submission, oral or poster presentation formats, early visa notification, Program Committee acceptance criteria, and in-person / virtual poster boundaries. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 2025 Joint MMM-Intermag sources identify the January 13-17, 2025 New Orleans cycle, July 19, 2024 abstract deadline, September 20, 2024 author notifications, Program Book / Abstract Book downloads, organizing and program committee rows, and confirmed partner/exhibitor listing rows. | | Magnetism and magnetic materials research spanning spintronics, magnetic recording, MRAM-adjacent devices, magnetic sensors, high-frequency and power magnetic devices, thin films, nanomagnetics, quantum materials, magnetic characterization, and applied magnetics. Relevant to semiconductor memory, reliability, device physics, materials integration, sensors, and metrology research. 監視テーマ: Joint MMM-Intermag, Intermag, MMM, spintronics, magnetic recording, MRAM, magnetic sensors, Program Book first-listed affiliation mix, NIST, Western Digital, Seagate, IBM, Samsung Electronics, TDK, Toshiba, Materion, Lake Shore Cryotronics, and official partner/exhibitor rows |
| JSSRR Annual Meeting 日本放射光学会年会・放射光科学合同シンポジウム / Japanese Society for Synchrotron Radiation Research Annual Meeting and Joint Symposium in Synchrotron Radiation Scienceロジック / デバイス / プロセス統合 The Japanese Society for Synchrotron Radiation Research | 会期終了 2025-01-12 561日前 2025-01-10 to 2025-01-12 / Tsukuba International Congress Center, Tsukuba, Ibaraki, Japan Tsukuba International Congress Center (Epochal Tsukuba) / Tsukuba, Ibaraki, Japan | Official JSSRR 2025 Confit pages identify oral, poster, and facility-report presentations for the completed cycle. Reviewed public graph data is hydrated from PostgreSQL researchVisualSignals. Official JSSRR 2025 sources identify the January 10-12, 2025 Tsukuba cycle, completed-cycle counts, organization committee rows, public session/presentation rows, full official exhibitor listing, co-host organizations, and current-cycle context from JSSRR 2026. | | Synchrotron radiation science and beamline research covering light sources, beamline and detector systems, XFEL, VUV/soft X-ray and X-ray spectroscopy, diffraction/scattering, imaging, XAFS, infrared/terahertz, biological applications, industrial use, and facility reports. Relevant to semiconductor materials analysis, surface/interface characterization, thin films, device materials, metrology, and process-control research. 監視テーマ: JSSRR Annual Meeting, synchrotron radiation science, XAFS, diffraction and scattering, imaging, surface/interface spectroscopy, industrial use, beamline instrumentation, official committee mix, visible first-listed affiliation sample, and official exhibitor rows |
| ISSM International Symposium on Semiconductor Manufacturing露光 / パターニング / 配線 / 量産 ISSM Organizing Committee / SEMI | 会期終了 2024-12-10 594日前 2024-12-09〜10 / Tokyo Bay Ariake Washington Hotel, Tokyo, Japan Tokyo Bay Ariake Washington Hotel / Tokyo, Japan | abstract / short paper selection + presentation 学術トップ会議というより、半導体製造・Fab運用・量産改善を実務側から追う主要会議。 | | semiconductor manufacturing、Fab operations、yield improvement、process control、量産技術を製造実務側から確認する。 監視テーマ: fab operations, manufacturing, yield, process control, equipment, production technology |
| High Pressure Forum 高圧討論会 / High Pressure Forumロジック / デバイス / プロセス統合 日本高圧力学会 / The Japan Society of High Pressure Science and Technology | 会期終了 2024-11-15 619日前 2024-11-13 to 2024-11-15 / Iwate Prefectural Information Exchange Center Aiina, Morioka, Iwate, Japan Iwate Prefectural Information Exchange Center Aiina / Morioka, Japan | Official 65th High Pressure Forum presentation and abstract pages identify presentation application, abstract manuscript submission, oral/poster formats, public program PDFs, and an abstract-review statement. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 65th High Pressure Forum sources identify the November 13-15, 2024 Morioka cycle, September 2, 2024 extended presentation-application deadline, October 7, 2024 abstract manuscript deadline, visible committee role rows, public program first-listed affiliation rows, and current sponsor/ad/academic logo rows. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | High-pressure science and technology spanning DAC/high-pressure apparatus, solid-state physics, high-pressure synthesis and phase transitions, materials science, fluids, biological and food high-pressure science, geoscience, shock compression, neutron/synchrotron measurement, and instrumentation suppliers relevant to semiconductor-adjacent materials and characterization workflows. 監視テーマ: 高圧討論会, High Pressure Forum, diamond anvil cell, DAC, high-pressure apparatus, synchrotron high-pressure analysis, neutron high-pressure science, high-pressure materials synthesis, superconducting hydrides, oxides, semiconducting materials, JASRI, NIMS, KEK, JAEA, Tungaloy, KEYENCE, PULSTEC, Leica, Nihon Hydro-Pac, Syn Corporation, and official first-listed program affiliation rows |
| PVSEC International Photovoltaic Science and Engineering Conferenceパワー半導体 / Wide-Bandgap PVSEC-35 Organizing Committee / The Japan Photovoltaic Society (J-PVS) | 最終原稿締切 2025-01-17 556日前 2024-11-10〜15 / Plaza Verde, Numazu, Japan Plaza Verde / Numazu, Japan | Official PVSEC-35 pages list abstract submission, late-news abstract submission, acceptance notice, public Confit program, and paper submission after the conference. 公式PVSEC-35 pages list abstract submission extended to 2024-06-19, late-news abstract deadline 2024-07-31, abstract acceptance notice 2024-08-29, and paper submission extended to 2025-01-17. | | photovoltaic systems、wafer-based silicon PV、thin-film PV、perovskite and emerging PV、PV module reliability、grid integration、AI in PV developmentを横断して確認できる。 監視テーマ: silicon photovoltaics, perovskite tandem solar cells, thin-film photovoltaics, PV modules, grid integration, hydrogen and Solar-to-X, AI in PV development |
| ISSS International Symposium on Surface Scienceロジック / デバイス / プロセス統合 The Japan Society of Vacuum and Surface Science (JVSS) | 最終原稿締切 2025-01-31 542日前 2024-10-20〜24 / Kitakyushu International Conference Center, Kitakyushu, Japan Kitakyushu International Conference Center / Kitakyushu, Japan | One-page PDF abstract submission via Confit; oral/poster acceptance notice; presented papers may be submitted to e-JSSNT and undergo journal peer review 公式abstract pageはConfitでの1-page PDF abstract提出を案内し、important dates pageはoral/poster abstract deadline、acceptance notice、manuscript deadlineを示す。publication pageはpresented papersのe-JSSNT投稿とpeer reviewを案内する。 | | surface structures and characterization、surface/interface physics、nanotechnology and nanomaterials、surface chemistry、environmental and energy applications、soft/bio material interfaces、vacuum technology and surface engineeringを確認できる。 監視テーマ: surface science, vacuum technology, surface/interface characterization, nanomaterials, 2D materials, carbon neutral, AI and informatics, technical exhibition |
| PRiME Pacific Rim Meeting on Electrochemical and Solid-State Science / PRiME 2024ロジック / デバイス / プロセス統合 The Electrochemical Society (ECS) / The Electrochemical Society of Japan (ECSJ) / The Korean Electrochemical Society (KECS) | 会期終了 2024-10-11 654日前 2024-10-06 to 2024-10-11 / Hawaii Convention Center & Hilton Hawaiian Village, Honolulu, HI, United States Hawaii Convention Center & Hilton Hawaiian Village / Honolulu, United States | Official PRiME 2024 Confex call identifies abstract submission to named symposia and organizer review/scheduling into the technical program. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official PRiME 2024 sources identify the October 6-11 Honolulu cycle, June 19 abstract deadline, complete Confex program rows, symposium organizers and session chairs, meeting and symposia sponsors, and exhibitors. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Electrochemistry, solid-state science, batteries, fuel cells, electrolysis, electronic materials, atomic layer deposition and etching, SiGe and related devices, sensors, corrosion, and photonic/electronic devices. 監視テーマ: PRiME, ECS, ECSJ, KECS, electrochemistry, solid-state science, batteries, fuel cells, atomic layer deposition, etching, SiGe, electronic materials, sensors, photonic devices, Applied Materials, Tokyo Electron, GlobalFoundries, Panasonic Energy |
| Colloid 75 コロイドおよび界面化学討論会 / Colloid and Interface Chemistry Discussion Meetingロジック / デバイス / プロセス統合 公益社団法人 日本化学会 コロイドおよび界面化学部会 | 会期終了 2024-09-20 675日前 2024-09-17 to 2024-09-20 / Tohoku University Kawauchi-kita Campus and Aoba-no-Kaze Terrace, Sendai, Japan Tohoku University Kawauchi-kita Campus / Aoba-no-Kaze Terrace / Sendai, Japan | Official Confit registration guidance identifies oral and poster presentation application, abstract manuscript upload deadlines, program publication, and public Confit search/program rows. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. Official 2024 Confit sources identify the September 17-20, 2024 Sendai cycle, oral abstract deadline extended to June 17, 2024, poster abstract deadline June 28, 2024, organizing and executive committee tables, public search/program rows, sponsor-company page, exhibitor pages, and host/co-host/support society listings. Reviewed graph data is hydrated from PostgreSQL researchVisualSignals. | | Colloid and interface chemistry, surfactants, emulsions, dispersions, nanoparticles, membranes, surface forces, soft matter, rheology, biointerfaces, cosmetics/materials chemistry, surface analysis, analytical instruments, and interface-control themes relevant to semiconductor wet process chemicals, slurry/dispersion control, coating, packaging, and materials characterization. 監視テーマ: コロイドおよび界面化学討論会, Colloid and Interface Chemistry Discussion Meeting, surfactants, colloids, dispersions, interface analysis, rheology, membranes, slurry, coating, wet processing, Kao, Lion, Anton Paar Japan, Otsuka Electronics, Kyowa Interface Science, Sanyo Trading, TA Instruments Japan, HORIBA, LUM Japan, Photonic Lattice, NIMS, AIST, Tohoku University, Tokyo University of Science, and official Confit first-listed affiliation rows |
| IWPSD International Workshop on Physics of Semiconductor Devicesロジック / デバイス / プロセス統合 Indian Institute of Technology Madras / Society for Semiconductor Devices / Semiconductor Society (India) | 会期終了 2023-12-17 953日前 2023-12-13 to 2023-12-17 / Research Park, IIT Madras, Chennai, India Research Park, IIT Madras / Chennai, India | Official IWPSD 2023 home states that abstract submission closed on August 15, 2023 and abstract status notification was September 15, 2023. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official IWPSD 2023 pages identify the December 13-17, 2023 IIT Madras cycle, August 15 abstract-submission closure, September 15 abstract status notification, organizing/advisory/technical committee rows, public keynote/plenary/distinguished speaker rows, sponsor logo/link listings, organizer rows, and the biennial series started in 1981. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Semiconductor materials and devices, 2D materials, crystal growth and epitaxy, device modelling and simulation, quantum devices, oxide and compound semiconductors, memory and logic devices, MEMS/NEMS/sensors, organic and flexible electronics, photovoltaics, power semiconductor devices, and optoelectronics. 監視テーマ: IWPSD India semiconductor devices workshop, IIT Madras, SSD India, 2D materials, compound semiconductors, power devices, photonics, sensors, OLED speaker signals, sponsor logo listings |
| PLASMA2017 Plasma Conference / PLASMA2017ロジック / デバイス / プロセス統合 Japan Society of Applied Physics Division of Plasma Electronics / Japan Society of Plasma Science and Nuclear Fusion Research / Physical Society of Japan Division 2 / JSPS 153rd Committee on Plasma Materials Science | 会期終了 2017-11-24 3167日前 2017-11-20 to 2017-11-24 / Himeji Chamber of Commerce and Industry, Himeji, Hyogo, Japan Himeji Chamber of Commerce and Industry / Himeji, Hyogo, Japan | Official PLASMA2017 guidance identifies oral and poster presentation formats, an August 4, 2017 presentation-application deadline, early-September accept/reject notification by e-mail, and a two-page English proceedings manuscript. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. Official PLASMA2017 sources identify the November 20-24, 2017 Himeji cycle, chair/host/supporting society evidence, oral/invited and poster program PDFs, official exhibition listing rows, and the official 2011/2014/2017 series history. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Plasma science and engineering, plasma processing, fusion plasma, discharge physics, materials processing, thin-film and surface modification, plasma diagnostics, high-density plasma, atmospheric-pressure plasma, space plasma, and nanomaterial/device-related plasma applications. 監視テーマ: PLASMA2017, plasma processing, semiconductor device plasma process sessions, oral/poster affiliation mix, Toshiba/Hitachi/Mitsubishi/ULVAC/QST exhibitor and support listings, Japanese plasma society host signals |
| ICNME International Conference on Nano-Molecular Electronicsロジック / デバイス / プロセス統合 ICNME 2010 Organizing Committee / National Institute of Information and Communications Technology | 会期終了 2010-12-16 5702日前 2010-12-14 to 2010-12-16 / International Conference Center Kobe, Japan International Conference Center Kobe / Kobe, Japan | Official ICNME 2010 abstract page says abstracts were submitted through the UMIN web system, all contributed abstracts were accepted, and the Program Committee selected oral presentations from a scientific point of view. Official ICNME 2010 pages identify the December 14-16, 2010 Kobe conference, November 5 extended abstract deadline, all-contributed-abstract acceptance note, official committee rows, program PDF presentation rows, and sponsor/support/cooperation listings. Reviewed source signals are hydrated from PostgreSQL researchVisualSignals. | | Nano-molecular electronics, molecular photonics, nano-interface fabrication, bioelectronics, organic devices, organic photovoltaics, liquid crystal and interface phenomena, and molecular device materials. 監視テーマ: nano-molecular electronics, organic devices, molecular photonics, organic photovoltaics, bioelectronics, liquid crystal interfaces, AIST/NICT nanoelectronics ecosystem, Kobe ICNME archive |
| ISQED International Symposium on Quality Electronic Design回路 / システム / 設計自動化 International Society for Quality Electronic Design | 論文締切 2026-09-17 52日後 ISQED'27 CFP公開 / 会期日程は公式掲載待ち 公式掲載待ち / 会期日程は公式掲載待ち, TBD | double-blind 4-8 page manuscript + camera-ready + presentation video ISQED'27 CFP: paper submission deadline is 2026-09-17; acceptance notification is 2027-01-22; camera-ready paper is due 2027-02-17. Exact 2027 conference dates are not posted on the official page as of 2026-07-01. | | design for manufacturability、EDA、advanced packaging、hardware security、device modeling までまたぐ品質設計会議。 監視テーマ: design for manufacturability, EDA, advanced packaging, device modeling, hardware security, agentic AI |
該当する conference はありません。検索語を短くするか、Tier / 分野 / 進行状況フィルタを解除してください。
このDBで確認する項目
Section titled “このDBで確認する項目”分野で対象 layer を絞る関連日付距離で 30日内、31〜90日、90日超、通過済み、未取得を分ける進行状況で、投稿中、査読待ち、program 監視、CFP公開待ち、会期終了を分ける募集要項列から CFP と official site を開き、scope と原稿形式を確認する確認ポイントで、工程ページや装置ページへ接続する論点を決める
現在の schema
Section titled “現在の schema”この v0.1 では、学会 1 件を 1 レコードとして持ち、currentCycleStart / currentCycleEnd、deadlineEvents[]、paperDeadline、lateNewsDeadline、finalPaperDeadline、acceptanceNotice から関連日付カードを生成します。将来は conference master、yearly edition、deadline events、session archive、article trend signals に分けていく前提です。
| 項目 | 持つ理由 |
|---|---|
id / code | 年次アーカイブや JSON export で結合しやすくするための固定識別子です。 |
fieldId | circuit、device、patterning、packaging、power、memory / reliability を横断比較する軸です。 |
genreIds | 研究室DBで実発表実績が確認できた学会タグを、FEOL、BEOL、3DI、回路、WBG、フォトニクス、信頼性のジャンルへ絞り込むための正式分類です。 |
tier | 研究室DBで実発表実績タグを並べるときに使う概算tierです。発表採択数や研究力の断定ではありません。 |
peerReviewStatus | 査読または投稿審査が確認できる学会を優先し、確認中のものと分けるための正式ステータスです。 |
organizer | IEEE、SEMI、SPIE、JSAP、ITRI のような主催の違いで会議の温度感が変わるためです。 |
currentCycleStart / currentCycleEnd | 次に確認するサイクルが開催前か、会期中か、会期後かを機械的に判定できます。 |
venue / city / country | 開催地の偏りから、米国主導、日本主導、欧州主導、台湾主導のテーマ差を比較できます。 |
officialUrl | 会議トップから schedule、registration、news を確認できます。 |
cfpUrl | 募集要項を直接開き、締切、対象分野、原稿形式を確認できます。 |
programUrl / proceedingsUrl | 会期前後で確認するページが変わるため、program と proceedings の導線を分けて保持します。 |
submissionFormat | abstract、digest、full paper、late news の違いを持つことで、原稿準備の重さを比較できます。 |
abstractDeadline | abstract submission の締切を持ち、関連日付カードと短期確認対象に含めます。 |
paperDeadline / lateNewsDeadline / finalPaperDeadline / acceptanceNotice | full paper、late news、final paper、採択通知を原稿準備や program 監視の関連日付として保持します。 |
deadlineEvents[] | abstract、paper、digest、late news、final paper、採択通知などを日付イベントとして切り出し、締切カレンダーへ転用できます。 |
nextDeadline | 各学会で次に来る主要な関連日付を取り出し、短期の確認対象を並べ替えられます。 |
trackingPhase | CFP公開待ち、投稿受付中、査読中、program監視、会期終了など、次の確認対象を表示できます。 |
watchItems | 同じ conference でも確認対象が散るため、注目テーマをレコードごとに固定します。 |
historyNote | 将来の歴代アーカイブ化に備え、年次比較に使う軸を残します。 |
募集要項で確認する項目
Section titled “募集要項で確認する項目”scopeに process、packaging、memory、reliability のどこまで入るかsubmission formatが abstract、digest、full paper、late news のどれかauthor timelineに acceptance、final paper、registration が分かれているかprogram / proceedingsが公式サイトにいつ載るかno-showやin-person requiredの条件があるか
学会記事面から技術語を抽出する
Section titled “学会記事面から技術語を抽出する”締切DBの次段階では、CFP、program、proceedings、plenary / tutorial の題名語を sessionTitleKeywords として残します。
公開レビュー記事、公式サマリー、公開ニュースも publicReviewSourceIds として残し、学会別の短い結果要約と年次の注目テーマ候補へ結合します。抽出した語は 学会記事トレンドウォッチ で、GAA、High-NA EUV、BEOL、hybrid bonding、SiC / GaN、memory / reliability の技術テーマへ照合します。